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    Technique for manufacturing micro-electro mechanical structures
    63.
    发明公开
    Technique for manufacturing micro-electro mechanical structures 审中-公开
    Technik zum Herstellen von mikroelektromechanischen Strukturen

    公开(公告)号：EP1712515A2

    公开(公告)日：2006-10-18

    申请号：EP06075741.6

    申请日：2006-03-30

    Applicant: Delphi Technologies, Inc.

    Inventor： Chilcott, Dan W.

    IPC: B81C1/00

    CPC classification number: B81B3/0072 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81C2201/0135 ,  B81C2201/014 ,  B81C2201/017

    Abstract: A technique (400) for manufacturing a micro-electro mechanical structure includes a number of steps. Initially, a cavity is formed into a first side of a handling wafer (404), with a sidewall of the cavity forming a first angle greater than about 54.7 degrees with respect to a first side of the handling wafer at an opening of the cavity. Then, a bulk etch is performed on the first side of the handling wafer to modify the sidewall of the cavity to a second angle greater than about 90 degrees (406), with respect to the first side of the handling wafer at the opening of the cavity. Next, a second side of a second wafer is bonded to the first side of the handling wafer (408).

    Abstract translation: 用于制造微机电结构的技术（400）包括多个步骤。 最初，空腔形成处理晶片（404）的第一侧，空腔的侧壁在空腔的开口处相对于处理晶片的第一侧形成大于约54.7度的第一角度。 然后，在处理晶片的第一侧上执行体蚀刻，以将腔的侧壁相对于处理晶片的开口处的第一侧相对于第二角度大于约90度（406） 腔。 接下来，将第二晶片的第二面接合到处理晶片（408）的第一侧。

    Sensor design and process
    64.
    发明公开
    Sensor design and process 审中-公开
    Sensorentwurf und Verfahren

    公开(公告)号：EP1705489A2

    公开(公告)日：2006-09-27

    申请号：EP06012101.9

    申请日：2000-03-16

    Applicant: Input/Output, Inc.

    Inventor： Selvakumar, Arjun ,  Goldberg, Howard D. ,  Yu, Duli ,  IP, Matthew ,  Schmidt, Martin A. ,  Marsh, James L. ,  Fung, Bing-Fai ,  Simon, Philip

    IPC: G01P15/13 ,  G01P15/08 ,  G01P15/125 ,  B81B3/00 ,  G01P1/02 ,  G01P1/00 ,  B81B7/00

    CPC classification number: G01P1/023 ,  B81B3/001 ,  B81B3/0072 ,  B81B7/0016 ,  B81B2201/0235 ,  G01D11/245 ,  G01D18/008 ,  G01N2001/021 ,  G01P15/0802 ,  G01P15/13 ,  G01P21/00 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/181 ,  G01V1/186 ,  H01L2224/48472 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

    Abstract translation: 一种用于测量地震数据的加速度计（305）。 加速度计（305）包括用于在真空密封过程中使用的集成通气孔和用于减小盖子晶片弯曲的平衡金属图案。 加速度计（305）还包括用于将结合压力隔离到加速度计（305）的指定区域的顶盖挤压框架凹部（405）和底盖压力框架凹部（420）。 加速度计（305）被真空密封并且包括平衡金属图案（730），以防止加速度计（305）的性能下降。 在加速度计（305）上执行切割处理以隔离加速度计（305）的电引线。 加速度计（305）还包括过冲保护缓冲器（720）和图案化金属电极，以在加速度计（305）的操作期间减小静摩擦力。

    Weighted released-beam sensor
    66.
    发明公开
    Weighted released-beam sensor 有权
    传感器电子邮件Biegebalken

    公开(公告)号：EP1676809A1

    公开(公告)日：2006-07-05

    申请号：EP05257824.2

    申请日：2005-12-19

    Applicant: STMicroelectronics, Inc.

    Inventor： McAlexander III, Joseph Colby

    IPC: B81B3/00

    CPC classification number: H01H35/14 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81C1/0015 ,  G01P15/0802 ,  G01P15/0891 ,  G01P15/125 ,  G01P15/135 ,  G01P2015/0828 ,  H01H1/0036

    Abstract: A released-beam sensor includes a semiconductor substrate having a layer formed thereon, and an aperture formed in the layer. A beam is mechanically coupled at a first end to the layer and suspended above the layer such that a second end forms a cantilever above the aperture. A boss is coupled to a second end of the beam and suspended at least partially within the aperture. The beam is configured to flex in response to acceleration of the substrate along a vector substantially perpendicular to a surface of the substrate. Parameters of the sensor, such as the dimensions of the beam, the mass of the boss, and the distance between the boss and a contact surface within the aperture, are selected to establish an acceleration threshold at which the boss will make contact with the contact surface. The sensor may be employed to deploy an airbag in a vehicle.

