公开(公告)号：EP1091626A1

公开(公告)日：2001-04-11

申请号：EP99919564.7

申请日：1999-05-13

Applicant: Rohm Co., Ltd.

Inventor： NAKAMURA, Satoshi

IPC: H05K1/14 ,  H01M2/10

CPC classification number: H05K1/148 ,  H01M2/1061 ,  H01M2/20 ,  H01M2/30 ,  H01M2/34 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/141 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/36 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/0382 ,  H05K2201/1028

Abstract: A protective circuit device (3) according to the present invention prevents overcharge to a storage battery (2). Protective circuit device (3) has a circuit board body (32) with a prescribed circuit pattern, and island portions (33, 34) having on their surfaces a plurality of external terminals (30) and connected to circuit board body (32) through a metal piece (35, 36). Island portions (33, 34) preferably includes first and second islands. First island (33) preferably has an external terminal (30) and is parallel to circuit board body (32). Second island (34) is preferably arranged between first island (33) and circuit board body (32) and is vertical to circuit board body (32).

Abstract translation: 根据本发明的保护电路装置（3）防止对蓄电池（2）过充电。 保护电路装置（3）具有：具有规定的电路图案的电路基板主体（32）;在表面具有多个外部端子（30）并与电路基板主体（32）连接的岛部（33,34） 一个金属片（35,36）。 岛部分（33,34）优选地包括第一和第二岛。 第一岛（33）优选具有外部端子（30）并且平行于电路板主体（32）。 第二岛（34）优选地布置在第一岛（33）和电路板主体（32）之间并且与电路板主体（32）垂直。

公开(公告)号：EP0921716A1

公开(公告)日：1999-06-09

申请号：EP98308969.9

申请日：1998-11-03

Applicant: Ford Global Technologies, Inc.

Inventor： Liu, Dangrong Ronald

IPC: H05K3/34

CPC classification number: B23K1/008 ,  B23K2201/42 ,  H05K3/3442 ,  H05K3/4015 ,  H05K2201/1028 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is disclosed herein a printed circuit board 50 having reinforced solder joints, comprising: a substrate 11 having mounting pads 14 arranged thereon; a surface mount component 13 having terminations 12, wherein the component 13 is disposed on the substrate 11 with each termination 12 being registered atop a respective mounting pad 14; a solder joint 10 connecting each termination 12 with its respective mounting pad 14; and a thin metallic member 30 disposed within each solder joint 10 between each termination 12 and its respective mounting pad 14. A method for producing such reinforced solder joints is also disclosed.

Abstract translation: 这里公开了一种具有加强焊接接头的印刷电路板50，包括：具有布置在其上的安装焊盘14的基板11; 具有端子12的表面安装部件13，其中部件13设置在基板11上，每个端子12被登记在相应的安装焊盘14的顶部; 将每个端子12与其相应的安装垫14连接的焊接接头10; 以及设置在每个端子12和其相应的安装垫14之间的每个焊接接头10内的薄金属构件30.还公开了一种用于制造这种增强的焊点的方法。

公开(公告)号：EP0371646B1

公开(公告)日：1994-03-09

申请号：EP89311663.2

申请日：1989-11-10

Applicant: THE WHITAKER CORPORATION

Inventor： Henschen, Homer Ernst ,  McKee, Michael John ,  Pawlikowski, Joseph Michael

IPC: B23K3/04 ,  H05B3/12 ,  H01R43/02

CPC classification number: H05K1/0212 ,  B23K3/0475 ,  H01R43/0242 ,  H05B3/12 ,  H05K1/0242 ,  H05K1/117 ,  H05K3/244 ,  H05K3/3494 ,  H05K3/363 ,  H05K3/4015 ,  H05K2201/083 ,  H05K2201/1028 ,  H05K2201/10924 ,  H05K2203/1115

公开(公告)号：EP0311418B1

公开(公告)日：1993-07-21

申请号：EP88309366.8

申请日：1988-10-07

Applicant: TDK Corporation

Inventor： Sasaki, Yoshinori ,  Takahashi, Sumio ,  Kuroshima, Toshihiro

IPC: H03H1/00

CPC classification number: H03H1/00 ,  H05K1/0233 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/165 ,  H05K1/183 ,  H05K3/3442 ,  H05K3/4015 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/1028 ,  H05K2201/10636 ,  H05K2201/10916 ,  Y02P70/611 ,  Y02P70/613

公开(公告)号：EP0250045B1

公开(公告)日：1992-09-09

申请号：EP87201127.5

申请日：1987-06-15

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY ,  DU PONT DE NEMOURS (NEDERLAND) B.V.

Inventor： Verhoeven, Laurentius Maria

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H05K3/4015 ,  H05K1/117 ,  H05K3/305 ,  H05K3/3405 ,  H05K2201/1028 ,  Y10T29/49213

公开(公告)号：EP0343375A1

公开(公告)日：1989-11-29

申请号：EP89107071.6

申请日：1989-04-19

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Thorwarth, Rüdiger ,  Enzensberger, Siegfried ,  Deimann, Rolf

IPC: H05K3/22

CPC classification number: H05K3/225 ,  B23K11/002 ,  B23K11/22 ,  B23K2201/42 ,  H05K3/328 ,  H05K2201/1028 ,  H05K2203/1115 ,  H05K2203/173 ,  Y10T29/49155 ,  Y10T29/49742

