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    MEMS RF-SWITCH WITH CONTROLLED CONTACT LANDING
    51.
    发明公开
    MEMS RF-SWITCH WITH CONTROLLED CONTACT LANDING 审中-公开

    公开(公告)号：EP3378088A1

    公开(公告)日：2018-09-26

    申请号：EP16804971.6

    申请日：2016-11-15

    Applicant: Cavendish Kinetics, Inc.

    Inventor： VAN KAMPEN, Robertus Petrus ,  KNIPE, Richard L. ,  RENAULT, Mickael ,  DASTIDER, Shibajyoti Ghosh ,  MUYANGO, Jaques Marcel

    IPC: H01H59/00 ,  B81B3/00

    CPC classification number: H01H59/0009 ,  B81B3/001 ,  B81B3/0035 ,  B81B2201/016 ,  H01G5/16 ,  H01H2059/0018 ,  H01H2059/0072

    Abstract: A MEMS switch contains an RF electrode 102, pull-down electrodes 104 and anchor electrodes 108 located on a substrate 101. A plurality of islands 226 are provided in the pull-down electrode and electrically isolated therefrom. On top of the RF electrode is the RF contact 206 to which the MEMS-bridge 212, 214 forms an ohmic contact in the pulled-down state. The pull-down electrodes 104 are covered with a dielectric layer 202 to avoid a short-circuit between the bridge and the pull-down electrode. Contact stoppers 224 are disposed on the dielectric layer 202 at locations corresponding to the islands 226, and the resulting gap between the bridge and the dielectric layer in the pulled-down state reduces dielectric charging. In alternative embodiments, the contact stoppers are provide within the dielectric layer 202 or disposed on the islands themselves and under the dielectric layer. The switch provides good controllability of the contact resistance of MEMS switches over a wide voltage operating range.

    RF MEMS ISOLATION, SERIES AND SHUNT DVC, AND SMALL MEMS
    52.
    发明公开
    RF MEMS ISOLATION, SERIES AND SHUNT DVC, AND SMALL MEMS 审中-公开
    RF-MEMS-ISOLIERUNG，REIHEN- UND NEBENANSCHLUSS-DVC UND KLEINES MEMS

    公开(公告)号：EP2751818A2

    公开(公告)日：2014-07-09

    申请号：EP12772159.5

    申请日：2012-08-31

    Applicant: Cavendish Kinetics Inc.

    Inventor： GADDI, Roberto ,  KNIPE, Richard L. ,  VAN KAMPEN, Robertus Petrus ,  UNAMUNO, Anartz

    IPC: H01G5/18 ,  H01G5/38 ,  H01G5/40 ,  H01H59/00

    CPC classification number: H01L28/60 ,  B81B3/0086 ,  B81B2201/016 ,  B81B2207/015 ,  H01G5/18 ,  H01G5/38 ,  H01G5/40 ,  H01H59/0009 ,  H03K17/162 ,  H03K17/6872 ,  H03K2217/0009 ,  H03K2217/0036 ,  H03K2217/009

    Abstract: The present invention generally relates to an architecture for isolating an RF MEMS device from a substrate and driving circuit, series and shunt DVC die architectures, and smaller MEMS arrays for high frequency communications. The semiconductor device has one or more cells with a plurality of MEMS devices therein. The MEMS device operates by applying an electrical bias to either a pull-up electrode or a pull-down electrode to move a switching element of the MEMS device between a first position spaced a first distance from an RF electrode and a second position spaced a second distance different than the first distance from the RF electrode. The pull-up and/or pull-off electrode may be coupled to a resistor to isolate the MEMS device from the substrate.

    Abstract translation: 本发明一般涉及用于将RF MEMS器件与衬底以及驱动电路，串联和分流DVC管芯结构以及用于高频通信的较小MEMS阵列隔离的架构。 半导体器件具有一个或多个具有多个MEMS器件的单元。 MEMS器件通过将电偏压施加到上拉电极或下拉电极来操作，以将MEMS器件的开关元件移动在与RF电极间隔开第一距离的第一位置和间隔第二位置的第二位置 距离与RF电极的第一距离不同。 上拉和/或下拉电极可以耦合到电阻器以将MEMS器件与衬底隔离。

    MEMS DEVICE ANCHORING
    53.
    发明公开
    MEMS DEVICE ANCHORING 审中-公开
    VERANKERUNG EINER MEMS-VORRICHTUNG

    公开(公告)号：EP2751022A2

    公开(公告)日：2014-07-09

    申请号：EP12781188.3

    申请日：2012-08-31

    Applicant: Cavendish Kinetics Inc.