    Abstract translation: 释放光束传感器包括其上形成有层的半导体衬底和形成在该层中的孔。 梁在第一端机械耦合到层并且悬挂在层上方，使得第二端在孔上方形成悬臂。 凸台联接到梁的第二端并且至少部分地悬挂在孔内。 梁被配置为响应于沿着基本上垂直于衬底的表面的矢量的衬底的加速度而弯曲。 选择传感器的参数，例如梁的尺寸，凸台的质量以及凸台和孔内的接触表面之间的距离，以建立凸台将与触点接触的加速度阈值 表面。 可以使用传感器将气囊展开在车辆中。

    MINIATURE 3-DIMENSIONAL PACKAGE FOR MEMS SENSORS
    67.
    发明公开
    MINIATURE 3-DIMENSIONAL PACKAGE FOR MEMS SENSORS 有权
    三MINIATURKAPSELUNG FOR MEMS传感器

    公开(公告)号：EP1642365A1

    公开(公告)日：2006-04-05

    申请号：EP04715806.8

    申请日：2004-02-27

    Applicant: Honeywell International Inc.

    Inventor： MACGUGAN, Douglas, C.

    IPC: H01R33/88 ,  B81B7/00

    CPC classification number: B81B7/0074 ,  B81B2201/0235 ,  G01C21/16 ,  G01P1/023 ,  G01P15/18 ,  H01R33/88

    Abstract: An apparatus for mechanically mounting one or more Micro Electro-Mechanical System (MEMS) sensors on a stable, structurally sound base, the base being a generally cubical block formed in a ceramic substrate having a plurality of substantially planar and mutually orthogonal surfaces, wherein a first one of the surfaces is structured for rotationally interfacing with a host structure that is to be monitored, one or more of the remaining surfaces is structured for mechanically mounting of a MEMS sensor and a plurality of electrical signal carriers communicate between each of the MEMS sensor mounting surfaces and a plurality of electrical interface contacts positioned on the interfacing surface.

    Vertical offset structure and method for fabricating the same
    68.
    发明公开
    Vertical offset structure and method for fabricating the same 审中-公开
    Vertikale versetzte Struktur和Herstellungsverfahren

    公开(公告)号：EP1619164A2

    公开(公告)日：2006-01-25

    申请号：EP05015684.3

    申请日：2005-07-19

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Lee, Sang-woo ,  Lee, Byeung-leul ,  Kim, Jong-pal ,  Choi, Joon-hyock

    IPC: B81B3/00

    CPC classification number: B81C1/00182 ,  B81B2201/0235 ,  B81C2203/0118 ,  G01P15/0802 ,  G01P15/125

    Abstract: A vertical offset structure and a method for fabricating the same. The vertical offset structure includes a substrate; a fixed electrode fixing portion formed on the substrate; a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance; a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves into a direction substantially perpendicular to a plate surface of the substrate; a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode.

    Abstract translation: 垂直偏移结构及其制造方法。 垂直偏移结构包括基板; 形成在所述基板上的固定电极固定部; 固定电极移动部，形成在远离所述基板的上部的位置上预定距离; 弹簧部分，用于将固定电极固定部分和固定电极移动部分彼此连接，使得固定电极移动部分移动到基本上垂直于基板的板表面的方向; 远离所述基板的上部预定距离以与所述固定电极移动部分水平的预定间隔的可动电极; 以及与所述固定电极移动部和所述可动电极之一的预定区域接合的盖晶片。

    BENDING BEAM ACCELEROMETER WITH DIFFERENTIAL CAPACITIVE PICKOFF
    69.
    发明公开
    BENDING BEAM ACCELEROMETER WITH DIFFERENTIAL CAPACITIVE PICKOFF 有权
    弯曲梁加速度计，差动电容ESSAUFNEHMER

    公开(公告)号：EP1606635A1

    公开(公告)日：2005-12-21

    申请号：EP04758547.6

    申请日：2004-03-26

    Applicant: Honeywell International Inc.

