公开(公告)号：EP0604838A1

公开(公告)日：1994-07-06

申请号：EP93120249.3

申请日：1993-12-16

Applicant: HOECHST CELANESE CORPORATION

Inventor： Jester, Randy D.

IPC: C08L67/00 ,  C08L67/04 ,  B32B15/08 ,  C09K19/38

CPC classification number: B32B15/08 ,  B29C55/00 ,  B29D7/01 ,  B29K2105/0079 ,  B29K2105/0088 ,  B29K2105/26 ,  B32B15/09 ,  B32B15/20 ,  B32B2307/52 ,  C08J5/18 ,  C08J11/06 ,  C08J2367/00 ,  C08L67/00 ,  C08L67/04 ,  C09K19/3809 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0212 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/0278 ,  Y02W30/701 ,  Y10S428/91 ,  Y10T428/1095 ,  Y10T428/24942 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786 ,  C08L2666/18

Abstract: A melt consolidated, multiaxially oriented liquid crystal polymer ("LCP") sheet or other article formed from LCP particles. One embodiment includes a multi-component LCP sheet in which particles of a higher melting LCP are imbedded in a matrix of a lower melting LCP. These LCP components are formed into sheet at a temperature between the melting point of the lower melting matrix LCP and the higher melting reinforcing LCP, so that the imbedded LCP particles may maintain their shape, orientation, and mechanical characteristics while the matrix LCP component flows around the particles and forms a solid sheet. In another embodiment, LCP particles are melt consolidated to form a single article in which a significant amount of LCP orientation is retained. A sheet of this invention may be formed by a variety of processes, and may be made from recycled scrap LCP.

Abstract translation: 熔融固化的多轴取向液晶聚合物（“LCP”）片或由LCP颗粒形成的其它制品。 一个实施方案包括多组分LCP片，其中较高熔点LCP的粒子嵌入较低熔点LCP的基质中。 这些LCP组分在低熔点基质LCP的熔点和较高熔点的增强LCP之间的温度下形成片材，使得嵌入的LCP颗粒可以在基质LCP组分流动时保持其形状，取向和机械特性 颗粒并形成固体片。 在另一个实施方案中，LCP颗粒被熔融固化以形成其中保留显着量的LCP取向的单一制品。 本发明的片材可以通过各种方法形成，并且可以由再循环废料LCP制成。

公开(公告)号：EP0544246A1

公开(公告)日：1993-06-02

申请号：EP92120064.8

申请日：1992-11-25

Applicant: HOECHST CELANESE CORPORATION

Inventor： Jester, Randy Douglas ,  Frank, Detlef Karl Manfred

IPC: B32B27/36 ,  B32B7/02

CPC classification number: B32B27/08 ,  B32B1/08 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/36 ,  B32B2457/08 ,  B32B2597/00 ,  H05K1/036 ,  H05K2201/0141 ,  Y10T428/10 ,  Y10T428/24926

Abstract: A coextruded liquid crystal polymer ("LCP") film or sheet wherein a higher melting LCP layer is laminated to a lower melting LCP layer. These LCP components are coextruded from the same die. This film or sheet may then be laminated onto other materials at a temperature between the melting point of the lower-melting LCP and the higher-melting LCP, so that the latter LCP may maintain its shape, orientation, and mechanical characteristics while the lower-melting LCP component flows and bonds with the other material. When the higher-melting LCP layer is sandwiched between two lower-melting layers, the film or sheet may be laminated on two sides thereof.

Abstract translation: 共挤出的液晶聚合物（“LCP”）膜或片，其中较高熔点的LCP层被层压到较低熔点的LCP层。 这些LCP组分从相同的模头共挤出。 然后可以在低熔点LCP的熔点和较高熔点的LCP之间的温度下将该膜或片材层压到其它材料上，使得后者LCP可保持其形状，取向和机械特性， 熔化的LCP组分流动并与其他材料结合。 当较高熔点的LCP层夹在两个较低熔点层之间时，膜或片可以层压在其两侧。

公开(公告)号：EP0464643A3

公开(公告)日：1993-01-20

申请号：EP91110575.7

申请日：1991-06-26

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Adcock, David Frederick

IPC: B29C59/02 ,  B24C1/06 ,  H05K3/38 ,  H05K3/00

CPC classification number: H05K3/381 ,  B29C59/02 ,  B29K2105/0079 ,  B29K2995/0024 ,  H05K1/0313 ,  H05K1/0373 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2203/025

Abstract: Surfaces of articles molded from unfilled or lightly filled liquid crystal polymers have a tendency to peel away when subjected to even slight rubbing. Such surfaces are improved by subjecting them to abrasion to remove at least 0.01 mm of surface thickness, whereby they acquire a smooth matte finish and are no longer susceptible to peeling.

