Abstract:
Method of manufacturing a transducer module (10), comprising the steps of: forming, on a substrate (1), a first MEMS transducer (20), in particular a gyroscope, and a second MEMS transducer (30), in particular an accelerometer, having a suspended membrane (4a); forming, on the substrate (1), a conductive layer (4) and defining the conductive layer (4) in order to provide, simultaneously, at least one conductive strip (4c; 4d) electrically coupled to the first MEMS transducer (20) and the membrane (4a) of the second MEMS transducer (30).
Abstract:
A MEMS sensor comprising: a substrate; and a sensor element movably mounted to a first side of said substrate; wherein a second side of said substrate has a pattern formed in relief thereon. The pattern formed in relief on the second side of the substrate provides a reduced surface area for contact with the die bond layer. The reduced surface area reduces the amount of stress that is transmitted from the die bond layer to the substrate (and hence reduces the amount of transmitted stress reaching the MEMS sensor element). Because the substrate relief pattern provides a certain amount of stress decoupling, the die bond layer does not need to decouple the stress to the same extent as in previous designs. Therefore a thinner die bond layer can be used, which in turn allows the whole package to be slightly thinner.
Abstract:
A sensor comprises a substrate 16 and a sensor element 20 anchored to the substrate 16, the substrate 16 and sensor element 20 being of dissimilar materials and having different coefficients of thermal expansion, the sensor element 20 and substrate 16 each having a generally planar face arranged substantially parallel to one another, the sensor further comprising a spacer 26, the spacer 26 being located so as to space at least part of the sensor element 20 from at least part of the substrate 16, wherein the spacer 26 is of considerably smaller area than the area of the smaller of face of the substrate 16 and that of the sensor element 20.
Abstract:
A MEMS device includes a movable mass having a central region overlying a sense electrode and an opening in which a suspension structure and spring system are located. The suspension structure includes an anchor coupled to a substrate and rigid links extending from opposing sides of the anchor. The spring system includes a first and second spring heads coupled to each of the rigid links. A first drive spring is coupled to the first spring head and to the movable mass, and a second drive spring is coupled to the second spring head and to the movable mass. The movable mass is resiliently suspended above the surface of the substrate via the suspension structure and the spring system. The spring system enables drive motion of the movable mass in the drive direction and sense motion of the movable mass in a sense direction perpendicular to the surface of the substrate.
Abstract:
An acceleration sensor of the invention has a sensor substrate with a frame and a package substrate bonded to the sensor substrate using a bonding portion. The frame has an opening, a movable portion held in the opening, and a portion outputs a positional displacement of the movable portion. The bonding portion has first and second laminate films. The first laminate film has a first insulating layer formed on a surface of the sensor substrate, a first intermediate layer portion formed on the insulating film, and a first metal layer formed on the intermediate layer portion over an entire circumference of the frame so as to surround the movable portion. The second laminate film has a second insulating layer formed on a surface of the packet substrate and a first frame-like metal layer portion formed on the second insulating layer so as to face the first metal layer of the sensor substrate. The first metal layer and first frame-like metal layer portion are made of gold.
Abstract:
Systems and methods are provided for calibrating and regulating the temperature of a sensor. One or more temperature adjusting devices can be provided to regulate the temperature of the sensor. One or more of the temperature adjusting devices can be provided to perform a calibration to determine a relationship between sensor bias and sensor temperature. The one or more temperature adjusting devices can be built into the sensor.
Abstract:
In one embodiment, a sensor includes a rigid wafer outer body, a first cavity located within the rigid wafer outer body, a first spring supported by the rigid wafer outer body and extending into the first cavity, a second spring supported by the rigid wafer outer body and extending into the first cavity, and a first sensor structure supported by the first spring and the second spring within the first cavity.