    Inventor： MALAMETZ, David, L. ,  HORNING, Robert, D. ,  BECKA, Stephen, F.

    IPC: G01P15/125 ,  G01P15/08

    CPC classification number: B81B3/0072 ,  B81B2201/0235 ,  G01P15/08 ,  G01P15/125 ,  G01P2015/0831

    Abstract: A low cost, pendulous, capacitive-sensing Micro Electro-Mechanical Systems (MEMS) accelerometer is provided. The accelerometer includes a pendulous proof mass, one or more securing pads, and one or more flexures coupled with the pendulous proof mass and the one or more securing pads. The flexures flex linearly with respect to motion of the pendulous proof mass. First and second capacitor plates are positioned relative to the pendulous proof mass for detecting motion of the proof mass according to a sensed difference in capacitance. One or more strain isolation beams are connected between the one or more flexures and the pendulous proof mass or the securing pads. The strain isolation beams protect the flexures from mechanical strain.

    Acceleration sensor
    70.
    发明公开
    Acceleration sensor 审中-公开
    Beschleunigungsaufnehmer

    公开(公告)号：EP1431764A3

    公开(公告)日：2005-12-07

    申请号：EP03028700.7

    申请日：2003-12-16

    Applicant: HITACHI METALS, LTD.

    Inventor： Ohtoyo, Daigo ,  Saitoh, Masakatsu

    IPC: G01P15/08 ,  G01P15/12 ,  G01P15/18

    CPC classification number: G01P15/18 ,  B81B3/0072 ,  B81B2201/0235 ,  B81B2203/0109 ,  B81B2203/051 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/084

    Abstract: An acceleration sensor (100, 200, 300, 400, 500) is disclosed that has a structure in which elastic support arms (10) are not broken even if subjected to an impact that may be caused during a usual handling. The acceleration sensor comprises a mass portion (20), a mass portion top plate (40) fixed onto the mass portion (20), a rectangular thick support frame (30) surrounding the mass portion (20), a frame top plate (50) fixed onto the frame (30), and four elastic support arms (10) hanging the mass portion (20) in the center of the frame (30) and bridging the mass portion top plate (40) and the frame top plate (50). There are provided lateral grooves (72, 74) just below the support arms (10) on side surfaces of the mass portion (20) and on inner side surfaces of the frame (30). Due to the grooves (72, 74), the mass portion top plate (40) and the frame top plate (50) have their portions (42, 52) bonded to the mass portion (20)/ the frame (30) and their portions (44, 54) protruding toward the support arms (10). Cross sections on boundaries between the bonded portions (42, 52) and the protruding portions (44, 54) are larger than those connecting the protruding portions (44, 54) to the support arms (10). Breakage of the elastic support arms (10) is prevented, because the strain caused in the mass portion (20)/the frame (30) by an impact applied from outside is not directly transmitted to the support arms (10) and is released in the protruding portions (44, 54) having a larger cross section than the support arms (10).

    Abstract translation: 公开了一种加速度传感器（100,200,300,400,500），其具有弹性支撑臂（10）即使经受可能在通常的操作期间引起的冲击也不会断裂的结构。 加速度传感器包括质量部分（20），固定在质量部分（20）上的质量部分顶板（40），围绕质量部分（20）的矩形厚的支撑框架（30），框架顶板 ）固定到框架（30）上，并且四个弹性支撑臂（10）将质量部分（20）悬挂在框架（30）的中心并且桥接质量部分顶板（40）和框架顶板（50） ）。 在质量部分（20）的侧表面和框架（30）的内​​侧表面上的支撑臂（10）正下方具有横向槽（72,74）。 由于凹槽（72,74），质量部分顶板（40）和框架顶板（50）的它们的部分（42,52）结合到质量部分（20）/框架（30）上，并且它们 朝向支撑臂（10）突出的部分（44,45）。 接合部（42,52）与突出部（44,54）之间的边界上的横截面大于将突出部（44,45）连接到支撑臂（10）的截面。 由于通过从外部施加的冲击在质量部分（20）/框架（30）中引起的应变不直接传递到支撑臂（10）并被释放，因此可以防止弹性支撑臂（10）的破裂 所述突出部分（44,45）具有比所述支撑臂（10）更大的横截面。

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