公开(公告)号：EP1349696A1

公开(公告)日：2003-10-08

申请号：EP01272148.6

申请日：2001-12-07

Applicant: Koninklijke Philips Electronics N.V.

Inventor： DIJKEN, Durandus, K. ,  HOVING, Willem

IPC: B23K26/24 ,  B23K26/06 ,  B23K26/22

CPC classification number: H05K3/328 ,  B23K26/22 ,  B23K26/60 ,  B23K2201/42 ,  B23K2203/05 ,  B23K2203/10

Abstract: Method of laser welding which comprises at least two steps : a first step wherein the laser (10) is operated for some time T1 at low intensity in order to create a melt (31) in one part (12) with little or no evaporation of matter, thereby reducing product contamination, and a further step wherein the laser is operated for a shorter time T2 at high intensity in order to push said melt (31) towards a further part (13), whereby large gaps between said parts can be bridged, yet further reducing product contamination thanks to the low laser energy needed to proceed with the further step. Optionally, a third step is performed during a third period of time (T3) in which the weld is post-heated.

公开(公告)号：EP1345481A1

公开(公告)日：2003-09-17

申请号：EP00985827.5

申请日：2000-12-21

Applicant: FUJITSU LIMITED

Inventor： NAKAMURA, Naoaki, c/o Fujitsu Limited ,  HIGASHI, Osamu, c/o Fujitsu Limited

IPC: H05K3/34 ,  B23K1/00 ,  B23K1/008

CPC classification number: B23K31/02 ,  B23K1/008 ,  B23K2201/42 ,  H05K3/3494

Abstract: A bath apparatus 12 reserves a liquid 13 as a heating medium and includes an input partition bath 31, a first intermediate partition bath 32, a heat partition bath 33, a second intermediate partition bath 34 and a removing partition bath 35 that are divided by gates 21 through 24 and sequentially arranged in a direction in which a printed board assembly where components are loaded onto a printed board moves. The temperatures of liquids 13-31 and 13-32 in the input partition bath 31 and the first partition bath 32 are a preheating temperature. The temperature of a liquid 13-33 in the heat partition bath 33 is a soldering temperature. The gate 21 is gradually opened while the printed board assembly 11 is located in the first intermediate partition bath 32 and before the printed board assembly 11 is conveyed into the heat partition bath 33. The liquid in the heat partition bath 33 is mixed with the liquid in the first intermediate partition bath 32, and thus the temperature of the first intermediate partition bath 32 is gradually increased to the soldering temperature. The temperature of the printed board assembly 11 is gradually increased from the preheating temperature to the soldering temperature.

Abstract translation: 浴器12储存液体13作为加热介质，并且包括由门分开的输入隔壁31，第一中间分隔浴32，隔热浴33，第二中间分隔浴34和除去分隔浴35 如图21至图24所示，并且顺序地布置在其中组件被加载到印刷板上的印刷电路板组件移动的方向上。 输入隔壁31和第一分隔槽32中的液体13-31和13-32的温度是预热温度。 热隔壁33中的液体13-33的温度是焊接温度。 门21逐渐打开，而印刷电路板组件11位于第一中间分隔槽32中，并且印刷电路板组件11被输送到隔热浴33之间。将热分隔浴33中的液体与液体 在第一中间分隔槽32中，因此第一中间隔壁32的温度逐渐升高到焊接温度。 印刷电路板组件11的温度从预热温度逐渐升高到焊接温度。

公开(公告)号：EP1308232A1

公开(公告)日：2003-05-07

申请号：EP02257278.8

申请日：2002-10-21

Applicant: NIHON DEN-NETSU KEIKI CO., LTD.

Inventor： Toba, Hideaki

IPC: B23K1/08 ,  B23K3/06

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: A soldering apparatus for soldering a printed wiring board, including a solder vessel (1) for containing a molten solder, a nozzle (8) disposed in the vessel and having a first opening (37) and a second opening (21), and an electromagnetic pump (12) secured in the vessel and including a tubular member (20a) defining a solder flow path therein and having an inlet (34) and an outlet (13) connected to the second opening (21) of the nozzle. The pump has cores (19,18) and coils (42) disposed at a position below the surface level of the molten solder and arranged to generate a moving magnetic field in the path when the coils are electrically energized, so that the molten solder is fed from the inlet to the outlet and is projected from the first opening of the nozzle to form a solder wave.

