公开(公告)号：EP2226373A1

公开(公告)日：2010-09-08

申请号：EP10154518.4

申请日：2010-02-24

Applicant: The Boeing Company

Inventor： Long, Lynn Edward ,  Moss, Randall Jay

IPC: C09J179/04 ,  C08K3/04

CPC classification number: C09J9/02 ,  C08K3/04 ,  C09J179/00 ,  C09J179/04

Abstract: An adhesive including an amorphous carbon dispersed in a cyanate ester resin, wherein the adhesive has static dissipative properties and low radio frequency loss properties.

Abstract translation: 包含分散在氰酸酯树脂中的无定形碳的粘合剂，其中所述粘合剂具有静电耗散特性和低射频损失特性。

公开(公告)号：EP2093594A4

公开(公告)日：2010-08-25

申请号：EP07832453

申请日：2007-11-26

Applicant: KURARAY CO

Inventor： MORISHITA YOSHIHIRO ,  HAMADA KENICHI ,  KUNIMUNE TETSUYA ,  ISHIURA KAZUSHIGE

IPC: G02B5/30 ,  C09J7/02 ,  C09J153/00

CPC classification number: C09J153/00 ,  C08L53/00 ,  C08L2205/02 ,  C08L2666/24 ,  C09J9/02 ,  Y10T428/2891 ,  Y10T428/31797

Abstract: Pressure-sensitive adhesives for optical films exhibit high cohesion, excellent re-workability, adhesion properties, heat resistance and durability without chemical crosslinking. A pressure-sensitive adhesive contains an acrylic triblock copolymer (I) at not less than 60% by mass based on the total mass of all solids contained in the pressure-sensitive adhesive, the acrylic triblock copolymer being represented by the formula A1-B-A2 wherein: A1 and A2 are each independently an alkyl methacrylate polymer block having Tg of not less than 100°C and B is an acryl acrylate polymer block having Tg of not more than -20°C; the content of the polymer block B is 50 to 95% by mass; Mw is in the range of 50,000 to 300,000; and the molecular weight distribution is in the range of 1.0 to 1.5. In a preferred embodiment, the acrylic triblock copolymer (I) is a combination of an acrylic triblock copolymer (Ia) having Mw of 50,000 to less than 100,000 and an acrylic triblock copolymer (Ib) having Mw of 100,000 to 300,000, in a mass ratio (Ia):(Ib) of 45:55 to 75:25.

公开(公告)号：EP1621596B1

公开(公告)日：2010-01-27

申请号：EP05016102.5

申请日：2005-07-25

Applicant: NITTO DENKO CORPORATION

Inventor： Amano, Tatsumi ,  Kobayashi, Natsuki ,  Ando, Masahiko

IPC: C09J133/00 ,  C09J7/00 ,  C09J7/02 ,  C09J11/06 ,  C09J9/00 ,  C08K5/00 ,  C08K5/19 ,  C08K5/3415 ,  C08K5/3435 ,  C08K5/3445 ,  C08K5/3462 ,  C08K5/36 ,  C08K5/49

CPC classification number: C09J133/08 ,  C08K5/0075 ,  C08K5/19 ,  C08K5/34 ,  C09J7/29 ,  C09J7/385 ,  C09J9/02 ,  C09J11/06 ,  C09J133/06 ,  C09J2201/606 ,  C09J2205/102 ,  G02F2202/22 ,  G02F2202/28 ,  Y10T428/12056 ,  Y10T428/28 ,  Y10T428/2891 ,  Y10T428/31935

Abstract: An object of the present invention is to provide a pressure-sensitive adhesive composition which is excellent in antistatic property of a non-electrification-prevented adherend (subject to be protected) upon peeling, and has reduced stainability in an adherend and is excellent in adhesion reliance, and electrification preventing pressure-sensitive adhesive sheets using the same. There is provided a pressure-sensitive composition comprising an ionic liquid, and a (meth)acryl-based polymer containing, as a monomer component, 0.1 to 100% by weight of a (meth)acrylic acid alkylene oxide. In addition, there is provided a pressure-sensitive composition comprising an ionic liquid, and a polymer containing, as a monomer component, 0.5 to 30 % by weight of a nitrogen-containing monomer and having a glass transition temperature Tg of no higher than 0°C. Furthermore, there is provided a pressure-sensitive composition comprising an ionic liquid, and a (meth)acryl-based polymer containing, as a monomer component, 0.01 to 20% by weight of a reactive surfactant.

