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11 条记录 (耗时 0.015 秒)

    OPTICAL CIRCUIT
    1.
    发明公开
    OPTICAL CIRCUIT 有权
    光学电路

    公开(公告)号：EP2980618A1

    公开(公告)日：2016-02-03

    申请号：EP14773895.9

    申请日：2014-03-19

    申请人： Photonics Electronics Technology Research Association

    发明人： YASHIKI, Kenichiro ,  TOKUSHIMA, Masatoshi

    IPC分类号： G02B6/122 ,  G02B6/30

    CPC分类号： G02B6/4207 ,  G02B6/12004 ,  G02B6/125 ,  G02B6/28 ,  G02B6/305 ,  G02B6/34 ,  G02B2006/12123 ,  G02B2006/12142 ,  H01S5/0064 ,  H01S5/0085

    摘要： An optical circuit, wherein the effects of reflected light generated by an optical component are reduced. The optical circuit (100) is provided with an optical branching (110) for branching light, an optical coupler (114) for coupling a first portion of branched light to an optical waveguide (118) for transmission, and an optical reflecting unit (116) for reflecting a second portion of the branched light, the phase difference between the reflected light from the optical coupler (114) and the reflected light from the optical reflecting unit (116) being (2m - 1)n (where m is an integer) on an input side of the optical branching (110).

    摘要翻译： 一种光学电路，其中由光学部件产生的反射光的影响减小。 光电路（100）具备：分支光的光分路器（110）;将分支光的第一部分耦合到光波导（118）进行传输的光耦合器（114）;以及光反射单元（116） ）用于反射分支光的第二部分，来自光耦合器（114）的反射光和来自光学反射单元（116）的反射光之间的相位差是（2m-1）n（其中m是整数 ）在光分路（110）的输入侧上。

    OPTICAL RECEIVING CIRCUIT AND METHOD FOR MANUFACTURING SAME
    3.
    发明公开
    OPTICAL RECEIVING CIRCUIT AND METHOD FOR MANUFACTURING SAME 审中-公开
    德国VERFAHREN ZURHERSTELLUNG DAVON的OPTISCHE EMPFANGSSCHALTUNG

    公开(公告)号：EP3054489A1

    公开(公告)日：2016-08-10

    申请号：EP14850881.5

    申请日：2014-10-01

    申请人： Photonics Electronics Technology Research Association

    发明人： SUZUKI, Yasuyuki ,  OKAMOTO, Daisuke

    IPC分类号： H01L31/10 ,  H03F3/08 ,  H04B10/60

    CPC分类号： G01J1/44 ,  G01J2001/446 ,  H01L21/02164 ,  H01L21/768 ,  H01L27/1443 ,  H01L31/02005 ,  H01L31/028 ,  H01L31/1808 ,  H03F1/083 ,  H03F3/08 ,  H04B10/60 ,  H04B10/693

    摘要： An optical receiving circuit which suppresses a characteristic deterioration due to a wiring between a PD and a TIA and a method for manufacturing the optical receiving circuit are provided. A optical receiving circuit (300) comprises a photodiode (302), and a transimpedance amplifier (308) that supplies an electrical power source to the photodiode (302). The characteristic impedance of a wiring between the anode of the photodiode (302) and the transimpedance amplifier (308) is higher than the characteristic impedance of a wiring between the cathode of the photodiode (302) and the transimpedance amplifier (308).

    摘要翻译： 提供抑制由于PD与TIA之间的布线导致的特性恶化的光接收电路以及光接收电路的制造方法。 光接收电路（300）包括光电二极管（302）和向光电二极管（302）提供电源的跨阻放大器（308）。 光电二极管（302）的阳极和跨阻放大器（308）之间的布线的特性阻抗高于光电二极管（302）的阴极与跨阻放大器（308）之间的布线的特性阻抗。

    OPTICAL END COUPLING TYPE SILICON OPTICAL INTEGRATED CIRCUIT
    4.
    发明公开
    OPTICAL END COUPLING TYPE SILICON OPTICAL INTEGRATED CIRCUIT 审中-公开
    光学端耦合型硅集成光学电路

