摘要:
A curable resin composition capable of providing good OHC performance at elevated temperatures when used in polymer matrix composites. This resin composition includes, as major components, one or more multifunctional benzoxazine compounds and cycloaliphatic epoxy resin.
摘要:
The present invention relates to a halogen-free flame retardant resin composition, according to parts by weight, the resin composition comprises:(A) a mixture of phenoxyphosphazene compound (A 1 ) and compound (A 2 ) having dihydrobenzoxazine ring: 45-90 parts by weight, and the weight ratio of the phenoxyphosphazene compound (A 1 ) and the compound(A 2 ) having dihydrobenzoxazine ring is between 1:25-1:2; (B) an epoxy resin with epoxy equivalent of 500 -2000: 10-45 parts by weight; (C) a phenolic resin: 10-25 parts by weight, and (D) an amine curing agent: 0.5-10 parts by weight. The prepreg, laminate, metal-clad laminate for printed circuit prepared using the halogen-free flame retardant resin composition, have the advantages of high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low water absorption as well as low C.T.E.