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公开(公告)号：EP1577658A1
公开(公告)日：2005-09-21
申请号：EP03782861.3
申请日：2003-12-19
发明人： UEDA, Yasuhiro , ADACHI, Minoru
IPC分类号： G01N1/00
CPC分类号： B01L3/0241 , B01L2200/0647 , B01L2400/0415 , B01L2400/0496 , B03C5/028 , G01N2001/4038 , G01N2035/1041
摘要： The present invention provides a method and a device for discharging a liquid specimen capable of controlling the sizes of substances in the liquid specimen. The device of the present invention includes a cylinder having a discharge port for a liquid specimen and a supply port for the liquid specimen and discharging means for discharging the liquid specimen, and a means for generating a non-uniform electric field in an internal space of the cylinder is provided in the cylinder. Using this device for discharging a liquid specimen, the sizes of the target substances in the liquid specimen to be discharged can be controlled by discharging the liquid specimen while generating an appropriate non-uniform electric field in the internal space of the cylinder.
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公开(公告)号：EP2077395A1
公开(公告)日：2009-07-08
申请号：EP06822368.4
申请日：2006-10-26
IPC分类号： F04B43/04
CPC分类号： F04B43/04
摘要： Provided is a droplet ejecting apparatus by which durability of a portion driven by a piezoelectric element and productivity can be improved. The droplet ejecting apparatus is provided with a pressurizing chamber (42) communicating with a nozzle (41); a vibrating membrane (32) forming a part of the pressurizing chamber (42); a piezoelectric element for vibrating the vibrating membrane (32); a protruding section (31) provided on the vibrating membrane (32) by being connected to the piezoelectric element, for transmitting vibration to the vibrating membrane (32), and a flow channel (35) communicating with the pressurizing chamber (42). The droplet ejecting apparatus ejects a droplet from the nozzle (41). At least a base portion in the vicinity of the vibrating membrane (32) on the protruding section (31) is an expanding section whose cross-sectional area increases toward the vibrating membrane. An angle formed by the vibrating membrane (32) and a side wall (31b) of the expanding section is obtuse and/or a boundary section between the vibrating membrane (32) and the side wall (31b) is rounded (R1).
摘要翻译： 本发明提供一种能够提高由压电元件驱动的部分的耐久性和生产性的液滴喷射装置。 液滴喷射装置具有与喷嘴（41）连通的加压室（42） 形成加压室（42）的一部分的振动膜（32）; 振动振动膜（32）的压电元件; 通过与压电元件连接而设置在振动膜32上并向振动膜32传递振动的突出部31以及与加压室42连通的流路35。 液滴喷射装置从喷嘴（41）喷射液滴。 突出部（31）上的振动膜（32）附近的至少基部是朝向振动膜的截面积增大的扩展部。 振动膜（32）与扩张部分的侧壁（31b）所成的角度是钝角，和/或振动膜（32）与侧壁（31b）之间的边界部分被倒圆（R1）。
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3.发明公开PROCESS FOR PRODUCING WIRING BOARD, AND WIRING BOARD 审中-公开VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE UND LEITERPLATTE
公开(公告)号：EP1863327A1
公开(公告)日：2007-12-05
申请号：EP05766427.8
申请日：2005-07-21
发明人： FUJIMOTO, Takayoshi, Cluster Technology Co., Ltd. , KITAOKA, Kenji, Cluster Technology Co., Ltd.
CPC分类号： H05K3/4007 , H05K1/0284 , H05K3/107 , H05K3/1258 , H05K3/182 , H05K3/246 , H05K3/3436 , H05K3/4614 , H05K2201/0347 , H05K2201/0367 , H05K2201/0373 , H05K2201/09036 , H05K2201/09045 , H05K2201/09472 , H05K2203/0709 , H05K2203/1173 , H05K2203/1189 , H05K2203/1476 , Y10T29/49155 , Y10T29/49165
摘要： A wiring circuit board and a method of producing the same are provided in which a desired pattern of wiring is provided at higher density while permitting no overflow from the grooves of an electroless plating catalyst containing solution and an electric conductor forming liquid such as silver ink.