    Inventor： RENAULT, Mickael ,  JOSHI, Vikram ,  KNIPE, Richard, L. ,  UNAMUNO, Anartz ,  VAN KAMPEN, Robertus, Petrus

    IPC: B81C1/00 ,  H01H59/00

    CPC classification number: B81B7/00 ,  B81B2201/016 ,  B81B2203/0307 ,  B81C1/00039 ,  B81C2203/0136 ,  H01G5/16 ,  H01H59/0009 ,  Y10T29/49105

    Abstract: Embodiments of the present invention generally relate to a MEMS device that is anchored using the layer that is deposited to form the cavity sealing layer and/or with the layer that is deposited to form the pull-off electrode. The switching element of the MEMS device will have a flexible or movable portion and will also have a fixed or anchor portion that is electrically coupled to ground. The layer that is used to seal the cavity in which the switching element is disposed can also be coupled to the fixed or anchor portion of the switching element to anchor the fixed or anchor portion within the cavity. Additionally, the layer that is used to form one of the electrodes may be used to provide additional leverage for anchoring the fixed or anchor portion within the cavity. In either situation, the movement of the flexible or movable portion is not hindered.

    Abstract translation: 本发明的实施例一般涉及使用沉积以形成空腔密封层和/或沉积以形成拉出电极的层来锚定的MEMS器件。 MEMS器件的开关元件将具有柔性或可移动部分，并且还将具有电耦合到地的固定或锚定部分。 用于密封其中设置有开关元件的空腔的层也可以耦合到开关元件的固定部分或锚定部分，以将固定部分或锚固部分固定在腔体内。 另外，用于形成电极之一的层可以用于提供用于将固定或锚定部分固定在腔内的额外的杠杆作用。 在这两种情况下，柔性或可动部分的运动不受阻碍。

    MEMS DEVICES
    55.
    发明公开
    MEMS DEVICES 审中-公开
    MEMS器件

    公开(公告)号：EP2277185A1

    公开(公告)日：2011-01-26

    申请号：EP09746214.7

    申请日：2009-05-07

    Applicant: NXP B.V.

    Inventor： STEENEKEN, Peter, G. ,  SUY, Hilco ,  GOOSSENS, Martijn

    IPC: H01H1/00 ,  H01H59/00

    CPC classification number: H01H1/0036 ,  B81B3/0078 ,  B81B2201/016 ,  B81B2203/0109 ,  H01H59/0009 ,  H01H2057/006

    Abstract: A MEMS device comprises first and second opposing electrodes (42,46), wherein the second electrode (46) is electrically movable to vary the electrode spacing between facing first sides of the first and second electrodes. A first gas chamber (50) is provided between the electrodes, at a first pressure, and a second gas chamber (52) is provided on the second, opposite, side of the second electrode at a second pressure which is higher than the first pressure. This arrangement provides rapid switching and with damping of oscillations so that settling times are reduced.

    Abstract translation: MEMS器件包括第一和第二相对电极（42,46），其中第二电极（46）可电动地移动以改变第一和第二电极的相对第一侧之间的电极间距。 在第一压力下在电极之间提供第一气体腔室（50），并且在第二电极的相对的第二侧面上以高于第一压力的第二压力提供第二气体腔室（52） 。 这种布置提供了快速切换并且具有振荡阻尼，从而降低了稳定时间。

    Electrostatically actuatable MEMS device
    56.
    发明公开
    Electrostatically actuatable MEMS device 有权
    电子科技有限公司MEMS-Vorrichtung mit verringerter Substrataufladung

    公开(公告)号：EP2107038A2

    公开(公告)日：2009-10-07

    申请号：EP09156532.5

    申请日：2009-03-27

    Applicant: IMEC ,  Katholieke Universiteit Leuven

    Inventor： De Wolf, Ingrid ,  Rottenberg, Xavier ,  Czarnecki, Piotr ,  Soussan, Philippe

    IPC: B81B3/00

    CPC classification number: B81B3/0008 ,  B81B2201/016 ,  H01G5/16 ,  H01H59/0009 ,  H01H2059/0018

