FUNCTIONAL FILM MANUFACTURING METHOD AND FUNCTIONAL FILM
    21.
    发明公开
    FUNCTIONAL FILM MANUFACTURING METHOD AND FUNCTIONAL FILM 审中-公开
    HERSTELLUNGSVERFAHRENFÜREINE FUNKTIONSFOLIE UND FUNKTIONSFOLIE

    公开(公告)号:EP2752251A1

    公开(公告)日:2014-07-09

    申请号:EP12828475.9

    申请日:2012-08-16

    发明人: IWASE, Eijiro

    摘要: The present invention relates to a high-performance functional film, such as a gas barrier film with a high gas barrier performance, which uses an inexpensive support and is manufactured at a low cost and a high productivity. According to the functional film of the present invention which is formed by laminating a coating-based organic layer and an inorganic layer based on a vapor phase deposition method, a glass transition temperature of the organic layer is at least 100°C, and a thickness thereof is between 0.05 µm and 3 µm. The organic layer is coated with at least 5 cc/m 2 of a coating material, and formed for a viscosity in a falling-rate drying state to be at least 20 cP and for a surface tension to be 34 dyn/cm or less. The inorganic layer is formed at a surface of the organic layer by a vapor phase film formation method for plasma generation.

    摘要翻译: 本发明涉及一种高性能功能膜,例如阻气性高的阻气膜,其使用廉价的载体并以低成本和高生产率制造。 根据通过基于气相沉积法层压基于涂料的有机层和无机层形成的本发明的功能膜,有机层的玻璃化转变温度为至少100℃,厚度 在0.05μm和3μm之间。 有机层涂覆有至少5cc / m 2的涂料,并以下降干燥状态的粘度形成为至少20cP,表面张力为34dyn / cm以下。 通过用于等离子体产生的气相成膜方法在有机层的表面上形成无机层。

    SILICON NITRIDE FILM OF SEMICONDUCTOR ELEMENT, AND METHOD AND APPARATUS FOR PRODUCING SILICON NITRIDE FILM
    26.
    发明公开
    SILICON NITRIDE FILM OF SEMICONDUCTOR ELEMENT, AND METHOD AND APPARATUS FOR PRODUCING SILICON NITRIDE FILM 审中-公开
    氮化硅用于生产的氮化硅膜的半导体元件和方法及装置

    公开(公告)号:EP2579300A4

    公开(公告)日:2013-12-18

    申请号:EP11786529

    申请日:2011-05-18

    发明人: NISHIKAWA SEIJI

    摘要: Disclosed are: a silicon nitride film of a semiconductor element, which is formed by applying a bias power and appropriately controls hydrogen leaving from the silicon nitride film; and a method and apparatus for producing a silicon nitride film. Specifically disclosed is a silicon nitride film which is formed on a substrate (19) by plasma processing and used in a semiconductor element. If the silicon nitride film is in contact with a film (41) to which supply of hydrogen is required to be shut off, the silicon nitride film is configured of a biased SiN (31) that is formed by applying a bias to the substrate (19) and an unbiased SiN (32) that is formed without applying a bias to the substrate (19) and the unbiased SiN (32) is arranged on the side on which the silicon nitride film is in contact with the film (41).