Abstract translation: 一种用于焊接印刷电路板的焊接装置，包括用于容纳熔融焊料的焊料容器（1），设置在容器中并具有第一开口（37）和第二开口（21）的喷嘴（8），以及 电磁泵（12）固定在容器中，并包括在其中限定焊料流动路径的管状构件（20a），并具有连接到喷嘴的第二开口（21）的入口（34）和出口（13）。 泵具有设置在熔融焊料的表面水平以下的位置处的芯（19,18）和线圈（42），并布置成当线圈通电时在路径中产生移动磁场，使得熔融焊料为 从入口进入出口并从喷嘴的第一开口突出以形成焊波。

公开(公告)号：EP0650795B1

公开(公告)日：2003-01-15

申请号：EP94114605.2

申请日：1994-09-16

Applicant: International Business Machines Corporation

Inventor： Acocella, John ,  Banks, Donald Ray ,  Benenati, Joseph Angelo ,  Caulfield, Thomas ,  Corbin Jr.,John Saunders ,  Hoebener, Karl Grant ,  Watson, David P.

IPC: B23K1/00 ,  H05K3/34

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2224/29099 ,  H01L2924/014

公开(公告)号：EP1270131A1

公开(公告)日：2003-01-02

申请号：EP02013236.1

申请日：2002-06-17

Applicant: Val, Bernard ,  Val, Annemarie

Inventor： Val, Bernard

IPC: B23K3/06

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: L'invention concerne un dispositif de brasage à la vague pour cartes électroniques câblées, à partir d'un réservoir destiné à contenir de la soudure liquide, d'une colonne montante (1) dirigée vers le haut, dont l'extrémité inférieure communique avec le réservoir et dont l'extrémité supérieure s'ouvre sur une plaque perforée (2) munie de plusieurs orifices de débordement (9) de soudure liquide disposés transversalement par rapport au trajet de la carte électronique afin que la soudure liquide qui en déborde et qui est destinée à entrer en contact avec la carte électronique, puisse former une vague turbulente et qui s'écrase au passage d'une carte électronique.
Dans le but de permettre à moindre coût une variation du temps de contact entre la face inférieure de la carte à circuits imprimés et l'onde de soudure, il est proposé de prévoir des moyens (5, 6) pour faire varier l'angle de la surface de la plaque perforée (2) par rapport à l'horizontale.

Abstract translation: 用于电子板的焊接机具有引导熔融焊料的支撑件和支撑柱，其垂直延伸，其下端连接到储存器，并且上端开口连接到多孔板（2）上。 板具有横向于板的路径延伸的多个开口，以使波接触印刷电路。 该板可调节（5,6），以相对于水平面的角度。

公开(公告)号：EP1149661A3

公开(公告)日：2002-10-09

申请号：EP01302940.0

申请日：2001-03-29

Applicant: Tamura Kaken Corporation

Inventor： Akaike, Shinichi ,  Ohno, Takao ,  Saito, Shoichi

IPC: B23K35/363 ,  H05K3/34

CPC classification number: B23K35/3613 ,  B23K35/3612 ,  B23K35/3615 ,  B23K35/3616 ,  B23K2201/42 ,  H05K3/3489

Abstract: There is provided a soldering flux for circuit board, which is designed to be employed on an occasion of soldering electronic parts on a circuit board, the soldering flux being free from any organic solvent which may become a cause for contaminating air atmosphere and being capable of providing an excellent insulating property. This soldering flux comprises; a rosin-based modified resin having an acid value of not less than 100, a nondissociative activator formed of a nondissociative halogenide, and an aqueous solvent containing a volatile basic agent. There is also provided a circuit board having a flux film formed from such a soldering flux.

Abstract translation: 提供了一种用于电路板的助焊剂，其被设计用于在电路板上焊接电子部件的情况下使用，焊剂不含有可能成为污染空气气氛的原因的任何有机溶剂，并且能够 提供绝佳的绝缘性能。 该焊剂包括： 具有不小于100的酸值的松香基改性树脂，由非离子化卤化物形成的非解离活化剂和含有挥发性碱性试剂的水性溶剂。 还提供了具有由这种焊剂形成的焊剂膜的电路板。

公开(公告)号：EP1230829A1

公开(公告)日：2002-08-14

申请号：EP00976144.6

申请日：2000-11-16

Applicant: Visteon Global Technologies, Inc.