公开(公告)号：EP2146404A1

公开(公告)日：2010-01-20

申请号：EP08752380.9

申请日：2008-05-07

Applicant: Hitachi Chemical Company, Ltd.

Inventor： FUKUSHIMA, Naoki ,  TSUKAGOSHI, Isao ,  SHIMIZU, Takehiro

IPC: H01R43/00 ,  C09J5/02 ,  C09J7/00 ,  C09J9/02 ,  H01L31/042 ,  H01R4/04

CPC classification number: H01L31/186 ,  C09J5/06 ,  C09J7/22 ,  C09J7/35 ,  C09J9/02 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2203/322 ,  C09J2400/163 ,  H01L31/0512 ,  Y02E10/50 ,  Y10T29/49194

Abstract: The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor.

Abstract translation: 本发明的电导体连接方法为相互分开的第一电导体和第二电导体之间的电连接的方法，包括热压的金属箔的工序中，第一粘合剂层形成在金属箔的一面和 第一电导体，以该顺序排列，以电连接并粘接金属箔和第一电导体，以及热压金属箔，形成在所述金属箔的另一侧上的第一粘合剂层或第二粘合剂层，并且所述第二 电导体，以该顺序排列，以电连接并粘接金属箔和所述第二电导体。

公开(公告)号：EP2146355A1

公开(公告)日：2010-01-20

申请号：EP08752378.3

申请日：2008-05-07

Applicant: Hitachi Chemical Company, Ltd.

Inventor： FUKUSHIMA, Naoki ,  TSUKAGOSHI, Isao ,  SHIMIZU, Takehiro

IPC: H01B5/02 ,  C09J5/02 ,  C09J7/02 ,  C09J9/02 ,  H01L31/042 ,  H01R4/04

CPC classification number: H01L31/18 ,  C08K7/18 ,  C09J7/28 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/602 ,  C09J2205/102 ,  H01L31/022425 ,  H01L31/0512 ,  Y02E10/50

Abstract: The electric conductor connecting member of this invention comprises a metal foil having a roughened surface on at least one main side, and an adhesive layer formed on the roughened surface of the metal foil.

Abstract translation: 本发明的导电体连接构件包括在至少一个主侧上具有粗糙表面的金属箔和形成在金属箔的粗糙表面上的粘合层。

公开(公告)号：EP2042580A4

公开(公告)日：2009-12-09

申请号：EP06767886

申请日：2006-07-05

Applicant: HENKEL ABLESTIK JAPAN LTD ,  NAMICS CORP

Inventor： WATANABE BUNYA ,  TOIDA GO

IPC: C09J201/00

CPC classification number: H05K3/321 ,  C08K3/08 ,  C08K5/0008 ,  C08K5/3437 ,  C08K5/378 ,  C09J9/02 ,  C09J11/02 ,  H05K2201/0769 ,  H05K2203/121 ,  H05K2203/122

公开(公告)号：EP2079084A1

公开(公告)日：2009-07-15

申请号：EP07829106.9

申请日：2007-10-03

Applicant: Hitachi Chemical Company, Ltd.

Inventor： TAKAI, Kenji ,  TAKANE, Nobuaki

IPC: H01B5/00 ,  B22F1/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01B13/00 ,  H01R11/01 ,  H01R43/00

CPC classification number: H01R11/01 ,  B22F1/0062 ,  B22F1/025 ,  C08K9/04 ,  C08K9/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01R4/04 ,  H01R13/03 ,  H01R13/035 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0224

Abstract: A coated particle 10 comprising a functional group-containing conductive particle at least partially surface-coated with an insulating material, wherein the conductive particle has a metal surface and at least a part of the metal surface has a functional group, and wherein the insulating material comprises polymer electrolytes 4 and an insulating particles 6 made of an inorganic oxide having a hydroxy group on at least a part of a surface thereof.