The pattern of electric conductor is deposited by applying the electric conductor forming liquid into the grooves provided in a substrate and distributing the same along the grooves with the action of capillarity. The method starts with patterning the grooves in the surface of the substrate (S1), applying the electric conductor forming liquid into the grooves (S2), and coating the surface of the substrate with a layer of repellent liquid which is lower in the affinity with the electric conductor forming liquid (S3). This is followed by cleaning at least the grooves (S4) and then filling the grooves with the electric conductor forming liquid once again (S5). The electric conductor forming liquid applied into the grooves is then distributed throughout the grooves by the action of capillarity. When silver ink is used, the pattern of electric conductor is produced by repeating an action of applying and drying a number of times. Alternatively, the patter of electric conductor can be produced by an electroless plating technique or a combination of an electroless plating technique and an electro-plating technique for separating an electrical conductive material form the electric conductor forming liquid.摘要翻译： 提供了一种布线电路板及其制造方法，其中以更高的密度提供所需的布线图形，同时不会从含化学镀电镀催化剂溶液的槽和诸如银墨的电导体形成液体的槽中溢出。 通过将导电剂形成液体施加到设置在基板中的凹槽中并通过毛细管作用沿着凹槽分布而将电导体的图案沉积。 该方法开始于图案化基板表面上的凹槽（S1），将导电剂形成液体施加到凹槽（S2）中，并且用一层与亲水性相差较小的驱避液体涂覆基板的表面， 导电体形成液体（S3）。 然后，至少清洗槽（S4），然后再次用导电体形成液填充槽（S5）。 然后通过毛细作用的作用将施加到槽中的电导体成形液分布在整个凹槽中。 当使用银墨时，通过重复施加和干燥多次的动作来产生电导体的图案。 或者，电导体的图案可以通过化学镀技术或化学镀技术和用于从形成电导体的液体分离导电材料的电镀技术的组合来制造。
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公开(公告)号：EP1310348A1
公开(公告)日：2003-05-14
申请号：EP01945768.8
申请日：2001-07-02
发明人： ADACHI, Minoru , UESUGI, Shoji
CPC分类号： C04B35/52 , B29C45/006 , B29C65/08 , B29C66/54 , B29C2045/0063 , B29L2031/767 , B41J2/16 , B41J2/1623 , B41J2/1637 , C04B2235/48 , C04B2235/602 , C04B2235/77
摘要： The present invention provides a method that allows ultra-precisely bonding by which a complete sealingly bonded molded article can be produced in a simple manner. This method includes (1) fixing an injection molded article (a) at a position (predetermined bonding position) formed with a mold; (2) mounting and moving a molded article (b) to be bonded to the injection molded article (a) to the predetermined bonding position within the mold; (3) positioning the molded article (b) at the predetermined bonding position ; and (4) closing the mold for bonding.
摘要翻译： 本发明提供一种能够以简单的方式制造完全密封结合的成型体的超精密结合的方法。 该方法包括：（1）将注射成型品（a）固定在由模具形成的位置（预定的接合位置）; （2）将与注射成型体（a）接合的成型体（b）安装移动到模具内的规定的接合位置; （3）将模制品（b）定位在预定的粘结位置; 和（4）关闭用于粘合的模具。
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5.发明公开MOLDING RESIN COMPOSITION AND METHOD OF MOLDING 有权GEFORMTE STRUKTUR MIT EINER MIKROSKOPISCHEN STRUKTUR联合王国ZU DEREN HERSTELLUNG
公开(公告)号：EP1300446A1
公开(公告)日：2003-04-09
申请号：EP01945769.6
申请日：2001-07-02
IPC分类号： C08L101/00 , C08K5/00 , B29C45/00 , B41J2/16
CPC分类号： B41J2/1637 , B29C45/0013 , B29C45/2628 , B41J2/16 , B41J2/1634 , B41J2002/14387 , C08L63/00 , C08L101/00 , C08L61/20 , C08L2666/14
摘要： The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin is a thermosetting resin composition comprising 95 to 35 wt% of a thermosetting resin and 5 to 65 wt% of organic filler having a particle size of 10 µm or less. From such a resin, an ink ejecting apparatus having a microscopic structure, for example, a nozzle of a diameter of 30 µm, is integrally molded.
摘要翻译： 本发明提供一种适于成型具有小固化收缩率，良好的模具转印性能以及用于诸如抛光加工和激光加工的后处理的优异性能的微结构的树脂组合物。 这种树脂是包含95〜35重量％的热固性树脂和5〜65重量％的粒径为10μm以下的有机填料的热固性树脂组合物。 通过这种树脂，将具有微观结构的喷墨装置，例如直径为30μm的喷嘴整体模制。
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6.发明公开DROPLET EJECTING APPARATUS AND METHOD FOR MANUFACTURING THE SAME 审中-公开TRÖPFCHENAUSSTOSSVORRICHTUNG以下地区ZUR HERSTELLUNG DERSELBEN
公开(公告)号：EP2077394A1
公开(公告)日：2009-07-08
申请号：EP06822363.5
申请日：2006-10-26
IPC分类号： F04B43/04
CPC分类号： F04B43/04
摘要： Provided is an efficient droplet ejecting apparatus, which has high assembly accuracy even with a simple structure and simple assembly steps and transmits expansion and contraction of a piezoelectric element to a protruding section. A method for manufacturing such droplet ejecting apparatus is also provided. The droplet ejecting apparatus is provided with a pressurizing chamber communicating with a nozzle (41); a vibrating membrane forming a part of the pressurizing chamber; a piezoelectric element (10) for vibrating the vibrating membrane; a protruding section provided on the vibrating membrane by being connected to the piezoelectric element (10), for transmitting vibration to the vibrating membrane; and a bracket (20). The droplet ejecting apparatus ejects a droplet from the nozzle (41). A member provided with the pressurizing chamber, the vibrating membrane and the protruding section can be fixed to the bracket (20). The bracket (20) is provided with a groove section between a releasing section and the protruding section, for guiding the bar-shaped piezoelectric element (10). The piezoelectric element (10) is adhered in the groove section.
摘要翻译： 提供了一种有效的液滴喷射装置，其即使具有简单的结构和简单的组装步骤也具有高的组装精度，并且将压电元件的膨胀和收缩传递到突出部分。 还提供了制造这种液滴喷射装置的方法。 液滴喷射装置设有与喷嘴（41）连通的加压室; 形成加压室的一部分的振动膜; 用于振动所述振动膜的压电元件（10）; 突出部，其通过与所述压电元件连接而设置在所述振动膜上，用于将振动传递到所述振动膜; 和支架（20）。 液滴喷射装置从喷嘴（41）喷射液滴。 设置有加压室，振动膜和突出部的构件可以固定到支架（20）。 托架（20）在释放部分和突出部分之间设置有用于引导棒状压电元件（10）的槽部。 压电元件（10）粘附在凹槽部分中。
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7.发明授权MOULDED STRUCTURE HAVING A MICROSCOPIC STRUCTURE AND METHOD OF MOLDING SUCH STRUCTURE 有权根据上述制造量子微观结构及形态方法形结构
公开(公告)号：EP1300446B1
公开(公告)日：2011-11-30
申请号：EP01945769.6
申请日：2001-07-02
IPC分类号： C08L101/00 , C08K5/00 , B29C45/00 , B41J2/16 , C08K5/3492
CPC分类号： B41J2/1637 , B29C45/0013 , B29C45/2628 , B41J2/16 , B41J2/1634 , B41J2002/14387 , C08L63/00 , C08L101/00 , C08L61/20 , C08L2666/14
摘要： A resin composition which is suitable for producing a molding of a fine structure, reduced in molding shrinkage, satisfactory in mold shape transfer, and excellent in suitability for post-processing such as polishing and laser processing. It is a thermosetting resin composition comprising 95 to 35 wt.% thermosetting resin and 5 to 65 wt.% organic filler having a particle diameter of 10 νm or smaller. From this composition, an ink ejection device for ink-jet printers which has a fine structure, for example, a nozzle having a diameter of 30 νm, is integrally molded.
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公开(公告)号：EP1300446A4
公开(公告)日：2009-04-29
申请号：EP01945769
申请日：2001-07-02
发明人： ADACHI MINORU , UESUGI SHOJI
IPC分类号： C08L101/00 , B29C45/00 , B29C45/26 , B41J2/16 , C08K5/00 , C08K5/3492
CPC分类号： B41J2/1637 , B29C45/0013 , B29C45/2628 , B41J2/16 , B41J2/1634 , B41J2002/14387 , C08L63/00 , C08L101/00 , C08L61/20 , C08L2666/14
摘要： A resin composition which is suitable for producing a molding of a fine structure, reduced in molding shrinkage, satisfactory in mold shape transfer, and excellent in suitability for post-processing such as polishing and laser processing. It is a thermosetting resin composition comprising 95 to 35 wt.% thermosetting resin and 5 to 65 wt.% organic filler having a particle diameter of 10 νm or smaller. From this composition, an ink ejection device for ink-jet printers which has a fine structure, for example, a nozzle having a diameter of 30 νm, is integrally molded.
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公开(公告)号：EP1310348A4
公开(公告)日：2006-04-12
申请号：EP01945768
申请日：2001-07-02
发明人： ADACHI MINORU , UESUGI SHOJI
CPC分类号： C04B35/52 , B29C45/006 , B29C65/08 , B29C66/54 , B29C2045/0063 , B29L2031/767 , B41J2/16 , B41J2/1623 , B41J2/1637 , C04B2235/48 , C04B2235/602 , C04B2235/77
摘要： The present invention provides a method that allows ultra-precisely bonding by which a complete sealingly bonded molded article can be produced in a simple manner. This method includes (1) fixing an injection molded article (a) at a position (predetermined bonding position) formed with a mold; (2) mounting and moving a molded article (b) to be bonded to the injection molded article (a) to the predetermined bonding position within the mold; (3) positioning the molded article (b) at the predetermined bonding position ; and (4) closing the mold for bonding.
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