Inventor： WONG, Stephen, H., P. ,  KIANG, Billy

IPC: H05K3/36 ,  H05K3/34

CPC classification number: H05K3/363 ,  B23K1/085 ,  B23K2201/42 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/3468 ,  H05K2203/0126 ,  H05K2203/0165 ,  H05K2203/0557 ,  Y10T29/49144

Abstract: An apparatus and method for connecting together first and second printed circuit boards 10/20 (PCBs), wherein one or both of the PCBs is a flex circuit. The method includes overlapping the two PCBs such that their respective matching circuit trace arrays 12/22 face each other and are separated by a small predetermined distance K, and then introducing molten solder 30 proximate an overlapping PCB edge 18, such as by wave soldering, so as to urge capillation of the molten solder between the two PCBs, thereby forming solder joints operatively connecting together the two circuit trace arrays.

Abstract translation: 一种用于将第一和第二印刷电路板10/20（PCB）连接在一起的设备和方法，其中PCB中的一个或两个是柔性电路。 该方法包括使两个PCB重叠，使得它们各自的匹配电路迹线阵列12/22彼此面对并且分开一个小的预定距离K，然后例如通过波峰焊接将熔融焊料30靠近重叠的PCB边缘18引入， 以促使两个PCB之间的熔融焊料的熔化，从而形成可操作地将两个电路迹线阵列连接在一起的焊接点。

公开(公告)号：EP1230088A1

公开(公告)日：2002-08-14

申请号：EP00954711.8

申请日：2000-08-18

Applicant: Ford Motor Company

Inventor： HA, Vinh, Van ,  TRUBLOWSKI, John ,  LIN, John, (Jin Her)

IPC: B41F15/44 ,  H05K3/12 ,  B67D5/02

CPC classification number: B67D7/0244 ,  B23K3/0607 ,  B23K2201/42 ,  B41F15/44 ,  H05K3/1233 ,  H05K2203/0126

Abstract: An apparatus for compressing viscous material (100) through openings (48) in a stencil (46) is disclosed. The apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurised viscous material through the openings (48) in the stencil (46). The apparatus further includes a selectively expandable diaphragm (218, 318, 418, 518) which selectively and expandably allows the viscous material (100) to be dispensed into the compression head cap.

Abstract translation: 公开了一种用于通过模板（46）中的开口（48）压缩粘性材料（100）的设备。 该设备具有压缩盖帽，其提供所包含的环境以引导和帮助加压的粘性材料流过模板（46）中的开口（48）。 该设备还包括选择性可膨胀隔膜（218,318,418,518），其选择性地并且可扩展地允许粘性材料（100）被分配到压缩盖帽中。

公开(公告)号：EP1195217A1

公开(公告)日：2002-04-10

申请号：EP00935564.5

申请日：2000-06-07

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  Matsushige, Kazumi

Inventor： MATSUSHIGE, Kazumi ,  HORIUCHI, Toshihisa ,  IKARI, Takashi ,  SUETSUGU, Kenichiro ,  HIRANO, Masato ,  HIBINO, Shunji ,  YAMAGUCHI, Atsushi

IPC: B23K1/06 ,  B23K1/00

CPC classification number: B23K1/06 ,  B23K1/20 ,  B23K35/262 ,  B23K2201/40 ,  B23K2201/42 ,  H05K3/3463

Abstract: There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.

Abstract translation: 提供了一种焊接无铅焊料的方法，其降低无铅焊料的熔点并防止在由无铅焊料接合的部分处的接合强度的劣化，以及使用 焊接方法。 作为不含铅的锡的合金的无铅焊料熔化，并且当熔融的铅 - 铅焊料熔融时，超声波振动至少与通过无铅焊料的待连接接合体或无铅焊料起作用， 自由焊料固化。 因此，无铅焊料中含有的成分的晶体变细，并且防止了被包含的部件在接合物的接合界面处偏析，从而可以提高接合界面处的接合强度。

公开(公告)号：EP0806262B1

公开(公告)日：2002-02-13

申请号：EP97400803.9

申请日：1997-04-08

Applicant: L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE

Inventor： Leturmy, Marc

IPC: B23K1/08

CPC classification number: B23K1/085 ,  B23K2201/36 ,  B23K2201/42