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    MONOLITHIC FABRICATION OF THERMALLY ISOLATED MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES
    3.
    发明授权
    MONOLITHIC FABRICATION OF THERMALLY ISOLATED MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES 有权
    热分离微电子机械系统（MEMS）器件的整体制造

    公开(公告)号：EP3095755B1

    公开(公告)日：2017-07-26

    申请号：EP16168459.2

    申请日：2016-05-04

    申请人： Honeywell International Inc.

    发明人： REINKE, John ,  LODDEN, Grant

    IPC分类号： B81B7/00 ,  B81C1/00

    CPC分类号： B81B7/0019 ,  B81B3/0081 ,  B81B7/0087 ,  B81B2201/0228 ,  B81B2201/025 ,  B81C1/0069 ,  H02N1/00

    摘要： A method for fabricating a thermally isolated microelectromechanical system (MEMS) structure is provided. The method includes processing a first wafer of a first material with a glass wafer to form a composite substrate including at least one sacrificial structure of the first material and glass; forming a MEMS device in a second material; forming at least one temperature sensing element on at least one of: the composite substrate; and the MEMS device; and etching away the at least one sacrificial structure of the first material in the composite substrate to form at least one thermally isolating glass flexure. The MEMS device is thermally isolated on a thermal isolation stage by the at least one thermally isolating glass flexure. The at least one temperature sensing element in on a respective at least one of: the thermal isolation stage; and the MEMS device.

    摘要翻译： 提供了一种用于制造热隔离微机电系统（MEMS）结构的方法。 该方法包括用玻璃晶片处理第一材料的第一晶片以形成包括第一材料和玻璃的至少一个牺牲结构的复合衬底; 以第二材料形成MEMS器件; 在至少一个复合衬底上形成至少一个温度传感元件; 和MEMS器件; 以及蚀刻掉复合衬底中的第一材料的至少一个牺牲结构以形成至少一个热隔离玻璃弯曲部。 MEMS器件通过至少一个热绝缘玻璃挠曲件在热绝缘台上热隔离。 所述至少一个温度感测元件位于热隔离级中的相应的至少一个上： 和MEMS器件。

    ENVIRONMENTAL SENSOR
    4.
    发明公开
    ENVIRONMENTAL SENSOR 审中-公开

    公开(公告)号：EP3376173A1

    公开(公告)日：2018-09-19

    申请号：EP18151213.8

    申请日：2018-01-11

    申请人： OMRON CORPORATION

    发明人： YAMAUCHI, Takanobu ,  UEDA, Naotsugu ,  NAKAMURA, Kayo ,  SAKAI, Ryusuke

    IPC分类号： G01D21/02

    CPC分类号： G01D21/02 ,  B81B7/0058 ,  B81B7/0087 ,  B81B2201/02 ,  B81C99/003 ,  G01L9/0019 ,  G01L9/125

    摘要： A technique for optimizing the operation of an environmental sensor in a fixed state in which the sensor is fixed at an installation location and in an unfixed state in which the sensor is away from the installation location increases the use mode variations of the environmental sensor and enhances convenience. The sensor including sensor elements to measure multiple physical quantities associated with a surrounding environment, and includes a state determination unit that determines whether the environmental sensor is in a first state in which the sensor is fixed at a predetermined installation location or in a second state in which the sensor is away from the installation location (S102, S104), and an operation switch unit that switches an operation of each sensor element that measures the physical quantities based on whether a state determined by the determination unit is the first state or the second state (S105, S106).

    DEVICE AND METHOD FOR SENSOR CALIBRATION
    6.
    发明公开
    DEVICE AND METHOD FOR SENSOR CALIBRATION 审中-公开
    传感器校准的装置和方法

    公开(公告)号：EP3233716A1

    公开(公告)日：2017-10-25

    申请号：EP15823293.4

    申请日：2015-12-19

    申请人： InvenSense, Inc.

    发明人： TESKEY, Wesley James Emmanouel ,  TEA, Nim Hak

    IPC分类号： B81B7/00 ,  B81C99/00

    CPC分类号： G01D18/008 ,  B81B7/0087 ,  B81C99/003

    摘要： A device and method for a MEMS device with at least one sensor is disclosed. A thermal element is disposed adjacent the MEMS device to selectively adjust a temperature of the MEMS device. A calibration operation is initiated for the sensor to determine a correction value to be applied to the sensor measurement based on the temperature. The correction value is stored.