Abstract translation: 涂覆颗粒10，其包括含官能基导电粒子的至少部分表面涂覆有绝缘材料，worin导电性粒子具有金属表面和金属表面的至少一部分具有官能基，和worin绝缘材料 包括高分子电解质4和由具有上至少在其表面的一部分具有羟基的无机氧化物的绝缘性粒子6的。

公开(公告)号：EP1850351A4

公开(公告)日：2009-06-03

申请号：EP05811653

申请日：2005-12-02

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： TOSHIOKA HIDEAKI ,  YAMAMOTO MASAMICHI ,  KAWABATA KAZUHIRO

IPC: H01B1/20 ,  C09J9/02 ,  C09J163/00 ,  H01B1/00 ,  H01R11/01

CPC classification number: C09J163/00 ,  C09J9/02 ,  H01B1/22 ,  H01B1/24 ,  H01R4/04

公开(公告)号：EP2058822A1

公开(公告)日：2009-05-13

申请号：EP07806061.3

申请日：2007-08-24

Applicant: Murata Manufacturing Co. Ltd.

Inventor： NOMURA, Akihiro ,  TAKAOKA, Hidekiyo ,  NAKANO, Kosuke

IPC: H01B1/22 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01B1/00 ,  H05K3/32

CPC classification number: H05K3/321 ,  C08K3/08 ,  C08K7/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/0425 ,  Y02P70/611 ,  Y10T428/2857 ,  Y10T428/31678

Abstract: An electroconductive bonding material contains a thermosetting resin 7, a low-melting-point metal powder 8 which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin 7, a high-melting-point metal powder 9 which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin 7 and which reacts with the low-melting-point metal powder 8 to form a reaction product having a high melting point of 300°C or higher during heat-hardening of the thermosetting resin 7, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder 9. The total content of the low-melting-point metal powder 8 and the high-melting-point metal powder 9 is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder 8 to the average particle size D2 of the high-melting-point metal powder 9 is 0.5 to 6.0. Thereby, it is possible to provide an electroconductive bonding material which has good conduction properties and high connection strength even when reflow heat treatment is repeatedly carried out or thermal shock accompanied with a rapid temperature change is applied to the electroconductive bonding material, and an electronic apparatus using such an electroconductive bonding material.

Abstract translation: 导电性接合材料含有热固性树脂7，在等于或低于热固性树脂7的热固化温度的温度下熔化的低熔点金属粉末8，高熔点金属粉末9， 在等于或低于热固性树脂7的热固化温度的温度下不熔化，并且与低熔点金属粉末8反应，以在热处理期间形成高熔点为300℃或更高的反应产物， 硬化热固性树脂7，以及去除在高熔点金属粉末9的表面上形成的氧化物的还原物质。低熔点金属粉末8和高熔点金属粉末8的总含量 金属粉末9为75〜88重量％，低熔点金属粉末8的平均粒径D1与高熔点金属的平均粒径D2的粒径比D1 / D2 粉末9为0.5〜6.0。 由此，即使重复进行回流热处理，也可以提供具有良好导通性和高连接强度的导电性接合材料，或者对导电性接合材料施加伴随着快速变化的热冲击，电子设备 使用这种导电接合材料。

公开(公告)号：EP2048211A2

公开(公告)日：2009-04-15

申请号：EP08017744.7

申请日：2008-10-09

Applicant: Nitto Denko Corporation

Inventor： Nonaka, Takahiro ,  Daigaku, Noritsugu ,  Nakayama, Junichi

IPC: C09J7/02 ,  C09J7/04 ,  C09J9/02 ,  C09J11/02 ,  C09J11/08 ,  C09J11/04 ,  C09J11/06

CPC classification number: C09J133/02 ,  C08K3/04 ,  C08K3/08 ,  C08K5/13 ,  C08K5/37 ,  C09J7/10 ,  C09J7/21 ,  C09J7/38 ,  C09J7/385 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/263 ,  C09J2433/00 ,  H05K3/0058 ,  Y10T428/24909

Abstract: The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition contains an acrylic polymer as a main component and further contains an electrically conductive filler in a proportion of 5 to 100 parts by weight with respect to 100 parts by weight of a total solid in the pressure-sensitive adhesive composition except the electrically conductive filler. The double-sided pressure-sensitive adhesive tape or sheet is excellent in adhesiveness, electrically conducting property and anti-repulsion property, and thus can be advantageously used for wiring circuit board.

Abstract translation: 本发明提供一种双面压敏粘合带或粘合片用于布线电路板，其包括由压敏粘合剂组合物形成的压敏粘合剂层，worin压敏粘合剂组合物含有丙烯酸类聚合物作为 主要成分，并且还含有在5〜100重量份，相对于100组重量份的总固体的压敏粘合剂组合物除导电性填料的比例导电填料。 双面压敏粘合带或粘合片具有优良的粘接性，导电性能和抗排斥性能，并且因此可以有利地用于布线电路板。