公开(公告)号：EP0464643A2

公开(公告)日：1992-01-08

申请号：EP91110575.7

申请日：1991-06-26

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Adcock, David Frederick

IPC: B29C59/02 ,  B24C1/06 ,  H05K3/38 ,  H05K3/00

CPC classification number: H05K3/381 ,  B29C59/02 ,  B29K2105/0079 ,  B29K2995/0024 ,  H05K1/0313 ,  H05K1/0373 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2203/025

Abstract: Surfaces of articles molded from unfilled or lightly filled liquid crystal polymers have a tendency to peel away when subjected to even slight rubbing. Such surfaces are improved by subjecting them to abrasion to remove at least 0.01 mm of surface thickness, whereby they acquire a smooth matte finish and are no longer susceptible to peeling.

Abstract translation: 由未填充或轻质液晶聚合物成型的制品的表面在经受甚至轻微摩擦时具有剥离的倾向。 通过使它们磨损以除去至少0.01mm的表面厚度来改善这些表面，由此它们获得光滑的哑光光洁度，并且不再易于剥离。

公开(公告)号：EP0402028A3

公开(公告)日：1991-09-25

申请号：EP90305843.6

申请日：1990-05-30

Applicant: POLYPLASTICS CO. LTD.

Inventor： Suzuki, Yoshiharu ,  Akeda, Tomoyuki

IPC: H05K3/02 ,  H05K3/38 ,  H05K1/03

CPC classification number: H05K1/0366 ,  H05K1/0326 ,  H05K1/0373 ,  H05K3/14 ,  H05K3/388 ,  H05K3/4626 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/09118

Abstract: A board suitable for the formation thereon of a precision fine-line conductive metal circuit by the substractive method comprises a base plate prepared by molding a liquid-crystal polyester resin composition comprising (A) a melt-processable polyester (liquid-crystal polyester) capable of forming an anisotropic molten phase and (B) an inorganic filler, the base plate being treated to form a metallic coating on the surface thereof by sputtering, ion plating or vacuum deposition while heating said surface to a temperature of 60°C or above in a reduced pressure chamber.

公开(公告)号：EP0315851A1

公开(公告)日：1989-05-17

申请号：EP88118077.2

申请日：1988-10-31

Applicant: BASF Aktiengesellschaft

Inventor： Buchert, Hermann, Dr. ,  Grimm, Gerhard ,  Muenstedt, Helmut, Dr.

IPC: B32B15/08

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  B32B27/20 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B2307/308 ,  B32B2311/12 ,  H05K1/0313 ,  H05K1/0326 ,  H05K1/0333 ,  H05K1/034 ,  H05K3/022 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0355 ,  Y10S428/901 ,  Y10T428/31 ,  Y10T428/31504 ,  Y10T428/31533 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31692

Abstract: Verbundmaterialien, im wesentlichen aufgebaut aus

A) einem hochtemperaturbeständigen Thermoplasten auf der Basis von Polyarylethersulfonen, Polyaryletherketonen, Polyetherimiden oder thermotropen Polymeren und
B) einer direkt darauf aufgebrachten metallischen Schicht, deren Oberfläche durch chemische oder mechanische Behandlung vergrößert wurde,
wobei die Seite mit vergrößerter Oberfläche dem hochtemperaturbeständigen Thermoplasten zugewandt ist und die Haftfestigkeit zwischen der metallischen Schicht B) und dem hochtemperaturbeständigen Thermo­plasten A), gemessen bei einer Abzugsgeschwindigkeit von 20 mm/min und einem Abzugswinkel von 180°, mindestens 1,9 N/mm beträgt.

Abstract translation: 从... A）一种耐高温的热塑性建立本质上的复合材料基于聚芳基醚砜，聚芳醚酮，聚醚酰亚胺或热嗜聚合物和... B）直接涂覆到其与表面areaswhich金属涂层由已经增加 化学或机械处理，...面向高温度 - 耐热塑性塑料和金属涂层B之间的粘合强度）和耐高温热塑性A中的增加的表面面积的一侧）以20mm的剥离速度测量 /分钟，180°的剥离角，至少为1.9牛顿/毫米。

公开(公告)号：EP2695914B1

公开(公告)日：2018-08-29

申请号：EP11862875.9

申请日：2011-11-28

Applicant: Shenzhen Wote Advanced Materials Co., Ltd.