    公开(公告)号：EP2980617A1

    公开(公告)日：2016-02-03

    申请号：EP14773100.4

    申请日：2014-03-20

    申请人： Photonics Electronics Technology Research Association

    发明人： TAKAHASHI, Shigeki ,  FUJIKATA, Junichi

    IPC分类号： G02B6/122

    CPC分类号： G02B6/1228 ,  G02B6/122 ,  G02B6/14 ,  G02B6/2813 ,  G02B6/305

    摘要： An optical end coupling type silicon optical integrated circuit is provided using an SOI substrate. This optical integrated circuit is constituted so as to connect with an external optical circuit at an end coupling part and have signal light incident to an optical circuit that includes a curved part. In the plane of the optical integrated circuit, the position of one end coupling part selected from among any thereof and the position of any multimode optical waveguide element to which a respective optical waveguide is connected via a respective curved part satisfy a positional relationship defined on the basis of a beam divergence angle [theta] of stray light.

    摘要翻译： 使用SOI衬底提供光学端耦合型硅光学集成电路。 该光集成电路构成为与端部耦合部分处的外部光路连接，并且使信号光入射到包括弯曲部分的光路。 在光集成电路的平面中，从其中任何一个中选择的一端耦合部分的位置和各个光波导通过各个弯曲部分连接到的任何多模光波导元件的位置满足在 杂散光的光束发散角θ的基础。

    Electro-optical modulator
    5.
    发明公开
    Electro-optical modulator 审中-公开
    电光调制器

    公开(公告)号：EP2908169A1

    公开(公告)日：2015-08-19

    申请号：EP14160548.5

    申请日：2014-03-18

    申请人： National Institute of Advanced Industrial Science and Technology ,  Photonics Electronics Technology Research Association

    发明人： KAMEI, Toshihiro ,  TAKEI, Ryohei ,  MORI, Masahiko ,  SAKAKIBARA, Youichi ,  FUJIKATA, Junichi

    IPC分类号： G02F1/025

    CPC分类号： G02F1/025 ,  G02F2001/0151 ,  G02F2202/103 ,  G02F2202/105

    摘要： An object of the present invention is to provide an electro-optical modulator that allows high-speed carrier injection into a silicon-containing i-type amorphous semiconductor, particularly a-Si:H, and has little optical loss.
    An electro-optical modulator comprises: a substrate 201; an optical waveguide comprising a silicon-containing i-type amorphous semiconductor 204 formed on the substrate; and a silicon-containing p-type semiconductor layer 203 and a silicon-containing n-type semiconductor layer 205 arranged apart from each other with the silicon-containing optical waveguide comprising an i-type amorphous semiconductor 204 interposed therebetween and constituting optical waveguides together with the silicon-containing optical waveguide comprising an i-type amorphous semiconductor. The silicon-containing p-type semiconductor layer 203 and/or silicon-containing n-type semiconductor layer 205 are a crystalline semiconductor layer.

    摘要翻译： 本发明的一个目的是提供一种允许高速载流子注入到含硅i型非晶半导体，特别是a-Si：H中，并且光损失很小的电光调制器。 一种电光调制器包括：衬底201; 包含在基板上形成的含硅i型非晶半导体204的光波导， 以及含硅光波导，该硅基p型半导体层203和含硅n型半导体层205彼此分离地设置，该含硅光波导包括插入在其间的i型非晶半导体204，并且构成光波导以及 该含硅光波导包括i型非晶半导体。 含硅的p型半导体层203和/或含硅的n型半导体层205是结晶半导体层。

    PAD-ARRAY STRUCTURE ON SUBSTRATE FOR MOUNTING IC CHIP ON SUBSTRATE, AND OPTICAL MODULE HAVING SAID PAD-ARRAY STRUCTURE
    7.
    发明公开
    PAD-ARRAY STRUCTURE ON SUBSTRATE FOR MOUNTING IC CHIP ON SUBSTRATE, AND OPTICAL MODULE HAVING SAID PAD-ARRAY STRUCTURE 有权
    PAD阵列结构上安装IC芯片上的基板，以及光学模块，该焊盘阵列结构的基底

    公开(公告)号：EP3125285A1

    公开(公告)日：2017-02-01

    申请号：EP15769376.3

    申请日：2015-03-18

    申请人： Photonics Electronics Technology Research Association

    发明人： AKAGAWA, Takeshi ,  YASHIKI, Kenichiro

    IPC分类号： H01L23/12 ,  H05K1/02 ,  H05K3/34

    CPC分类号： H05K1/111 ,  G02B6/122 ,  G02B6/4232 ,  H01L23/49844 ,  H01L2224/16225 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/181 ,  H05K3/4688 ,  H05K2201/10121 ,  H05K2201/10734 ,  Y02P70/611

    摘要： A pad-array arrangement structure on a substrate for mounting an IC chip on the substrate, wherein a structure with which it is possible to maximally avoid an increase in the number of wiring layers on the substrate is obtained by devising the pad arrangement in an IC pad-array region.
    A embodiment of the present invention provides a pad-array structure on a substrate for mounting an IC chip on the substrate. The present invention is characterized in that: a plurality of ground pads arrayed equidistantly in a first row, and a plurality of signal pads arrayed equidistantly in a second row on the inside of and parallel to the first row, are provided on a first circumferential edge in the pad-array region; each of the signal pads passes between two adjacent ground pads in the first row and is connected to an external circuit on the substrate; and electrical signals are input to and output from the external circuit.

    摘要翻译： 上的基片A垫阵列布置结构，用于安装在基底上的IC芯片，worin的结构与它能够最大限度地避免增加布线层的数目在基板是通过在IC制定的焊盘布置在获得 垫阵列区域。 本发明的实施例提供用于在衬底上的IC芯片的安装在基片的焊盘阵列结构。 本发明的特征在于：被设置在第一周向边缘的在第一行等距离排列接地用焊盘多个，并且在第二行等距排列在内侧并平行于第一行的信号焊盘复数， 在焊盘阵列区域; 各信号焊盘的第一行中的两个相邻接地焊盘之间穿过，并在在基片上的外部电路连接到; 和电气信号被输入到和输出从外部电路。

    PHOTOELECTRIC HYBRID DEVICE AND METHOD FOR MANUFACTURING SAME
    8.
    发明公开
    PHOTOELECTRIC HYBRID DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
    VORFAHREN ZUR HERSTELLUNG DAVON FOTOELEKTRISCHE HYBRIDVORRICHTUNG

    公开(公告)号：EP2980619A1

    公开(公告)日：2016-02-03

    申请号：EP14775978.1

    申请日：2014-03-20

    申请人： Photonics Electronics Technology Research Association

    发明人： OGURA, Ichiro ,  TAKEMURA, Koichi ,  KURIHARA, Mitsuru ,  UEMURA, Toshinori ,  UKITA, Akio ,  KURATA, Kazuhiko

    IPC分类号： G02B6/122 ,  G02B6/13 ,  G02B6/42

    CPC分类号： G02B6/4251 ,  G02B6/12004 ,  G02B6/138 ,  G02B6/305 ,  G02B6/4207 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4248 ,  G02B6/425 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292

    摘要： In a photoelectric hybrid device, an optical connector is mounted on a flat optical surface provided on one end of vertical optical waveguides for inputting and outputting an optical signal, and along with making integration of the photoelectric hybrid device into an interposer or the like easy, integration is standardized. The photoelectric hybrid device is provided with: conductive pins (108) that are connected to an electric signal pathway for a photoelectric hybrid substrate; a translucent member (116) that has a flat optical surface and also has a translucent part (118); and a plurality of self organizing optical waveguides (122) that form an optical path between the translucent part (118) and an optical waveguide of the photoelectric hybrid substrate. The constitution is such that the position of the flat optical surface is not lower than the tops of the electrical connection parts (110) on the conductive pins (108); thereby, when an optical connector on which an optical waveguide that transmits an optical signal among the optical waveguides (122) is mounted on the flat optical surface, collision of the optical connector and the tops of the electrical connection parts can be avoided.

    摘要翻译： 在光电混合装置中，光连接器安装在设置在垂直光波导的一端上的平面光学表面上，用于输入和输出光信号，并且随着将光电混合器件集成到插入器等中， 整合规范化。 光电混合器件设置有：连接到光电复合衬底的电信号通路的导电引脚（108） 具有平坦光学表面并且还具有半透明部分（118）的半透明构件（116）; 以及多个自组织光波导（122），其在所述透光部分（118）和所述光电混合基板的光波导之间形成光路。 该结构使得平面光学表面的位置不低于导电引脚（108）上的电连接部分（110）的顶部; 因此，当在光波导（122）上安装有发送光信号的光波导的光连接器安装在平面光学面上时，可以避免光连接器与电连接部的顶部的碰撞。