公开(公告)号：EP1840081A2

公开(公告)日：2007-10-03

申请号：EP07006353.2

申请日：2007-03-28

申请人： Interuniversitair Microelektronica Centrum (IMEC) ,  Katholieke Universiteit Leuven (KUL)

发明人： Witvrouw, Ann ,  Hellin Rico, Raquel ,  Celis, Jean-Pierre

IPC分类号： B81C1/00

CPC分类号： B81C1/00293 ,  B81B2203/0109 ,  B81B2203/0315 ,  B81C2201/0107 ,  B81C2203/0136 ,  B81C2203/0145 ,  Y10T428/249953

摘要： A method is provided for forming hermetically sealed cavities (20), e.g. semiconductor cavities comprising fragile devices, MEMS or NEMS devices (12). The method according to embodiments of the present invention allows forming hermetically sealed cavities (20) at a controlled atmosphere and pressure and at low temperatures, preferably at temperatures not exceeding 200°C. The method furthermore allows forming sealed cavities (20) with short release times, for example release times of a few minutes to 30 minutes. The method may for example be used for zero level packaging of MEMS or NEMS devices.

摘要翻译： 提供了一种用于形成密封腔（20）的方法，例如。 半导体腔包括易碎器件，MEMS或NEMS器件（12）。 根据本发明的实施例的方法允许在受控的气氛和压力和低温下，优选在不超过200℃的温度下形成气密密封腔（20）。 该方法还允许形成具有短释放时间的密封空腔（20），例如几分钟至30分钟的释放时间。 该方法可以例如用于MEMS或NEMS装置的零级封装。

公开(公告)号：EP1694597B1

公开(公告)日：2007-08-15

申请号：EP04805699.8

申请日：2004-12-14

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE

发明人： ROBERT, Philippe

IPC分类号： B81B7/00 ,  G01P1/02

CPC分类号： B81C1/00293 ,  B81C2203/0145 ,  G01P1/023

公开(公告)号：EP1747169A1

公开(公告)日：2007-01-31

申请号：EP05769285.7

申请日：2005-05-03

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE

发明人： BLANC, Henri ,  CAPLET, Stéphane

IPC分类号： B81B7/00 ,  H01L23/18

CPC分类号： B81C1/00293 ,  B81C2203/0145 ,  H01L21/67138 ,  H01L24/85 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The inventive method for closing a vent (9) formed in a microstructure (3) wall (10) under a controlled atmosphere is carried out by an ultrasonic bonding machine comprising a welding electrode (14), a metal wire (13) crossing the electrode (14) and a working table (15). A ball (12) is formed by melting on the end part of the metal wire (13) and is deposited on the end of the vent (9) and a holding plug (11) and is subsequently exposed to compression forces (F) and ultrasonic vibration (Fus) by the electrode (14) in a controlled atmosphere chamber (17).

公开(公告)号：EP1697255A1

公开(公告)日：2006-09-06

申请号：EP04805944.8

申请日：2004-12-06

申请人： CAVENDISH KINETICS LIMITED

发明人： WILLEM, Matthijs, Heuvelman

IPC分类号： B81B7/00 ,  B81B3/00

CPC分类号： B81C1/00301 ,  B81B2207/015 ,  B81B2207/096 ,  B81C2203/0145 ,  H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of enclosing a micromechanical element formed between a base layer and one or more metallization layers includes forming one or more encapsulating layers over the micromechanical element and providing an encapsulating wall surrounding the element extending between the base layer and the one or more encapsulating layers. An electrical connection is provided between the base layers and the one or more metallization layers formed above the micromechanical element.

公开(公告)号：EP1640334A2

公开(公告)日：2006-03-29

申请号：EP05255976.2

申请日：2005-09-26

申请人： STMicroelectronics, Inc.

发明人： Chiu, Anthony M. ,  Siegel, Harry Michael

IPC分类号： B81B7/00

CPC分类号： B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0163

摘要： An integrated lid for micro-electro-mechanical system (MEMS) devices is formed from a nitride layer deposited over a cavity containing movable parts for the device. Pillars are formed through openings within large area movable parts to support the lid over those parts. Slides are formed and moved under large etchant openings through the lid to allow the openings to be sealed by sputtering.

