摘要:
[Problem to Be Solved] To provide a plane heater including a carbon wire heating element which has an arrangement pattern allowing a heating surface to be a substantially uniform heating temperature plane. [Means to Solve Problem] Surface arrangement densities of a carbon wire heating element CW are different in an inner area and an outer area located in the periphery. The surface arrangement density in the above-mentioned outer area is denser than the surface arrangement density in the inner area. A power supply terminal unit 8 having connection wires for supplying electricity to the above-mentioned heating element CW is arranged in the center on the back side of the above-mentioned silica glass plate-like member 2. The connection wires 4a and 4b connected with the carbon wire heating element in the above-mentioned inner area are connected with the carbon wire heating element CW in the inner area in the center of the above-mentioned silica glass plate-like member. The connection wires 3a and 3b connected with the carbon wire heating element in the above-mentioned outer area are extended from the center of the above-mentioned silica glass plate-like member toward the outer area, and are connected with the carbon wire heating element CW in the outer area, without intersecting the carbon wire heating element CW in the above-mentioned inner area.
摘要:
According to a producing method including; preparing a foaming slurry by agitating and blending a dispersion medium containing hollow glass or ceramic particles having an average particle diameter of 1 µm or more, a dispersant and a foaming agent to foam; obtaining a dried body by dropping the foaming slurry in liquid nitrogen, followed by freeze drying in a vacuum; and sintering the dried body to obtain a spherical porous body having open pores interconnected over an entirety, a porous body that is highly communicative, has sufficient mechanical strength and is suitable as a cell culture carrier for microcarrier culture can be provided.
摘要:
A nitride semiconductor substrate is provided which is suitable for a high withstand voltage power device and prevents a warp and a crack from generating in a Si substrate when forming a thick nitride semiconductor layer on the substrate. A nitride semiconductor substrate 1 is prepared in such a manner that a buffer layer 3 and a semiconductor active layer 4 each comprising a group 13 nitride are stacked one by one on one principal plane of a Si single crystal substrate, the one principal plane has an offset angle of 0.1° to 1° or -1° to -0.1° with respect to a (111) plane, an average dopant concentration in a bulk is 1×10 18 to 1×10 21 cm -3 , the Si single crystal substrate 2 has a SiO 2 film on the back, and the total thickness of the buffer layer 3 and the semiconductor active layer 4 is 4 to 10 µm.
摘要翻译:提供一种氮化物半导体衬底,其适用于高耐压功率器件,并且在衬底上形成厚的氮化物半导体层时,可防止在Si衬底中产生翘曲和裂纹。 以这样的方式制备氮化物半导体衬底1,即,在Si单晶衬底的一个主平面上逐层堆叠各自包含13族氮化物的缓冲层3和半导体活性层4,一个主平面具有 偏移角相对于(111)面为0.1°至1°或-1°至-0.1°,主体中的平均掺杂剂浓度为1×10 18至1×10 21 cm -3,Si单晶 基板2在背面具有SiO 2膜,缓冲层3和半导体活性层4的总厚度为4〜10μm。
摘要:
Acarbon-fiber-reinforcedsilicon-carbide-basedcomposite material which has better strength and toughness, and a braking material, such as a brake disc using the composite material, are provided. By using the carbon-fiber-reinforced silicon-carbide-based composite material including a bundle of fibers having chopped carbon fibers arranged in parallel and the other carbon component, carbon, silicon, and silicon carbide, in which the fiber bundle is flat, its cross-section perpendicular to its longitudinal direction has a larger diameter of 1 mm or more, a ratio of the larger diameter to a smaller diameter is from 1. 5 to 5, and a plurality of the fiber bundles are randomly oriented substantially along a two-dimensional plane, and a two-dimensional side serves as a braking side to thereby constitute the braking material.
摘要:
There is provided a vertical wafer boat by which the purifying efficiency of a purifying process is improved and which has wafer support portions the length of which is increased. A top plate 7 has an opening 7a formed using the center point of a wafer W to be mounted as its center and a slit portion 7b communicating with the opening 7 and formed to the insertion side of the wafer, the slit 7 has a width T which is 35% or more to 45% or less of the width φD of the top plate 7, further, upper surface corners 2a1 3a1, 4a1, and 5a1 are chamfered up to the position of 40% or more to 60% or less of the length of wafer support portions 2a, 3a, 4a, and 5a from the extreme ends of the wafer support portions 2a, 3a, 4a, and 5a toward direction of the support columns 2b, 3b, 4b, and 5b as well as the upper surface corners 2a2, 3a2, 4a2, and 5a2 from the position at which the chamfering is ended to the support columns 2b, 3b, 4b, and 5b is formed at an angle of 90° or less.
摘要:
The crucible for melting silicon according to the present invention is a crucible for melting silicon including a crucible main body including a heat-resistant member, and a protective film formed at least on an inner surface of the crucible main body, in which the protective film has a composition of SiO X N Y in which X > 0 and Y > 0. The crucible for melting silicon according to the present invention has excellent releasability to a silicon block, reduces the amount of impurities dissolved in a silicon melt, and can be produced at low cost. Furthermore, the present invention provides a release agent for use in the production of the crucible for melting silicon.
摘要:
The crucible for melting silicon according to the present invention is a crucible for melting silicon including a crucible main body including a heat-resistant member, and a protective film formed at least on an inner surface of the crucible main body, in which the protective film has a composition of SiO X N Y in which X > 0 and Y > 0. The crucible for melting silicon according to the present invention has excellent releasability to a silicon block, reduces the amount of impurities dissolved in a silicon melt, and can be produced at low cost. Furthermore, the present invention provides a release agent for use in the production of the crucible for melting silicon.