摘要:
To prevent a semiconductor device from breaking down due to a surge voltage which is generated by the existence of floating inductance in a terminal conductor drawn out from the connection of two semiconductor elements contained in one semiconductor container and which is applied to one of the elements when they are turned off, the invention provides a semiconductor device in which two pairs of a first and a second pair of electrode conductors each consists of a pair of a first electrode conductor onto which semiconductor elements with main electrodes are fixed on its bottom surface and a second electrode conductor connected to the main electrodes on the upper surface on the semiconductor elements by connecting leads are fixed on the bottom plate of a container via insulating plates, one main terminal conductor connected to the first electrode conductor of the first pair and another main terminal conductor connected to the second electrode conductor of the second pair are both drawn out externally, and one intermediate terminal conductor is connected to both the second electrode conductor of the first pair and the first electrode conductor of the second pair and drawn out externally wherein connecting conductor with a lower floating inductance and a higher resistance than in the part of the intermediate terminal conductor between the second electrode conductor of the first pair and the first electrode conductor of the second pair is connected across both electrode conductors in parallel to the intermediate terminal conductor. When semiconductor elements are connected to the respective semiconductor elements in parallel, the connecting conductors are installed at locations close to each semiconductor element of the electrode conductors.
摘要:
To solve the problem that very little heat is dissipated from the surface, the capacity is restricted, and the inductance is high when electrodes on the surface of many semiconductor elements contained in one container with the terminal conductors are connected by wire bonding, the invention provides a semiconductor device (1) wherein a current flowing and heat-dissipating path is formed by contacting bodies (2,5) that make contact with the electrodes (11,12) on the surface of the semiconductor elements and the spring via a spring (6) that makes contact with the inner face of the terminal body (7), which has one face exposed to the outside, or a heat dissipating path is formed by contacting bodies, the pressurising body being coupled with the contacting body via the electrically conductive plate, and the spring, and a current flowing path is formed by connecting an electrically conductive plate with the terminal body. This construction allows the module to be cooled from both sides of the container, and allows the inductance to be reduced.
摘要:
Devices for interactive communication of voice, control and data in a multifunction communication access system, including cellular telephones (401, 407) with enhanced capabilities, to enable more flexible communications, including control interfacing. These systems and devices also have the ability to employ alphanumeric data entry and transmission for a wide variety of applications and to interface with multiple communications networks (405, 406, 411). The system includes a stationary network and mobile units. The mobile units can include low power and high power components. The low power components are normally active, while the high power components are active only upon initiation by specific signals within the system. The mobile devices can be programmed remotely throughout the system through entry of control or programming signals from alphanumeric input devices.