摘要:
There is disclosed an endoscopic ligation kit which is capable of successively effecting ligations safely and positively. This kit includes an inner cylinder, an outer cylinder having at least two bamboo shoot-like steps formed on an outer periphery of its distal end portion, and a slide cylinder provided between the inner cylinder and the outer cylinder. The outer cylinder has a notch extending from its distal end to its maximum outer diameter portion. On the other hand, the slide cylinder has at its distal end portion a projection which conforms in size to the notch, and has steps, and the projection is fitted in the notch. O-rings are mounted respectively on the outer periphery of the distal end portion of the inner cylinder and the step portions of the outer cylinder. When a fluid is fed into an annular hermetic space, formed at a rear side of the slide cylinder, to move the slide cylinder forwardly, the O-ring, mounted on the outer periphery of the distal end portion of the inner cylinder, is disengaged therefrom, and also the O-rings, mounted respectively on the step portions of the outer cylinder, are moved to the forwardly-adjacent step portions, respectively.
摘要:
An epoxy resin composition for encapsulating a semiconductor, which is free from halogen and antimony and has excellent soldering crack resistance and high-temperature storage life without lowering the flame-retardancy, and which comprises as essential components (A) an epoxy resin, (B) a phenol resin curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) a red phosphorus-based flame-retardant, wherein the ratio of (a) the number of epoxy groups of the epoxy resin to (b) the number of phenolic hydroxyl groups of the phenol resin curing agent [(a)/(b)] is 0.8 to 1.2, the amount of the inorganic filler (D) contained in the epoxy resin composition is 70 to 90% by weight based on the total weight of the epoxy resin composition and the cured product of the epoxy resin composition has a glass transition temperature of 100 to 160°C and a linear expansion coefficient at 25°C of 0.8 to 1.8 × 10 -5 /°C.
摘要:
A laminated board comprising an intermediate layer and two surface layers formed thereon, in which board the intermediate layer comprises a central layer made of a nonwoven glass fiber fabric impregnated with a resin composition containing a thermosetting resin and an inorganic filler and upper and lower layers formed on the central layer, each being made of said resin composition containing a thermosetting resin and an inorganic filler, and the two surface layers formed on the intermediate layer are made of a thermosetting resin-impregnated fiber substrate; and a process for production of the laminated board.
摘要:
A process for producing a container covered with a cylindrical heat shrinking film comprises preparing a continuous double layer sheet of a heat shrinking film by folding a continuous single layer sheet (22) supplied from a roll (21), sealing the open side of the continuous double layer sheet by heat, cutting the continuous double layer sheet to form a cylindrical heat shrinking film (1) having two open ends, disposing the cylindrical heat shrinking film around periphery of a container in an upright condition after moving past outside of floats (3,4), cutting and sealing an upper part of the film by heat to a shape of an arc (11) without removing the film from the container to form a heat shrinking bag film, pulling down the film until the sealed part is brought into contact with top of the container, allowing a lower part of the film to shrink by partial heating to bring the heated part tightly into contact with bottom of the container, and heating the whole film to bring approximately the whole film tightly in contact with the whole container while the container is kept in the upright condition. An apparatus for the process is also disclosed. A packaging line can be remarkably improved because the cylindrical heat shrinking film can be produced in the line. Shrinking ratio of the film can be decreased because a film of a size close to the container can be easily used. Appearance of the product container can be kept the same on all sides because the container can be transferred in an upright condition. Deformation of characters and patterns printed on the film can be avoided. Therefore, a container covered with a heat shrinking film of beautiful appearance can be produced efficiently.
摘要:
A covering tape used for the heat sealing of a plastic carrier tape provided with contiguous pockets for housing electronic component chips, wherein the outer layer comprises a biaxially oriented film made from any of polyester, polypropylene and nylon, while the adhesive layer comprises one or more thermoplastic resins selected from among polyurethane, acrylic, polyvinyl chloride, ethylene-vinyl acetate and polyester resins and, dispersed therein, one or more fine conductive powders selected from among tin oxide, zinc oxide, titanium oxide, carbon black and organosilicon compounds.
摘要:
A photosensitive resin composition which comprises a polyamic ester having structural units (1a), (1b) and (1c) as the photosensitive resin and a sulfonamide derivative or a specified glycol ether acetate as the stabilizer and is especially excellent in viscosity stability, and a process for forming a high-resolution relief pattern by using said composition and a specified developer; wherein each symbol is as defined in the specification.
摘要:
Disclosed is a both-side roughened copper foil with a protection film, comprising a metal foil as soft as or softer than copper, or an organic type film having a melting point equal to or higher than a lamination temperature, laminated on one side of a copper foil with both sides roughened, the metal foil or organic film being continuously or continually bonded or adhered to the copper foil. It is possible to protect the ruggedness on the roughened surface at the time the both-side roughened copper foil is cut, packed, transported or stacked on another both-side roughened copper foil, simplify the press molding work, and improve the production efficiency particularly in the step of fabricating a copper-clad laminated board for a printed circuit board as well as the quality of the acquired copper-clad laminated board.
摘要:
A film adhesive mainly comprising a polyimide resin which has a glass transition point of 350 °C or below and is soluble in organic solvents, which resin is produced by the ring closure reaction of a reaction product between at least one of the following acid components (A) and (B): (A) 4,4'-oxydiphthalic dianhydride and (B) 3,3',4,4'-biphenyltetracarboxylic dianhydride and/or 3,3',4,4'-benzophenonetetracarboxylic dianhydride, and at least one of the following amine components (C) and (D); (C) a siloxane compound represented by general formula (1) and/or 2,2-bis-(4-(4-aminophenoxy)phenyl)propane, wherein R₁ and R₂ represent each a divalent C₁-C₄ aliphatic or aromatic group, R₃, R₄, R₅ and R₆ represent each a monovalent aliphatic or aromatic group, and k represents an integer of 1 to 20, and (D) bis(aminophenoxy)benzene and/or dimethylphenylenediamine.