摘要翻译： 用于微机电系统（MEMS）器件的集成盖由淀积在包含用于器件的可移动部件的腔体上的氮化物层形成。 支柱通过大面积可移动部件内的开口形成，以支撑盖在这些部件上方。 形成滑块并在大的蚀刻剂开口下移动通过盖子以允许通过溅射密封开口。

公开(公告)号：EP1296886A2

公开(公告)日：2003-04-02

申请号：EP01921222.4

申请日：2001-03-21

申请人： ROBERT BOSCH GMBH

发明人： LUTZ, Markus

IPC分类号： B81B1/00

CPC分类号： B81C1/00293 ,  B81C2203/0136 ,  B81C2203/0145 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/125 ,  Y10T29/49007

摘要： The invention relates to a micromechanical component that comprises a substrate (1); a movable sensor structure (6) in a first micromechanical functional layer (5) disposed above said substrate; a first closing layer (8) on the first micromechanical functional layer (5), which is at least partially structured; a second micromechanical functional layer (10) on the first closing layer (8), which has at least one covering function and which is at least partially anchored in the first micromechanical functional layer (5); and a second closing layer (8) on the second micromechanical functional layer (10). The sensor structure (6) is provided with trenches (7) the width of which is not larger than a maximum trench width (66) that can be closed by the first closing layer (8) in the form of plugs (9) that do not reach the trench bottoms.

公开(公告)号：EP2327658B1

公开(公告)日：2018-07-04

申请号：EP09177497.6

申请日：2009-11-30

申请人： IMEC VZW

发明人： Witvrouw, Ann ,  Haspeslagh, Luc ,  Claes, Gert

IPC分类号： B81C1/00

CPC分类号： B81C1/00293 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81B2207/015 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0735 ,  B81C2203/0771

摘要： A method is disclosed for manufacturing a sealed cavity comprised in a microelectronic device, comprising forming a sacrificial layer at least at locations where the cavity is to be provided, depositing a membrane layer on top of the sacrificial layer, patterning the membrane layer in at least two separate membrane layer blocks, removing the sacrificial laye through the membrane layer, and sealing the cavity by sealing the membrane layer, wherein patterning the membrane layer is performed after removal of the sacrificial layer; and associated microelectronic devices.

公开(公告)号：EP1572575B1

公开(公告)日：2018-01-10

申请号：EP03810000.4

申请日：2003-12-18

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives

发明人： DIEM, Bernard ,  DELAPIERRE, Gilles

IPC分类号： B81B7/00

CPC分类号： B81B7/007 ,  B81C2203/0145

公开(公告)号：EP2470938B1

公开(公告)日：2017-09-27

申请号：EP10747775.4

申请日：2010-08-24

申请人： Cavendish Kinetics Inc.

发明人： SMITH, Charles, Gordon ,  KNIPE, Richard, L.

IPC分类号： G02B26/00

CPC分类号： G02B26/0833 ,  B81B2201/042 ,  B81C1/00317 ,  B81C2203/0136 ,  B81C2203/0145 ,  G02B26/0841

公开(公告)号：EP3077325A1

公开(公告)日：2016-10-12

申请号：EP13852336.0

申请日：2013-12-06

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives ,  Epcos AG

发明人： SAINT-PATRICE, Damien ,  DEN DEKKER, Arnoldus ,  GIESEN, Marcel ,  GRECO, Florent ,  HENN, Gudrun ,  PORNIN, Jean-Louis ,  REIG, Bruno

IPC分类号： B81C1/00

CPC分类号： B81C1/00277 ,  B81B7/0035 ,  B81C1/00293 ,  B81C2203/0145

摘要： A method for packaging a microelectronic device in an hermetically sealed cavity and managing an atmosphere of the cavity with a dedicated hole, including making said cavity between a support and a cap layer such that a sacrificial material and the device are arranged in the cavity; removing the sacrificial material through at least one release hole, and hermetically sealing the release hole; making a portion of wettable material on the cap layer, around a blind hole or a part of said outside surface corresponding to a location of said dedicated hole; making a portion of fuse material on the portion of wettable material; making the dedicated hole by etching the cap layer; and reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole.