公开(公告)号：EP2740557A4

公开(公告)日：2015-06-17

申请号：EP12861048

申请日：2012-08-02

申请人： TANIGUROGUMI CORP

发明人： TANIGURO KATSUMORI ,  WATANABE GENZO

IPC分类号： B23K1/20 ,  B23K1/19 ,  H05K3/24 ,  H05K3/34

CPC分类号： B23K1/203 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K3/0669 ,  B23K3/082 ,  B23K2201/38 ,  H01L2224/11 ,  H05K3/24 ,  H05K3/3468 ,  H05K3/3489 ,  H05K2203/044 ,  H05K2203/0746 ,  H05K2203/122

摘要： Provided is a method for manufacturing a component having an electrode corrosion preventing layer by performing the low-cost, high-yield and highly reliable soldering, can be provided. The method for manufacturing a component includes: a step of preparing component 10' having electrode 2; a step of contacting first organic fatty acid-containing solution 3a with electrode 2; a step of adhering first molten solder 5a onto electrode 2 by contacting first molten solder 5a with electrode 2; a step of ejecting a gas flow or a liquid flow to adhered first molten solder 5a to remove excess first molten solder 5a in first molten solder 5a adhered onto electrode 2; and a step of cooling electrode 2 from which excess first molten solder 5a has been removed to less than a melting point of first molten solder 5a. First molten solder 5a includes a component forming electrode corrosion preventing layer 4 made of an intermetallic compound layer on a surface of electrode 2 by reacting with a component included in electrode 2, and the contact of first molten solder 5a with electrode 2 is performed by allowing a liquid flow of first molten solder 5a to collide with or spread over electrode 2while moving component 10'.

公开(公告)号：EP2840596A4

公开(公告)日：2016-04-27

申请号：EP12874866

申请日：2012-04-17

申请人： TANIGUROGUMI CORP

发明人： TANIGURO KATSUMORI

IPC分类号： H01L21/60 ,  B23K37/06 ,  H05K3/34

CPC分类号： B23K37/06 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05026 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/11312 ,  H01L2224/11472 ,  H01L2224/1181 ,  H01L2224/11821 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13155 ,  H01L2224/16503 ,  H01L2224/94 ,  H01L2924/00014 ,  H05K3/282 ,  H05K3/3468 ,  H05K13/0465 ,  H05K2203/0557 ,  H05K2203/0746 ,  H05K2203/1344 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/0132 ,  H01L2224/11 ,  H01L2224/05552

摘要： Provided is a solder bump forming method capable of forming solder bumps having a desired constant thickness, without any failure such as copper corrosion, on a mounting board such as a printed circuit board having fine copper electrodes. The solder bump forming method includes: a process in which a prepared mask (5) is placed on a prepared substrate (1) and then a molten solder jet is blown to fill an opening of the mask (5) with molten solder (11a) until the molten solder (11a) exceeds the thickness of the mask (5); a process of removing a part of the molten solder (11a) that exceeds the thickness of the mask (5) to form a solder bump (11) having a predetermined thickness; and a process of removing the mask (5). The molten solder (11a) is molten lead-free solder that includes tin as a main ingredient and at least nickel as a sub ingredient, and further includes one or more other ingredients such as silver, copper, and germanium. The part of the molten solder (11a) that exceeds the thickness of the mask (5) is removed by using a blade or an air cutter or by spraying a solution (18) that includes organic fatty acid having 12 to 20 carbon atoms.

摘要翻译： 本发明提供一种焊锡凸块形成装置，能够形成具有所期望的恒定的厚度的焊料凸块的方法，而没有任何故障：如铜腐蚀，在安装基板上：如具有微细铜电极的印刷电路板。 焊料凸块形成方法，包括：在其中一个准备好的掩模（5）在（1），然后将熔融焊料射流被吹入以填充在与熔融焊剂（11A），所述掩模（5）的开口部的预备基板放置在处理 直到熔融焊料（11A）超过掩模的厚度（5）; 除去熔融焊料（11）那样的一部分的过程超过所述掩模（5）的厚度，以形成具有预定厚度的焊料凸块（11）; 和去除所述掩模的工序（5）。 熔融焊料（11）熔融的无铅焊料确实包括锡作为主要成分和至少镍作为副成分，并且进一步包括一种或多种其它成分：例如银，铜，和锗。 熔融焊料（11）的部分确实超过了掩模（5）的厚度是通过使用刀片或切割器以空气或通过喷雾的溶液（18）中除去没有包括具有12至20个碳原子的有机脂肪酸。

公开(公告)号：EP2978287A4

公开(公告)日：2017-02-08

申请号：EP14768053

申请日：2014-03-20

申请人： TANIGUROGUMI CORP

发明人： TANIGURO KATSUMORI ,  WATANABE GENZO

IPC分类号： H05K3/34 ,  B23K1/00 ,  B23K1/018 ,  B23K1/08 ,  B23K1/20 ,  B23K3/04 ,  B23K3/06 ,  B23K3/08 ,  B23K35/26 ,  B23K101/40 ,  B23K101/42

CPC分类号： H05K3/34 ,  B23K1/0016 ,  B23K1/018 ,  B23K1/08 ,  B23K1/203 ,  B23K1/206 ,  B23K3/0607 ,  B23K3/082 ,  B23K3/087 ,  B23K31/02 ,  B23K35/262 ,  B23K37/04 ,  B23K2201/40 ,  B23K2201/42 ,  H05K3/26 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3489 ,  H05K2203/04 ,  H05K2203/0445 ,  H05K2203/075 ,  H05K2203/0783 ,  H05K2203/1509 ,  H05K2203/1518 ,  H05K2203/1572 ,  H05K2203/159

公开(公告)号：EP2671661A4

公开(公告)日：2016-04-27

申请号：EP12829099

申请日：2012-04-14

申请人： TANIGUROGUMI CORP

发明人： TANIGURO KATSUMORI

IPC分类号： B23K1/018 ,  B23K1/08 ,  B23K1/20 ,  B23K35/26 ,  H05K3/34

CPC分类号： B23K3/0607 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/206 ,  B23K3/0692 ,  H01L2924/14 ,  H05K1/0296 ,  H01L2924/00

公开(公告)号：EP2835204A4

公开(公告)日：2016-04-20

申请号：EP12868928

申请日：2012-04-16

申请人： TANIGUROGUMI CORP

发明人： TANIGURO KATSUMORI

IPC分类号： B23K1/018 ,  B23K1/18 ,  B23K1/20 ,  B23K35/26 ,  H05K3/34

CPC分类号： B23K3/0607 ,  B23K1/0016 ,  B23K1/08 ,  B23K1/20 ,  B23K1/203 ,  B23K3/0646 ,  B23K3/0669 ,  B23K3/082 ,  B23K35/262 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/741 ,  H01L24/742 ,  H01L2224/03312 ,  H01L2224/03418 ,  H01L2224/036 ,  H01L2224/0381 ,  H01L2224/03821 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05111 ,  H01L2224/05147 ,  H01L2224/05582 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/0569 ,  H01L2224/11312 ,  H01L2224/116 ,  H01L2224/11821 ,  H01L2224/13111 ,  H01L2224/1369 ,  H01L2224/741 ,  H01L2924/381 ,  H05K3/0085 ,  H05K3/282 ,  H05K3/3468 ,  H05K2203/081 ,  H05K2203/122 ,  H05K2203/1366 ,  H05K2203/1518 ,  Y10T428/31678 ,  H01L2224/1141 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2224/03