公开(公告)号：EP2397507B1

公开(公告)日：2017-09-20

申请号：EP10741224.9

申请日：2010-02-09

申请人： Nissan Chemical Industries, Ltd.

发明人： TAKEYAMA, Toshiaki ,  MORO, Takeo

IPC分类号： C08G59/20

CPC分类号： C08G59/3236 ,  C08L63/06

公开(公告)号：EP2669332B1

公开(公告)日：2017-05-17

申请号：EP13170121.1

申请日：2013-05-31

申请人： LG Innotek Co., Ltd.

发明人： Moon, Sung Bae ,  Jeong, Jae Hun ,  Yoon, Sang In

IPC分类号： C08L63/00 ,  C08L63/06 ,  C08G59/32 ,  C08G59/26 ,  H01L51/50 ,  H01L33/00

CPC分类号： H01L33/58 ,  C08G59/3218 ,  C08G59/3245 ,  C08G59/4215 ,  C08L63/06 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

公开(公告)号：EP2910587A4

公开(公告)日：2016-06-22

申请号：EP13847148

申请日：2013-10-18

申请人： MITSUBISHI GAS CHEMICAL CO

发明人： CHIBA TOMO ,  TAKAHASHI HIROSHI ,  SHIGA EISUKE ,  OGASHIWA TAKAAKI

IPC分类号： C08G59/20 ,  B32B15/08 ,  C08J5/24 ,  C08K3/00 ,  C08L63/00 ,  H05K1/03

CPC分类号： C08L73/00 ,  B32B5/26 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/24 ,  C08G59/4246 ,  C08G59/621 ,  C08G77/18 ,  C08G77/52 ,  C08J5/24 ,  C08J2363/00 ,  C08J2373/00 ,  C08J2383/06 ,  C08J2463/00 ,  C08J2473/00 ,  C08K3/34 ,  C08K3/36 ,  C08L63/00 ,  C08L63/06 ,  C08L83/06 ,  C08L83/14 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/025 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0275 ,  H05K2201/029

摘要： An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).

公开(公告)号：EP2272485A3

公开(公告)日：2014-07-16

申请号：EP10181016.6

申请日：2002-08-15

申请人： 3M Innovative Properties Co.

发明人： Karim, Naimul ,  Jones, Todd, D. ,  Lewandowski, Kevin, M. ,  Fansler, Duane, D. ,  Nelson, James, M. ,  Gaddam, Babu, N.

IPC分类号： A61K6/08 ,  A61K6/083 ,  A61K6/10

CPC分类号： A61K6/083 ,  A61K6/0073 ,  A61K6/087 ,  A61K6/10 ,  C08L33/00 ,  C08L63/06 ,  C08L23/00

摘要： The present invention relates to a preformed dental product comprising a hardenable composition, wherein the hardenable composition comprises a resin system, a filler system, and an initiator system;
wherein the hardenable composition is in the form of a hardenable, self-supporting structure having a first shape and sufficient malleability to be reformed into a second shape at a temperature of about 15°C to 38°C.

公开(公告)号：EP1867680A4

公开(公告)日：2013-10-30

申请号：EP06730094

申请日：2006-03-27

申请人： TORAY INDUSTRIES

发明人： MOCHIDUKI KATSUHIKO ,  MIHARA TAKAAKI

IPC分类号： C08L67/04 ,  C08G63/91 ,  C08L101/16 ,  D01F6/62 ,  D01F6/92

CPC分类号： C08G63/912 ,  C08G63/914 ,  C08L63/06 ,  C08L67/02 ,  D01F6/62 ,  D01F6/92 ,  Y10T428/29 ,  Y10T428/2924 ,  Y10T428/298 ,  C08L2666/22

公开(公告)号：EP2141201A1

公开(公告)日：2010-01-06

申请号：EP09008627.3

申请日：2009-07-01

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Yusuke, Taguchi ,  Toshio, Shiobara

IPC分类号： C08L63/06 ,  C08L63/00 ,  C08L83/04 ,  C08K3/00 ,  H01L23/29

CPC分类号： H01L23/49861 ,  C08G77/16 ,  C08G77/18 ,  C08L63/00 ,  C08L63/06 ,  C08L83/04 ,  C08L83/06 ,  H01L23/295 ,  H01L23/296 ,  H01L33/56 ,  H01L2924/0002 ,  C08L83/00 ,  C08L2666/14 ,  C08L2666/22 ,  H01L2924/00

摘要： A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.