    Abstract: Electrostatically actuatable MEMS device comprising: a substrate (103) of which at least a top layer (106) comprises a dielectric material; a first conductor (102) fixed to the top layer of the substrate, forming a fixed electrode of the device; and a second conductor (100) fixed to the top layer of the substrate, the second conductor being electrically isolated from the first conductor and comprising a movable portion (100') which is suspended at a predetermined first distance (D1) above the first conductor. The movable portion forms a movable electrode of the device which approaches the fixed electrode upon applying an appropriate voltage difference between the first and second conductors. A substrate surface area (105) is defined as the orthogonal projection of the movable portion on the substrate between the first and second conductors. In the substrate surface area at least one recess (107) is provided in at least the top layer of the substrate.

    Abstract translation: 可静电致动的MEMS器件包括：基底（103），至少顶层（106）包括介电材料; 固定到所述基板的顶层的第一导体（102），形成所述装置的固定电极; 以及固定到所述基板的顶层的第二导体（100），所述第二导体与所述第一导体电隔离，并且包括可移动部分（100'），所述可移动部分被悬置在所述第一导体之上的预定的第一距离（D1） 。 可移动部分在第一和第二导体之间施加适当的电压差，形成该装置的可动电极，该可移动电极接近固定电极。 衬底表面区域（105）被定义为在第一和第二导体之间的衬底上的可移动部分的正交突起。 在衬底表面区域中，至少一个凹部（107）设置在衬底的至少顶层中。

    DISPOSITIF MICROMECANIQUE COMPORTANT UNE POUTRE MOBILE
    57.
    发明授权
    DISPOSITIF MICROMECANIQUE COMPORTANT UNE POUTRE MOBILE 有权
    与移动BAR微机械装置

    公开(公告)号：EP1846320B1

    公开(公告)日：2008-06-25

    申请号：EP06709238.7

    申请日：2006-02-02

    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

    Inventor： FLEURY, Gatien ,  CHARVET, Pierre-Louis

    IPC: B81B3/00 ,  H01H50/00

    CPC classification number: B81C1/00666 ,  B81B2201/016 ,  B81C2201/0167

    Abstract: The invention relates to a micromechanical device comprising a mobile beam (1), said beam being attached by the two ends (2) thereof to a rigid frame (3) provided with two arms (4) each having two ends (5). The ends (5) of an arm (4) are respectively fixed to the two ends (2) of the mobile beam (1). Each arm (4) has a central part (6) arranged between the two ends (5) of the corresponding arm (4). A rear face of the central part (6) of each arm (4) is attached to a base support (10). The frame (3) comprises at least one stressed element (11) for adjusting the stressed state of the beam. The stressed element (11) can be centred between the front face and the rear face of the corresponding arm (4). The frame (3) can comprise pairs of front and rear stressed elements (11) which are respectively arranged on the front face and the rear face of the arms (4) in such a way that they face each other.

    MICROSYSTEME COMPORTANT UN PONT DEFORMABLE
    58.
    发明公开
    MICROSYSTEME COMPORTANT UN PONT DEFORMABLE 有权
    可变形桥MICROSYSTEMS

    公开(公告)号：EP1805100A1

    公开(公告)日：2007-07-11

    申请号：EP05857762.8

    申请日：2005-10-11

    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

    Inventor： CHARVET, Pierre-Louis

    IPC: B81B3/00

    CPC classification number: B81B3/0086 ,  B81B2201/016 ,  H01H59/0009

    Abstract: The invention relates to a microsystem comprising a deformable bridge (1), the ends (2) of which are connected to a substrate (3). According to the invention, at least one actuation electrode (6), which is solidly connected to the bridge (1), is disposed between the centre (C) of the bridge and one of the ends (2) next to a counter electrode (7) which is solidly connected to the substrate (3). The electrodes (6) are intended to deform the deformable bridge (1) such that a lower face of the bridge (1) comes into contact with a contact element (4) formed on the substrate (3). The actuation electrode (6) comprises, transversely to the bridge (1), a central zone (8) which is disposed on the bridge (1) and at least one projecting, flexible lateral flange (9). The lateral flange (9) can be connected to the central zone (8) by means of a narrower linking zone (10) which is disposed on the side of the flange (9) closest to the centre (C) of the bridge. Moreover, each actuation electrode (6) can comprise a pair of lateral flanges (9) which are disposed respectively on either side of the corresponding central zone (8).

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