公开(公告)号：EP2523199A1

公开(公告)日：2012-11-14

申请号：EP11803361.2

申请日：2011-03-16

Applicant: Omron Corporation

Inventor： KOJIMA, Toshiyuki ,  ASANO, Megumu

IPC: H01F27/36 ,  H01F19/04 ,  H04B3/50 ,  H04B15/02 ,  H05K9/00

CPC classification number: H05K9/006 ,  H01F19/04 ,  H01F27/36 ,  H05K1/0218 ,  H05K1/0228 ,  H05K1/0233 ,  H05K9/0066 ,  H05K2201/0723 ,  H05K2201/1003 ,  H05K2201/10371

Abstract: On a circuit board (20) adapted to transmit a signal, a pulse transformer (12A) is provided on a path used for transmitting the signal of the circuit board (20). A shield member (15) is provided on the circuit board (20) for preventing noise, which is generated due to noise current flowing in a noise line pattern (16), from entering the pulse transformer (12A). The shield member (15) covers a surface portion (upper surface (26) and side surface (27)) of at least one pulse transformer that intersects concentric circles (30) whose central axis is axis A extending along the direction in which the noise current flows.

Abstract translation: 在适于发送信号的电路板（20）上，在用于发送电路板（20）的信号的路径上设置脉冲变压器（12A）。 屏蔽部件（15）设置在电路板（20）上，用于防止由于在噪声线图案（16）中流动的噪声电流而产生的噪声进入脉冲变压器（12A）。 屏蔽部件（15）覆盖与同轴圆（30）相交的至少一个脉冲变压器的表面部分（上表面（26）和侧表面（27）），所述同心圆（30）的中心轴线是沿着噪声 当前流。

公开(公告)号：EP2127504B1

公开(公告)日：2011-06-15

申请号：EP07804631.5

申请日：2007-07-20

Applicant: Sony Ericsson Mobile Communications AB

Inventor： BYGDÖ, Hakan ,  HOLMBERG, Per

IPC: H05K1/14 ,  H05K1/02

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K1/182 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: An electronic device is provided that includes a main printed circuit board (PCB) (16) having a top surface (32), a bottom surface (34), and a hole (36) extending between the top surface and the bottom surface. The electronic device further includes a module PCB (18) having at least one electrical component (22,24) mounted on a top surface (38) of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surface of the main PCB, and the at least one electrical component extends into the hole. In addition, the electronic device includes a cover (26) on the bottom surface of the main PCB that substantially covers the hole.

公开(公告)号：EP2249382A1

公开(公告)日：2010-11-10

申请号：EP08870591.8

申请日：2008-10-16

Applicant: Panasonic Corporation

Inventor： NAGAIKE, Shotaro

IPC: H01L23/02 ,  H01L25/04 ,  H01L25/18 ,  H05K3/28

CPC classification number: H05K1/181 ,  G02F1/13452 ,  H01L23/04 ,  H01L23/24 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0382 ,  H05K2201/10128 ,  H05K2201/10371 ,  H05K2201/10515 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y02P70/611 ,  H01L2924/00

Abstract: A circuit board module that can prevent a short circuit of an electronic component and can reduce a thickness if mounted electronic components contain an electronic component taller than other electronic components by one step and an electronic apparatus including the circuit board module are provided.
A circuit board module includes: a board 1 having a mounting surface; electronic components 2 mounted on the mounting surface; a frame 4 which is mounted on the mounting surface so as to surround the electronic components and has electric conductivity; a resin portion 6 which is provided inside the frame 4 and closely contacts the electronic components 2, the mounting surface, and the frame 4; and a lid portion 8 which covers the electronic components 2, which has electric conductivity, and which is connected to the frame 8. The lid portion 8 includes a flat portion 82 which is provided at a portion containing an area corresponding to a tall component 2H taller by one step than other electronic components of the electronic components 2 and which protrudes outward than portions other than the portion.

Abstract translation: 一种电路板模块，其可以防止电子部件的短路，并且如果安装的电子部件包含比其他电子部件高一级的电子部件，并且包括电路板模块的电子设备，则可以减小厚度。 电路板模块包括：具有安装表面的板1; 安装在安装表面上的电子部件2; 框架4，其安装在安装表面上以围绕电子部件并具有导电性; 树脂部分6，其设置在框架4内部并且紧密接触电子部件2，安装表面和框架4; 以及盖部8，其覆盖具有导电性的电子部件2，并且连接到框架8.盖部8包括平坦部82，该平坦部82设置在包含对应于高部件2H的区域的部分 比电子部件2的其他电子部件高一个台阶，并且比该部分以外的部分向外突出。

公开(公告)号：EP2205050A2

公开(公告)日：2010-07-07

申请号：EP09179773.8

申请日：2009-12-17

Applicant: Honeywell International Inc.