    摘要翻译： 公开了一种用于具有至少一个传感器的MEMS装置的装置和方法。 热元件设置在MEMS装置附近以选择性地调节MEMS装置的温度。 开始对传感器进行校准操作，以基于温度确定将应用于传感器测量的校正值。 校正值被存储。

    Method and device for thermal insulation of micro-reactors
    7.
    发明公开
    Method and device for thermal insulation of micro-reactors 审中-公开
    微反应器绝热的方法和装置

    公开(公告)号：EP2902109A1

    公开(公告)日：2015-08-05

    申请号：EP15154853.4

    申请日：2011-09-23

    申请人： IMEC ,  Katholieke Universiteit Leuven ,  Panasonic Corporation

    发明人： Jones, Benjamin ,  Fiorini, Paolo ,  Tanaka, Hiroyuki

    IPC分类号： B01L7/00 ,  B01L3/00 ,  B81C1/00 ,  B81B3/00 ,  B81B7/00

    CPC分类号： B01L3/502707 ,  B01L3/502715 ,  B01L7/52 ,  B01L2200/147 ,  B01L2300/0816 ,  B01L2300/1805 ,  B01L2300/1883 ,  B81B3/0081 ,  B81B7/0087 ,  B81B2201/051

    摘要： A method for manufacturing a micro-fluidic device (104) comprises:
    - providing a semiconductor substrate (900) having a front side and a back side;
    - providing at least one micro-reactor (105) in said semiconductor substrate (900);
    - providing one or more micro-fluidic channels (101) in the front side of said semiconductor substrate (900), connected to said at least one micro-reactor (105);
    - sealing said micro-fluidic channels (101) by bonding of a cover layer (903) to the front side of the semiconductor substrate (900); and
    - thereafter, from the semiconductor backside, providing at least a partial etch for forming at least one through-substrate trench (100) surrounding said at least one micro-reactor (105) and the one or more micro-fluidic channels (101).

    摘要翻译： 一种用于制造微流体装置（104）的方法，包括：提供具有正面和背面的半导体衬底（900） - 在所述半导体衬底（900）中提供至少一个微反应器（105）; - 在所述半导体衬底（900）的正面中提供连接到所述至少一个微反应器（105）的一个或多个微流体通道（101）;以及 - - 通过将覆盖层（903）结合到所述半导体衬底（900）的所述前侧来密封所述微流体通道（101）; 然后从半导体背面提供用于形成围绕所述至少一个微反应器（105）和一个或多个微流体通道（101）的至少一个贯穿基板沟槽（100）的至少部分蚀刻， 。

    MEMS device with temperature compensation
    9.
    发明公开
    MEMS device with temperature compensation 审中-公开
    MEMS-Vorrichtung mit Temperaturausgleich

    公开(公告)号：EP2093184A2

    公开(公告)日：2009-08-26

    申请号：EP09152338.1

    申请日：2009-02-07

    申请人： Honeywell International Inc.

    发明人： Ridley, Jeff A. ,  Higashi, Robert ,  Detry, James F.

    IPC分类号： B81B7/00

    CPC分类号： B81B7/0087 ,  B81B2201/0242 ,  B81B2201/0278

    摘要： A MEMS device includes a P-N device formed on a silicon pin, which is connected to a silicon sub-assembly, and where the P-N device is formed on a silicon substrate that is used to make the silicon pin before it is embedded into a first glass wafer. In one embodiment, forming the P-N device includes selectively diffusing an impurity into the silicon pin and configuring the P-N device to operate as a temperature sensor.

    摘要翻译： MEMS器件包括形成在硅引脚上的PN器件，其连接到硅子组件，并且其中PN器件形成在硅衬底上，所述硅衬底在其被嵌入第一玻璃中之前用于制造硅销 晶圆。 在一个实施例中，形成P-N器件包括选择性地将杂质扩散到硅引脚中并将P-N器件配置为用作温度传感器。

    Passive thermal isolation structure
    10.
    发明公开
    Passive thermal isolation structure 审中-公开
    被动式隔热结构

    公开(公告)号：EP1829819A3

    公开(公告)日：2009-06-24

    申请号：EP06125198.9

    申请日：2006-12-01

    申请人： Honeywell International Inc.

    发明人： Younger, Dan W. ,  Lust, Lisa M

    IPC分类号： B81B7/00

    CPC分类号： B81B7/0087 ,  B81B2201/032 ,  F28F13/00 ,  F28F2270/00 ,  G05D23/024

    摘要： A thermal isolation structure for use in passively regulating the temperature of a microdevice is disclosed. The thermal isolation structure can include a substrate wafer and a cap wafer defining an interior cavity, and a number of double-ended or single-ended thermal bimorphs coupled to the substrate wafer and thermally actustable between an initial position and a deformed position. The thermal bimorphs can be configured to deform and make contact with the cap wafer at different temperatures, creating various thermal shorts depending on the temperature of the substrate wafer. When attached to a microdevice such as a MEMS device, the thermal isolation structure can be configured to maintain the attached device at a constant temperature or within a particular temperature range.