公开(公告)号：EP2460393A1

公开(公告)日：2012-06-06

申请号：EP10803777.1

申请日：2010-07-28

Applicant: ATI Technologies ULC

Inventor： LEUNG, Andrew ,  TOPACIO, Roden ,  MARTINEZ, Liane ,  LOW, Yip Seng

IPC: H05K3/00 ,  H01L23/12 ,  H01L23/488 ,  H05K1/02 ,  H05K3/10

CPC classification number: H01L23/49822 ,  B32B37/02 ,  B32B2309/105 ,  B32B2310/0843 ,  B32B2457/00 ,  H01L21/4857 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09136 ,  Y10T29/49117 ,  Y10T156/10 ,  H01L2224/05599

Abstract: A method of manufacturing a substrate for use in electronic packaging having a core, m buildup layers on a first surface of the core and n buildup layers on a second surface of the core, where m ≠ n is disclosed. The method includes forming (m-n) of the m buildup layers on the first surface, and then forming n pairs of buildup layers, with each one of the pairs including one of the n buildup layers formed on the second surface and one of the remaining n of the m buildup layers formed on the first surface. Each buildup layer includes a dielectric layer and a conductive layer formed thereon. The disclosed method protects the dielectric layer in each of buildup layers from becoming overdesmeared during substrate manufacturing by avoiding repeated desmearing of dielectric materials.

Abstract translation: 制造中使用的基板在电子封装具有在所述芯的第二表面，其中m≠N在芯和n堆积层的第一表面上的芯，m层积层的方法，是游离缺失盘。 该方法包括形成在第一表面上的m层积层的（M-N），然后形成堆积层的n对，与对包括形成在第二表面上的n层积层中的一个和中的一个中的每一个 形成在第一表面上的m层积层的剩余的n。 每个堆积层包括介电层和导电形成于其上的层。 盘方法游离缺失从通过避免电介质材料的重复去钻污底物的制造期间被overdesmeared保护在堆积层的介电层。

公开(公告)号：EP2066160B1

公开(公告)日：2011-05-18

申请号：EP08168277.5

申请日：2008-11-04

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Taguchi, Yuichi ,  Chino, Teruaki ,  Oi, Kiyoshi

IPC: H05K3/46

CPC classification number: H05K1/0271 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H05K3/4644 ,  H05K2201/09063 ,  H05K2201/09136 ,  H05K2201/10674 ,  H01L2924/00

公开(公告)号：EP2315284A2

公开(公告)日：2011-04-27

申请号：EP10188267.8

申请日：2010-10-20

Applicant: Toshiba Lighting & Technology Corporation

Inventor： Betsuda, Nobuhiko ,  Ogawa, Kozo ,  Matsuda, Shuhei ,  Nishimura, Kiyoshi ,  Shibano, Nobuo

IPC: H01L33/64 ,  H05K1/02 ,  H05K1/03 ,  F21V17/12 ,  F21V19/00 ,  F21Y101/02

CPC classification number: H01L33/641 ,  F21K9/00 ,  F21S8/02 ,  F21V17/12 ,  F21V23/00 ,  F21V29/75 ,  F21V29/76 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H05K1/0209 ,  H05K1/0306 ,  H05K2201/09136 ,  H05K2201/09781 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to one embodiment, a light-emitting apparatus (10) includes an insulating base made of ceramics, an obverse metallic component (12) dividedly arranged on the front surface (11A) of the insulating base (11), semiconductor light-emitting elements (13) mounted on the obverse metallic component, and a reverse metallic component (14) arranged on a back surface (11B) of the insulating base (11) and having a thickness the same as or smaller than a thickness of the obverse metallic component (12) a volume equal to 50% or larger of a volume of the obverse metallic component (12).

公开(公告)号：EP2278864A1

公开(公告)日：2011-01-26

申请号：EP09735831.1

申请日：2009-04-24

Applicant: NEC Corporation

Inventor： YUGAMI, Kazuyuki ,  FURUSAWA, Koji

IPC: H05K3/34 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/09136 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y02P70/613

Abstract: To solve a problem in which when a surface mounting component to be soldered at a vicinity of an end portion is mounted by soldering, warpage may occurs in a board or the surface mounting component and a distance between the terminal of the board and the terminal of the surface mounting component increases and whereby a connection failure occurs with respect to a connection using the solder. For this purpose, in a mounting structure of the surface mounting component that is configured by connecting the surface mounting component to the board at the vicinity of the end portion by soldering, a concave portion is formed between joint portions for the soldering in a range in which the surface mounting component of the board is mounted. This concave portion is configured so that an influence of deformation due to the warpage of the board or/and the surface mounting component can be reduced by the concave portion.

Abstract translation: 为了解决如下问题：当通过钎焊安装要在端部附近焊接的表面安装部件时，可能在基板或表面安装部件中发生翘曲，并且基板的端子与端子之间的距离 表面安装部件增加并且由此关于使用焊料的连接发生连接故障。 为此，在表面安装部件的安装结构中，通过钎焊将表面安装部件连接到板的端部附近，在用于钎焊的接合部分之间形成凹入部分， 电路板的表面安装部件安装在其上。 该凹部构成为能够利用该凹部减小基板和/或表面安装部件的翘曲引起的变形的影响。

公开(公告)号：EP2063690A1

公开(公告)日：2009-05-27

申请号：EP07828718.2

申请日：2007-09-28

Applicant: NEC Corporation

Inventor： MATSUZAWA, Tadashi

IPC: H05K1/02 ,  H05K7/14

CPC classification number: H05K7/1461 ,  H05K1/0271 ,  H05K2201/09136 ,  H05K2201/10393

Abstract: Provided is a correcting fitting clamped by elasticity at least on one part of an edge portion of a printed circuit board for correcting warpage or flexure of the printed circuit board. The correcting fitting has a clamping portion for coming into band-shaped abutting contact with both faces of the printed circuit board along the edge portion of the printed circuit board. The clamping portion is bent in such a manner that at least a portion thereof is directed toward the edge portion of the printed circuit board. The bending strength of the correcting fitting against warpage and flexure of the printed circuit board can be enhanced by the clamping portion. Further, since fixing elements such as screws are not used to mount the correcting fitting, the number of parts of the printed circuit board and the number of steps for assembling the same can be reduced to thereby lower cost and achieve high-density packaging.

Abstract translation: 提供了一种用于校正印刷电路板的翘曲或弯曲的印刷电路板的边缘部分的至少一部分上由弹性夹紧的校正配件。 校正配件具有夹持部分，用于沿着印刷电路板的边缘部分与印刷电路板的两个面形成带状邻接接触。 夹持部弯曲成使得其至少一部分朝向印刷电路板的边缘部分。 通过夹紧部分可以提高校正配件抵抗印刷电路板翘曲和挠曲的弯曲强度。 此外，由于不使用诸如螺钉的固定元件来安装校正配件，因此可以减少印刷电路板的部件数量和组装步骤的数量，从而降低成本并实现高密度封装。

公开(公告)号：EP2019572A2

公开(公告)日：2009-01-28

申请号：EP08013359.8

申请日：2008-07-24

Applicant: TDK Corporation

Inventor： Kanemaru, Yoshikazu ,  Kawabata, Kenichi

IPC: H05K3/00 ,  H01L23/538

CPC classification number: H05K3/0052 ,  H01L23/49838 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/185 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/09136 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2203/0169 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49124 ,  H01L2224/82 ,  H01L2924/00

Abstract: The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).