Inventor： ANDERSON, Robert B. ,  GILBERT, Michael A. ,  WATSON, Mark W.

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0218 ,  H05K1/0231 ,  H05K1/0233 ,  H05K9/0037 ,  H05K2201/0723 ,  H05K2201/10015 ,  H05K2201/1006 ,  H05K2201/10371 ,  Y10T29/49124

Abstract: An apparatus (100) for electrically shielding electronic components is provided. The apparatus includes a circuit board (102) having a first surface with a plurality of electronic components mounted on the first surface, the first surface having a first region (208,210) and a second region (206). The circuit board comprises a ground plane and a trace (302,402) on the first surface coupled to at least one electronic component in the first region and coupled to at least one electronic component in the second region. The circuit board also comprising a strip of conductive material (212,216) on the first surface, the strip of conductive material forming a perimeter around the first region of the circuit board, the strip of conductive material coupled to the ground plane, the strip of conductive material defining at least one gap (214,218) wherein the trace is oriented through the at least one gap. Additionally, a first filtering device (304,404) is coupled to the trace on a first side of the gap. The apparatus also includes a cover (104) composed of a conductive material for the first region of the circuit board. The cover comprises a contact surface (502) configured to contact the strip of conductive material on the circuit board. The contact surface has at least one notch (504). The at least one gap of the circuit board is configured to align with the at least one notch of the cover when the cover is installed on the circuit board.

Abstract translation: 提供一种用于电屏蔽电子部件的设备（100）。 该装置包括具有安装在第一表面上的多个电子部件的第一表面的电路板（102），第一表面具有第一区域（208,210）和第二区域（206）。 电路板包括在第一表面上的接地平面和迹线（302,402），其耦合到第一区域中的至少一个电子部件并耦合到第二区域中的至少一个电子部件。 所述电路板还包括在所述第一表面上的导电材料条（212,216），所述导电材料条形成围绕所述电路板的所述第一区域的周边，所述导电材料条耦合到所述接地平面，所述导电条 限定至少一个间隙（214,218）的材料，其中所述迹线被定向穿过所述至少一个间隙。 另外，第一过滤装置（304,404）在间隙的第一侧耦合到迹线。 该装置还包括由用于电路板的第一区域的导电材料构成的盖（104）。 所述盖包括被配置为接触所述电路板上的导电材料条的接触表面（502）。 接触表面具有至少一个凹口（504）。 当盖安装在电路板上时，电路板的至少一个间隙被配置成与盖的至少一个凹口对齐。

公开(公告)号：EP2200417A2

公开(公告)日：2010-06-23

申请号：EP09175386.3

申请日：2009-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cha, Kwang-Sik ,  Ha, Jung-Su ,  Park, Jung-Bae

IPC: H05K9/00

CPC classification number: H05K9/0026 ,  H05K1/141 ,  H05K1/148 ,  H05K9/003 ,  H05K2201/10159 ,  H05K2201/10371

Abstract: An installing structure of a memory for a portable terminal provides easy install and removal. The structure includes a main board and a sub-board coupled to the main board. A chip-type memory is coupled to the sub-board, and an electrical coupling unit transfers electrical signals between the main board and the sub-board. The memory installing structure of the portable terminal provides convenience by facilitating the replacement of the memory for repair or as an upgrade of capacity.

Abstract translation: 用于便携式终端的存储器的安装结构便于安装和拆卸。 该结构包括主板和耦合到主板的子板。 芯片型存储器耦合到子板，并且电耦合单元在主板和子板之间传送电信号。 便携式终端的存储器安装结构通过便于更换用于修理的存储器或作为容量的升级来提供方便。

公开(公告)号：EP2129195A1

公开(公告)日：2009-12-02

申请号：EP07714020.0

申请日：2007-02-09

Applicant: Panasonic Corporation

Inventor： MITSUBORI, Shinichi ,  KUBO, Tetsuya

IPC: H05K1/02

CPC classification number: H05K1/141 ,  H05K1/0271 ,  H05K2201/10371 ,  H05K2201/10378 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: It is an object to provide a circuit board, a laminating circuit board and an electronic apparatus which can enhance a shock resistance.
A first circuit board 20 has a first substrate 21, an electronic component 23 mounted on the first substrate 21, and a reinforcing member 25. The reinforcing member 25 includes a first portion having a first length which is orthogonal to a longitudinal direction of side portions 31 to 34, a second portion having a second length which is orthogonal to the longitudinal direction of the side portion and provided adjacently to the first portion, a first surface which is provided in the first portion and is fixed to the first substrate 21, a second surface which is provided on an opposite side to the first surface of the first portion and can be fixed to a second substrate 15, a third surface which is provided in the second portion and is fixed to the first substrate 21, and a fourth surface which is provided on an opposite side to the third surface of the second portion and can be fixed to the second substrate 15.

