Abstract:
A printed circuit board (100) and a display device (200) are provided. The printed circuit board (100) includes a plurality of insulation layers (110a-110e); at least one metal layer (120a-120d) between the plurality of insulation layers (110a-110e); and a fixing member (130) fixed to a surface of one (120d) of the at least one metal layer (120a-120d) and passing through an outermost one (110e) of the insulation layers (110a-110e) to protrude to the outside.
Abstract:
Provided is a printed circuit board including a base substrate, first row pads, and second row pads. The base substrate has two sides, that can be adjacent, respectively extending in first and second directions. A plurality of pad group areas successively positioned along the first direction are defined on the base substrate. The first row pads are respectively disposed within the pad group areas and successively positioned along a third direction. The second row pads are respectively disposed within the pad group areas, successively positioned along the third direction, and spaced apart from the first row pads. Each of the second row pads is a predetermined distance from a corresponding one of the first row pads in the second direction.
Abstract:
An electronic device (30) that includes a flexible display (31) is provided. The electronic device (30) includes a foldable display unit, a foldable functional device portion, and a connecting body (50, 52) that interconnects the display unit and the functional device portion. The display unit and the functional device portion are disposed to face each other so as to provide a first state, and after each of the display unit and the functional device portion is folded, at least a portion of the display unit is disposed in the rear side region to be utilized as a display region and at least a portion of the functional device portion is disposed in the front side region so as to provide a second state of being used as a region of the functional device portion.
Abstract:
Provided are a conducting substrate and a method for preparing the same. The method for preparing the conducting substrate according to an embodiment of the present application includes a) providing a substrate comprising a conducting layer; b) forming a metal layer on the entire surface of the substrate comprising the conducting layer; c) forming an insulating layer pattern on the metal layer; d) forming a metal layer pattern by over-etching the metal layer by using the insulating layer pattern as a mask; and e) reforming the insulating layer pattern.
Abstract:
A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (30); a fine L/S layer (40) formed in contact with a top surface of the wiring substrate; and a plurality of elements (12, 13) arranged in a matrix on a top surface of the fine L/S layer. The wiring substrate includes a plurality of first wiring lines (SigB1, Gate2), and a plurality of vias (14) arranged at a period corresponding to an integral multiple of an arrangement period of the plurality of element, and two or more of the vias are provided for each of the first wiring lines. Two or more adjacent ones of the elements on the fine L/S layer are electrically coupled to common one of the vias through one or more second wiring lines (16).
Abstract:
A display device includes: a display panel (120); a flexible printed circuit board FPCB (128) attached to the display panel (120); and an intermediate frame (130) including a support portion (131) supporting the display panel (120) and a first side wall (133) extending from the support portion (131), wherein the intermediate frame (130) has an aperture (133h) in the first side wall (133) and includes at least a protrusion (133a) extending from the first side wall (133) into the aperture (133h), and at least a portion of the FPCB (128) is disposed inwardly of the protrusion (133a) and in the aperture (133h).
Abstract:
Provided herein are conductive ink compositions having a good balance between adhesion to substrate, stability of submicron- sized particles, the ability to be sintered at relatively low temperatures, and good electrical conductivity. In one aspect, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the invention relates to methods for adhering submicron silver particles to a non-metallic substrate. In certain aspects, the invention relates to methods for improving the adhesion of a submicron silver-filled composition to a non-metalic substrate.