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    Systems and methods for a three-layer chip-scale MEMS device
    41.
    发明公开
    Systems and methods for a three-layer chip-scale MEMS device 有权
    Chipgröße的System-und Verfahrenfürdreilagige MEMS-Vorrichtung

    公开(公告)号：EP2455331A2

    公开(公告)日：2012-05-23

    申请号：EP11190203.7

    申请日：2011-11-22

    Applicant: Honeywell International, Inc.

    Inventor： Horning, Robert D. ,  Supino, Ryan

    IPC: B81B7/02 ,  B81B7/00

    CPC classification number: H01L29/84 ,  B81B7/0032 ,  B81B7/0038 ,  B81B7/0074 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81C2201/019 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.

    Abstract translation: 提供了用于微机电系统（MEMS）装置的系统和方法。 在一个实施例中，系统包括第一外层和包括第一组MEMS器件的第一器件层，其中第一器件层结合到第一外层。 该系统还包括第二外层和包括第二组MEMS器件的第二器件层，其中第二器件层结合到第二外层。 此外，该系统包括具有第一侧和与第一侧相反的第二侧的中心层，其中第一侧接合到第一器件层，第二侧接合到第二器件层。

    DYNAMIC QUANTITY SENSOR AND METHOD OF MANUFACTURING IT
    44.
    发明公开
    DYNAMIC QUANTITY SENSOR AND METHOD OF MANUFACTURING IT 审中-公开
    力学量传感器及其制造方法

    公开(公告)号：EP2090866A4

    公开(公告)日：2011-08-31

    申请号：EP07831892

    申请日：2007-11-15

    Applicant: DAINIPPON PRINTING CO LTD

    Inventor： TAKESHITA KIYOKAZU ,  AIDA KAZUHIKO

    IPC: B81B3/00 ,  B81C1/00 ,  G01C19/56 ,  G01P15/18

    CPC classification number: G01P15/18 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00714 ,  G01C19/56 ,  G01P15/0802 ,  G01P15/097 ,  G01P15/125 ,  Y10T29/49002

    Abstract: Amechanical quantity sensor includes a first structure having a fixed portion with an opening, a displaceable portion arranged in the opening and displaceable relative to the fixed portion, and a connection portion connecting the fixed portion and the displaceable portion, a second structure having a weight portion joined to the displaceable portion and a pedestal arranged surrounding the weight portion and joined to the fixed portion, the second structure being arranged and stacked on the first structure, a first base connected to the fixed portion and arranged and stacked on the first structure, and a second base connected to the pedestal and arranged and stacked on the second structure. The weight portion is adjusted in thickness after the first structure is made and before the second base and the second structure are joined.

    Vertical sensor assembly method
    46.
    发明公开
    Vertical sensor assembly method 有权
    Montageverfahrenfürvertikale Sensoren

    公开(公告)号：EP2275383A2

    公开(公告)日：2011-01-19

    申请号：EP10168299.5

    申请日：2010-07-02

    Applicant: Honeywell International Inc.

    Inventor： Wan, Hong ,  Rieger, Ryan W. ,  Bohlinger, Michael J.

    IPC: B81B3/00

    CPC classification number: B81B3/0054 ,  B81B2201/0235 ,  B81C2203/035 ,  H01L2224/16225

    Abstract: A method to vertically bond a chip to a substrate is provided. The method includes forming a metal bar having a linear aspect on the substrate, forming a solder paste layer over the metal bar to form a solder bar, forming a plurality of metal pads on the substrate, and forming a solder paste layer over the plurality of metal pads to form a plurality of solder pads on the substrate. Each of the plurality of solder pads is offset from a long edge the solder bar by an offset-spacing. The chip to be vertically bonded to the substrate has a vertical-chip thickness fractionally less than the offset-spacing. The chip to be vertically bonded fits between the plurality of solder pads and the solder bar. The solder bar enables alignment of the chip to be vertically bonded.

    Abstract translation: 提供了将芯片垂直粘合到基板的方法。 该方法包括在衬底上形成具有线性方面的金属棒，在金属棒上形成焊膏层以形成焊料条，在衬底上形成多个金属焊盘，并在多个焊盘上形成焊膏层 金属焊盘，以在衬底上形成多个焊盘。 多个焊盘中的每一个从焊料条的长边偏移偏移间隔。 要垂直粘合到基底的芯片具有小于偏移间距的垂直芯片厚度。 要垂直粘合的芯片装配在多个焊盘和焊条之间。 焊条可使芯片对准垂直粘合。

    Inertial sensor
    50.
    发明公开
    Inertial sensor 有权
    Trägheitssensor

    公开(公告)号：EP2081030A2

    公开(公告)日：2009-07-22

    申请号：EP08022419.9

    申请日：2008-12-23

    Applicant: Hitachi Ltd.

    Inventor： Yamanaka, Kiyoko ,  Takano, Hideaki

    IPC: G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01C19/56

    CPC classification number: G01P15/0802 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01C19/5719 ,  G01P1/02 ,  G01P15/125

    Abstract: An angular rate sensor and an acceleration sensor are sealed at the same sealing pressure. The sealing pressure at this time is put into a reduced pressure state below the atmospheric pressure in view of improving a detection sensitivity of the angular rate sensor. Even in the reduced pressure atmosphere, to improve the detection sensitivity of the acceleration sensor, a shift suppressing portion (damper) for suppressing shifts of a movable body of the acceleration sensor is provided. This shift suppressing portion includes a plurality of protruding portions integrally formed with the movable body and a plurality of protruding portions integrally formed with a peripheral portion, and the protruding portions are alternately disposed separately at equal intervals.

    Abstract translation: 在相同的密封压力下密封角速率传感器和加速度传感器。 考虑到提高角速度传感器的检测灵敏度，此时的密封压力被置于低于大气压的减压状态。 即使在减压气氛中，为了提高加速度传感器的检测灵敏度，提供了用于抑制加速度传感器的移动体的移动的偏移抑制部（阻尼器）。 该偏移抑制部包括与可动体一体形成的多个突出部和与周缘部一体形成的多个突出部，突出部以相等的间隔交替地配置。

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