Abstract: Bei Herstellungsprozessen von Leiterplatten auftretende Fehler an den Leiterbahnen (4) können durch geeignete Verfahren repariert werden. Die besondere Ausbildung der Leiterbahnen in Mäanderform und deren Miniaturisierung erfordert eine völlig neue Vorgehensweise. Die Abmessungen heutiger Leiterbahnen (4) beträgt beispielsweise: Breite x Höhe = 70 µm x 20 µm. Zur Reparatur derartiger Leiterbahnen (4), die meist sehr eng auf einem Leiterbahnträger (6) angeordnet sind, ist es notwendig, die zur Reparatur eingesetzten Formteile (2) absolut deckungsgleich auf die Leiterbahnunterbrechung (1) zu positionieren und bis zur vollständigen Herstellung der Verbindungszonen (7) zwischen Formteil (2) und Leiterbahn (4) zur arretieren. Dies wird durch den Einsatz einer Isolierfolie (3) mit Arbeitsfenstern (5) und einem sogenannten Formteil­nutzen (15), das mehrere Formteile (2) enthält, erreicht. Das Formteil (2) wird durch ein erstes Elektrodensystem (8;9) mittels Widerstandserwärmung mit der Leiterbahn (4) verbunden und durch ein zweites Elektrodensystem (12;13) aus dem Formteilnutzen (15) herausgetrennt.

Abstract translation: 在印刷电路板生产过程中发生的导体轨迹（4）上的故障可以使用合适的方法进行修复。 导体轨道的特殊设计以蜿蜒的形式和它们的小型化需要一个全新的程序。 现代导体轨道（4）的尺寸例如：宽x高=70μm×20μm。 为了修复在导体轨道架（6）上主要布置得非常靠近的导体轨道（4），必须将用于修复的模制元件（2）以绝对保形的方式定位在 导体轨道中断（1）并将其保持在适当位置，直到模制元件（2）和导体轨道（4）之间的连接区域（7）的生产完成。 这通过使用具有用于操作的窗口（5）的绝缘膜（3）和包含多个模制元件（2）的所谓的模制元件坯料（15）来实现。 模制元件（2）通过第一电极系统（8; 9）通过电阻加热连接到导体轨道（4），并通过第二电极系统（12）与模制元件坯件（15）分离 ; 13）。 ... ...

公开(公告)号：EP0311418A2

公开(公告)日：1989-04-12

申请号：EP88309366.8

申请日：1988-10-07

Applicant: TDK Corporation

Inventor： Sasaki, Yoshinori ,  Takahashi, Sumio ,  Kuroshima, Toshihiro

IPC: H03H1/00

CPC classification number: H03H1/00 ,  H05K1/0233 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/165 ,  H05K1/183 ,  H05K3/3442 ,  H05K3/4015 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/1028 ,  H05K2201/10636 ,  H05K2201/10916 ,  Y02P70/611 ,  Y02P70/613

Abstract: A composite bead element comprises a chip-­like magnetic body (10) in a shape of a nearly rectang­ular parallelepiped in which a recess (11) is provided, at least one feed-through hole (12 to 14) formed in said body and an electronic component (20) inserted in said recess. Bead inductors are formed by conductors provided in said feed-through holes, and said elec­tronic component and said conductors are connected by predetermined conductors (16 to 19) on a surface of said body.

Abstract translation: 复合胎圈元件包括形成有大致长方体形状的芯片状磁性体（10），其中设有凹部（11），形成在所述主体中的至少一个通孔（12〜14）和 电子部件（20）插入在所述凹部中。 珠电感器由设置在所述馈通孔中的导体形成，并且所述电子部件和所述导体通过所述主体的表面上的预定导体（16至19）连接。

公开(公告)号：EP0133752A3

公开(公告)日：1988-08-10

申请号：EP84304532

申请日：1984-07-02

Applicant: RAYCHEM CORPORATION (a Delaware corporation)

Inventor： Allen, Leslie John ,  Cherian, Gabe ,  Diaz, Stephen H.

IPC: B23K03/00

CPC classification number: B23K35/0222 ,  B23K3/06 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/4015 ,  H05K13/0465 ,  H05K2201/0215 ,  H05K2201/0314 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2201/10946 ,  H05K2203/0415 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A chip carrier mounting device includes a retaining member having a predefined pattern of apertures in which are positioned preforms of joint-forming matenal such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. The joint-forming material may be filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.

公开(公告)号：EP0125619A3

公开(公告)日：1985-03-06

申请号：EP84105224

申请日：1984-05-09

Applicant: HITACHI, LTD.

Inventor： Nakazawa, Terumi ,  Minorikawa, Hiroshi ,  Kawakami, Kazuhiko

IPC: H05K05/02

CPC classification number: H05K5/0056 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/148 ,  H05K3/284 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/36 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/1028 ,  H05K2201/10651

Abstract: @ An electronic device for an automobile is roughly divided into individual parts (5) and control circuit elements (2a) which are mounted in a casing (1) divided into two compartments (20, 30), according to the present invention. The individual parts (5) are arranged in one compartment (30) and are covered with silicon rubber to improve their water resistance. The control circuit elements (2a) are arranged in the other compartment (20) and are covered with a silicon gel to prevent any stresses acting upon the control circuit elements, such as ICs, and provide these elements with moisture resistance. The control circuit elements (2a) are bonded by high-temperature solder to improve their heat resistance, but the individual parts (5) are bonded by eutectic solder.

公开(公告)号：EP0043586A3

公开(公告)日：1984-07-18

申请号：EP81105265

申请日：1981-07-07

Applicant: Siemens Aktiengesellschaft

Inventor： Thorwarth, Rüdiger

IPC: H05K03/22 ,  B23K11/32

CPC classification number: H05K3/225 ,  H05K3/328 ,  H05K2201/1028 ,  H05K2203/1115 ,  H05K2203/173 ,  Y10T29/49742