Abstract translation: 本发明的目的是提供一种能够提高抗冲击性的电路板，层压电路板和电子设备。 第一电路板20具有第一基板21，安装在第一基板21上的电子部件23和加强部件25.加强部件25包括第一部分，该第一部分具有与侧部的纵向正交的第一长度 如图31至图34所示，第二部分具有第二长度，该第二长度与侧部的纵向方向垂直并且与第一部分相邻地设置，第一表面设置在第一部分中并固定到第一基板21， 第二表面设置在与第一部分的第一表面相反的一侧上，并且可以固定到第二基板15，第三表面设置在第二部分中并固定到第一基板21，第四表面 其设置在与第二部分的第三表面相对的一侧上，并且可以固定到第二基板15。

公开(公告)号：EP2098104A1

公开(公告)日：2009-09-09

申请号：EP07856684.1

申请日：2007-12-13

Applicant: Nokia Corporation

Inventor： HAKUNTI, Jussi ,  KILPI, Pekka ,  VÄNSKÄ, Anssi ,  AAPRO, Teppo ,  LASAROV, Harri

IPC: H05K5/06 ,  H05K3/28 ,  H05K9/00

CPC classification number: H05K5/065 ,  H05K3/284 ,  H05K5/062 ,  H05K2201/0209 ,  H05K2201/10371 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: An electronic device and method of assembling an electronic device, said device comprising: an electronic component; an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and injection molded material overlaying at least the portion of the component and the overlaying protective layer.

公开(公告)号：EP1677583B1

公开(公告)日：2009-06-17

申请号：EP05028567.5

申请日：2005-12-28

Applicant: HITACHI, LTD.

Inventor： Kadoya, Kiyoomi ,  Sasaki, Masahiro ,  Mayuzumi, Takuya

IPC: H05K1/18 ,  H05K3/28 ,  H01L21/56 ,  H01L23/28 ,  B60R16/02

CPC classification number: B60R16/0239 ,  B29C45/14377 ,  B29C45/14655 ,  H01L21/565 ,  H01L25/165 ,  H01L2924/0002 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/284 ,  H05K5/0034 ,  H05K2201/09745 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/1056 ,  H05K2203/1316 ,  H05K2203/1572 ,  H01L2924/00

公开(公告)号：EP1933610A4

公开(公告)日：2009-05-06

申请号：EP06782280

申请日：2006-08-03

Applicant: PANASONIC CORP

Inventor： ONO MASAHIRO ,  UDA YOSIHIRO ,  YAMAGUCHI SEIJI ,  SHINCHI KAZUHIRO ,  TOMEKAWA SATORU

IPC: H05K3/28

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K7/20463 ,  H05K9/0083 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/2018 ,  H01L2224/0401

Abstract: A substrate structure whereby a resin part for coating a plurality of electronic components by one operation is given a shielding property and the mounting strength of electronic components with respect to the substrate is secured and an electronic device including the substrate structure are provided. A substrate structure 10 includes a substrate 11, a plurality of electronic components 12 mounted along the substrate 11, and a resin part 13 coating each electronic component 12 with a resin 18 while kept in close contact with the substrate 11. The substrate structure 10 includes a frame body 15 surrounding each electronic component 12 while kept in close contact with the substrate 11 and a lid part 17 closing an opening 16 in the frame body 15, and a resin 18 is filled inside the frame body 15.

公开(公告)号：EP2050197A1

公开(公告)日：2009-04-22

申请号：EP07810003.9

申请日：2007-06-28

Applicant: CTS Corporation

Inventor： KNECHT, Thomas ,  REESER, Glen ,  CLARK, Dean

IPC: H04B1/08 ,  H05K1/14

CPC classification number: H04B1/08 ,  H05K1/0243 ,  H05K1/141 ,  H05K2201/09063 ,  H05K2201/10371

Abstract: An RF Rx module adapted for direct surface mounting to the top surface of the front end of the motherboard of a picocell. The module comprises a printed circuit board having a plurality of direct surface mounted discrete electrical components defining a receive (Rx) section and path for RF signals. The signal receive section is defined by at least the following elements located under a lid which is attached to the surface of the board: a duplexer, a receive low pass filter, a low-noise amplifier, and a receive bandpass filter. At least one aperture in the board is adapted to accept a screw or the like for securing the module to the motherboard of the picocell.