Inventor： LEE, Youn Eung ,  LEE, Jin Kyu ,  OH, Young Taek ,  KIM, Mahn Jong

IPC: C08L67/03 ,  C08K3/34 ,  C08K7/12 ,  H05K1/03 ,  C08K3/08 ,  C08K3/38 ,  C08K7/14 ,  C08K3/01 ,  C08K3/013

CPC classification number: C08K3/38 ,  C08K3/01 ,  C08K3/013 ,  C08K3/04 ,  C08K3/08 ,  C08K3/40 ,  C08K7/14 ,  C08K2003/0812 ,  C08K2003/382 ,  C08K2003/385 ,  C08K2201/001 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/09118 ,  Y10T428/24802 ,  Y10T428/31786 ,  C08K3/0033 ,  C08L67/03 ,  C08K3/0008

Abstract: A thermally conductive polymer composite material and an article including the same. The thermally conductive polymer composite material includes 15 to 20 parts by weight of a wholly aromatic liquid crystalline polyester resin; and 80 to 85 parts by weight of a thermally conductive additive.

公开(公告)号：EP3292885A1

公开(公告)日：2018-03-14

申请号：EP17183909.5

申请日：2017-07-31

Applicant: BIOTRONIK SE & Co. KG

Inventor： Bihler, Eckardt ,  Hauer, Marc ,  Schulze, Daniel

IPC: A61N1/05 ,  A61B5/042 ,  H05K1/02

CPC classification number: H01B5/14 ,  A61B5/042 ,  A61B5/6853 ,  A61B5/686 ,  A61B5/6876 ,  A61B2562/0209 ,  A61B2562/164 ,  A61N1/05 ,  H05K1/0283 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/056 ,  H05K2201/09263 ,  H05K2201/09436

Abstract: Dehnbare Elektrodenleiteranordnung für ein medizinisches Implantat, die mindestens einen zickzack- oder mäanderförmigen Leiterzug auf einem isolierenden Träger und mit einer isolierenden, mit dem Träger unter Einbettung des Leiterzuges dicht verbundenen Abdeckung aufweist, wobei der Träger ein im Wesentlichen nicht dehnbares Material aufweist und in Anpassung an die Kontur des Leiterzuges oder der Leiterzüge zickzack- oder mäanderförmig zugeschnitten ist.

Abstract translation: 对于具有至少一个锯齿形或在绝缘支撑，并与绝缘蜿蜒导体的轨道，与通过嵌入导体运行紧紧地连接盖，所述支撑件包括一个基本上不可拉伸的材料支撑的医用植入物和在适应拉伸电极导体配置 导体轨迹或导体轨迹的轮廓以锯齿形或曲折形切割。

公开(公告)号：EP3199652A3

公开(公告)日：2017-08-23

申请号：EP17151569.5

申请日：2017-01-16

Applicant: JX Nippon Mining & Metals Corp.

Inventor： FUKUCHI, Ryo

IPC: C22C9/02 ,  C22C9/00 ,  H05K1/00

CPC classification number: H05K1/0237 ,  C22C9/00 ,  C22C9/02 ,  H01Q1/38 ,  H05K1/0313 ,  H05K1/09 ,  H05K3/022 ,  H05K3/06 ,  H05K3/202 ,  H05K3/389 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0307

Abstract: To provide a copper foil and a copper-clad laminate board that have a good circuit formability and have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board. A copper foil comprising a gloss face, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.25 µm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.10 µm or less measured with a laser microscope, wherein the copper foil has a layer structure after heating at 200°C for 30 minutes or after heating at 130°C for 30 minutes or after heating at 300°C for 30 minutes.

Abstract translation: 本发明提供一种即使在高频电路基板中使用也能够良好地抑制电路形成性并且传输损失良好的铜箔及铜箔积层板。 使用激光显微镜测定的光泽面侧的铜箔的表面的表面粗糙度Ra为0.25μm以下，并且在光泽面上的铜箔表面的表面粗糙度Rz 其中铜箔在200℃下加热30分钟后或在130℃下加热30分钟后或在300℃下加热30分钟后具有层状结构，所述激光显微镜使用激光显微镜测量为1.10μm以下。

公开(公告)号：EP3199652A2

公开(公告)日：2017-08-02

申请号：EP17151569.5

申请日：2017-01-16

Applicant: JX Nippon Mining & Metals Corp.

Inventor： FUKUCHI, Ryo

IPC: C22C9/02

CPC classification number: H05K1/0237 ,  C22C9/00 ,  C22C9/02 ,  H01Q1/38 ,  H05K1/0313 ,  H05K1/09 ,  H05K3/022 ,  H05K3/06 ,  H05K3/202 ,  H05K3/389 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0307

Abstract: To provide a copper foil and a copper-clad laminate board that have a good circuit formability and have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board. A copper foil comprising a gloss face, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.25 µm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.10 µm or less measured with a laser microscope, wherein the copper foil has a layer structure after heating at 200°C for 30 minutes or after heating at 130°C for 30 minutes or after heating at 300°C for 30 minutes.