INERTIAL SENSOR
    42.
    发明公开
    INERTIAL SENSOR 审中-公开
    惯性传感器

    公开(公告)号:EP3315460A1

    公开(公告)日:2018-05-02

    申请号:EP17197965.1

    申请日:2017-10-24

    CPC classification number: B81B7/0048 B81B2201/0235 B81B2201/0242

    Abstract: A MEMS sensor comprising: a substrate; and a sensor element movably mounted to a first side of said substrate; wherein a second side of said substrate has a pattern formed in relief thereon. The pattern formed in relief on the second side of the substrate provides a reduced surface area for contact with the die bond layer. The reduced surface area reduces the amount of stress that is transmitted from the die bond layer to the substrate (and hence reduces the amount of transmitted stress reaching the MEMS sensor element). Because the substrate relief pattern provides a certain amount of stress decoupling, the die bond layer does not need to decouple the stress to the same extent as in previous designs. Therefore a thinner die bond layer can be used, which in turn allows the whole package to be slightly thinner.

    Abstract translation: 一种MEMS传感器,包括:衬底; 以及可移动地安装到所述衬底的第一侧的传感器元件; 其中所述衬底的第二面具有形成在其上的图案。 在衬底的第二侧上形成为浮雕的图案提供用于与管芯结合层接触的减小的表面积。 减小的表面积减少了从管芯结合层传递到基板的应力的量(并因此减少了到达MEMS传感器元件的传输应力的量)。 因为衬底浮雕图案提供一定量的应力解耦,所以芯片结合层不需要将应力解除耦合到与先前设计相同的程度。 因此可以使用更薄的芯片接合层,这又可以使整个封装略微更薄。

    STRAIN DECOUPLED SENSOR
    43.
    发明授权
    STRAIN DECOUPLED SENSOR 有权
    应变解耦传感器

    公开(公告)号:EP2800721B1

    公开(公告)日:2018-03-28

    申请号:EP13700783.7

    申请日:2013-01-04

    Abstract: A sensor comprises a substrate 16 and a sensor element 20 anchored to the substrate 16, the substrate 16 and sensor element 20 being of dissimilar materials and having different coefficients of thermal expansion, the sensor element 20 and substrate 16 each having a generally planar face arranged substantially parallel to one another, the sensor further comprising a spacer 26, the spacer 26 being located so as to space at least part of the sensor element 20 from at least part of the substrate 16, wherein the spacer 26 is of considerably smaller area than the area of the smaller of face of the substrate 16 and that of the sensor element 20.

    VIBRATION AND SHOCK ROBUST GYROSCOPE
    44.
    发明公开
    VIBRATION AND SHOCK ROBUST GYROSCOPE 审中-公开
    振动和冲击强化陀螺仪

    公开(公告)号:EP3270106A1

    公开(公告)日:2018-01-17

    申请号:EP17170728.4

    申请日:2017-05-11

    Applicant: NXP USA, Inc.

    Inventor: NAUMANN, Michael

    Abstract: A MEMS device includes a movable mass having a central region overlying a sense electrode and an opening in which a suspension structure and spring system are located. The suspension structure includes an anchor coupled to a substrate and rigid links extending from opposing sides of the anchor. The spring system includes a first and second spring heads coupled to each of the rigid links. A first drive spring is coupled to the first spring head and to the movable mass, and a second drive spring is coupled to the second spring head and to the movable mass. The movable mass is resiliently suspended above the surface of the substrate via the suspension structure and the spring system. The spring system enables drive motion of the movable mass in the drive direction and sense motion of the movable mass in a sense direction perpendicular to the surface of the substrate.

    Abstract translation: MEMS器件包括具有覆盖感测电极的中心区域和悬置结构和弹簧系统位于其中的开口的可移动块。 该悬架结构包括连接到基板的锚固件和从锚固件的相对侧延伸的刚性连接件。 弹簧系统包括连接到每个刚性连杆的第一和第二弹簧头。 第一驱动弹簧联接到第一弹簧头和可移动质量块,并且第二驱动弹簧联接到第二弹簧头和可移动质量块。 可移动块经由悬架结构和弹簧系统弹性地悬挂在衬底的表面上方。 弹簧系统使得可动质量块在驱动方向上能够进行驱动运动并且感测可动质量块在垂直于衬底表面的感测方向上的运动。

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