摘要翻译： 作为用于高亮度LED或太阳能电池的预先包装的理想的可热固化的有机硅树脂 - 环氧树脂组合物。 该组合物含有（A）可热固化的有机硅树脂，（B）三嗪衍生物环氧树脂和酸酐的组合，或通过它们反应获得的预聚物，（C）无机填料和（D） 固化促进剂。 该组合物显示出优异的固化性，并且产生均匀的固化产物，其在长时间内显示出优异的耐热性和耐光性保持性，并且几乎不发黄。

公开(公告)号：EP2100908A1

公开(公告)日：2009-09-16

申请号：EP07831799.7

申请日：2007-11-14

申请人： Hitachi Chemical Company, Ltd.

发明人： KOTANI, Hayato ,  URASAKI, Naoyuki ,  YUASA, Kanako ,  NAGAI, Akira ,  HAMADA, Mitsuyoshi

IPC分类号： C08G59/32 ,  B29B7/80 ,  B29C45/02 ,  B29C45/14 ,  H01L23/29 ,  H01L23/31 ,  H01L33/00

CPC分类号： H01L33/60 ,  B29C45/0001 ,  B29C45/02 ,  B29L2011/00 ,  C08G59/4014 ,  C08G59/4215 ,  C08K3/013 ,  C08K3/2279 ,  C08K7/24 ,  C08K7/28 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/2244 ,  C08L63/00 ,  C08L63/06 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： This invention provides a thermosetting resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature of 100°C to 200°C, molding pressure of not more than 20MPa, and molding time of 60 to 120 sec is not more than 5mmabd the light reflectance after heat curing at a wavelength of 350 nm to 800nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.

公开(公告)号：EP1698665B1

公开(公告)日：2008-06-04

申请号：EP06008910.9

申请日：2001-12-20

申请人： Meredian, Inc.

发明人： Autran, Jean-Philippe, Marie ,  Melik, David, Harry ,  Satkowski, Michael, Matthew

IPC分类号： C08L67/04

CPC分类号： C08G63/88 ,  C08L63/06 ,  C08L67/04 ,  C08L2666/18

公开(公告)号：EP1698665A1

公开(公告)日：2006-09-06

申请号：EP06008910.9

申请日：2001-12-20

申请人： The Procter and Gamble Company

发明人： Autran, Jean-Philippe, Marie ,  Melik, David, Harry ,  Satkowski, Michael, Matthew

IPC分类号： C08L67/04

CPC分类号： C08G63/88 ,  C08L63/06 ,  C08L67/04 ,  C08L2666/18

摘要： The present invention relates to a method for making a PHA polymer blend, and to the blend thus obtained.

摘要翻译： 本发明涉及一种制备PHA聚合物共混物的方法，以及由此获得的共混物。

公开(公告)号：EP1651734A1

公开(公告)日：2006-05-03

申请号：EP04777650.5

申请日：2004-07-07

申请人： DOW CORNING CORPORATION

发明人： GORDON, Glenn ,  HORSTMAN, John, Bernard ,  LILES, Donald ,  SCHMIDT, Randall ,  WIEBER, Gary ,  WITUCKI, Gerald, Lawrence

IPC分类号： C09D183/08 ,  C08L63/00

CPC分类号： C09D163/00 ,  C08G77/26 ,  C08K5/17 ,  C08L63/00 ,  C08L63/06 ,  C08L83/08 ,  C09D183/08 ,  C08L2666/14 ,  C08L83/00

摘要： This invention relates to a coating composition comprising (A) 100 weight parts of at least one epoxy resin; (B) 3-300 weight parts of at least one aminofunctional silicone resin; (C) up to 50 weight parts of at least one organic hardener; (D) up to 100 weight parts of at least one epoxyfunctional silicone resin; and (E) up to 10 weight parts of at least one cure accelerator. The coating compositions of this invention have acceptable moduli (>100MPa ), are tough, flexible, solvent and water resistant over a broad temperature range.