公开(公告)号：EP2707910A2

公开(公告)日：2014-03-19

申请号：EP12782296.3

申请日：2012-05-09

申请人： Shat-R-Shield, Inc

发明人： NOLAN, Robert J. ,  HARMAN, Sr., Jeffery D.

IPC分类号： H01L33/52 ,  H01L33/50

CPC分类号： H01L33/52 ,  H01L33/44 ,  H01L51/5253 ,  H01L2933/0025 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/10106 ,  H05K2203/1366

摘要： A silicone protective coating for an electronic light source and a method for applying the coating over an exposed or outer surface of the electronic light source assembled as part of or mounted to a circuit board or other substrate.

摘要翻译： 一种用于电子光源的硅树脂保护涂层和一种用于将涂层施加在作为电路板或其他基板的一部分或安装到电路板或其它基板上的电子光源的暴露或外表面上的方法。

公开(公告)号：EP2461657A1

公开(公告)日：2012-06-06

申请号：EP10193453.7

申请日：2010-12-02

申请人： SIEMENS AKTIENGESELLSCHAFT

发明人： Seebahn, Björn

IPC分类号： H05K3/28 ,  H05K9/00

CPC分类号： H05K3/284 ,  H05K9/0075 ,  H05K9/0083 ,  H05K2201/0215 ,  H05K2201/0715 ,  H05K2201/083 ,  H05K2203/1366

摘要： Die Erfindung betrifft eine elektrische Baugruppe, wobei die Baugruppe (1) eine Leiterplatte (5) und auf der Leiterplatte (5) angeordnete elektrische Bauelemente (2,3a,3b) aufweist, wobei die Leiterplatte (5) elektrisch leitende Leiterbahnen (4a,4b) aufweist, die die Bauelemente (2,3a,3b) elektrisch miteinander verbinden, wobei mindestens ein Bauelement (2,3a) eine Beschichtung (15a,15b) mit einem Lack aufweist, wobei der Lack magnetisch leitende Partikel (15) enthält. Weiterhin betrifft die Erfindung ein Verfahren zur Herstellung einer solchen elektrischen Baugruppe (1). Die Erfindung ermöglicht auf ein Bauelement (2,3a,3b) einer elektrischen Baugruppe (1) einwirkende magnetische Felder und/oder von dem Bauelement (2,3a,3b) erzeugte magnetische Felder zu reduzieren.

摘要翻译： 组件（1）具有电子部件（2,3a） 处理器和存储器芯片，布置在印刷电路板（PCB）上。 PCB具有通过焊接接头（14a，14b）将部件彼此电连接的导电通路（4a）。 其中一个部件具有涂层（15a，15b），涂层包含由铁磁材料构成的导磁颗粒，例如 铁和铁磁性含铁合金和含铁素体的材料。 透明涂层（10）保护导电路径。 组件是变压器，电动阀门如晶体管和绝缘栅双极晶体管（IGBT），电容器和电阻器。 还包括用于制造电组件的方法的独立权利要求。

公开(公告)号：EP2025210B1

公开(公告)日：2012-02-22

申请号：EP07718465.3

申请日：2007-05-25

申请人： A.B. Mikroelektronik Gesellschaft mit beschränkter Haftung

发明人： HAEGELE, Bernd

IPC分类号： H05K1/05 ,  H05K3/28 ,  H05K3/44 ,  C03C3/064 ,  C23C4/18

CPC分类号： H05K1/053 ,  C03C3/064 ,  C23C4/18 ,  H05K1/092 ,  H05K2201/0116 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2203/1147 ,  H05K2203/1366 ,  Y10T29/49126 ,  Y10T29/49146

摘要： Circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the latter having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.

公开(公告)号：EP2374612A8

公开(公告)日：2011-12-28

申请号：EP09834706.5

申请日：2009-12-08

申请人： FUJIFILM Corporation

发明人： SATOU, Masataka

IPC分类号： B32B15/08 ,  H05K3/38

CPC分类号： H05K3/387 ,  H05K3/064 ,  H05K3/067 ,  H05K2201/0191 ,  H05K2203/0709 ,  H05K2203/1361 ,  H05K2203/1366 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/24917 ,  Y10T428/265 ,  Y10T428/31678

摘要： A surface metal film material including, in this order, a substrate, a polymer layer that receives a plating catalyst or a precursor thereof, and a metal film formed by plating, wherein, when x µm represents surface roughness (Ra) at an interface between the substrate and the polymer layer, and y µm represents surface roughness (Ra) at an interface between the polymer layer and the metal film, x > y and 5 µm > x > 0.1 µm.

公开(公告)号：EP1924416A2

公开(公告)日：2008-05-28

申请号：EP06788758.8

申请日：2006-07-28

申请人： Velcro Industries B.V. (NL)

发明人： KINGSFORD, Howard A. ,  CLUNE, Willliam P. ,  FERRY, Kristel

IPC分类号： B29C43/22 ,  H05K3/10 ,  B60R16/02 ,  A44B18/00

CPC分类号： B29C43/222 ,  A44B18/0049 ,  B29C43/46 ,  B29C2043/461 ,  B29C2043/465 ,  B29L2031/729 ,  H05K1/0284 ,  H05K1/0393 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/0091 ,  H05K3/107 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/28 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/209 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/0143 ,  H05K2203/1366 ,  H05K2203/1545 ,  Y10T29/49128 ,  Y10T29/49158

摘要： A method of forming a flexible conductive strip includes : molding a continuous, flexible (14) base of an electrically insulating thermoplastic resin, while forming channels (34) in a surface of the base; at least partially- filling the formed channels with a flowable, electrically conductive composition; and then stabilizing the flowable composition in the channels to form a pattern of stable, electrically conductive traces (16) within the channels . A method of forming a flexible circuit board having loop-engageable touch fastener elements (38) includes: molding a continuous, flexible base from an electrically insulating thermoplastic resin, while forming a field of stems integrally molded with and extending from a first side of the base,- applying a conductive material to the base to form a pattern of electrically conductive traces in accordance with a circuit design; and forming loop-engageable heads on the stems .

公开(公告)号：EP1332800A1

公开(公告)日：2003-08-06

申请号：EP00966482.2

申请日：2000-10-13

申请人： Kem-Tec Japan Co., Ltd

发明人： YANAGIDA, Kazuyo

IPC分类号： B05B13/02 ,  B05B15/12 ,  H05K3/28 ,  B05D1/02

CPC分类号： H05K3/0091 ,  B05B13/0278 ,  B05B14/40 ,  B05B16/90 ,  B05D1/02 ,  H05K2203/1366 ,  H05K2203/1518 ,  H05K2203/1572 ,  Y02P70/36

摘要： ABSTRACT
A plate-like workpiece to be coated (100) is suspended, positioned and conveyed between a pair of nozzle units (4,4) arranged opposing each other in an application space 3 inside an application booth (2). A coating agent (A) is sprayed from a plurality of spray nozzles (5) arranged on each nozzle unit (4) in a row at regular intervals so as to coat both the front and rear application surfaces (100a) and (100b) of the plate-like workpiece to be coated (100) while the plate-like workpiece to be coated (100) is being moved in a direction (X) perpendicular to the direction in which individual spray nozzles 5 are arrayed. With this arrangement it is possible to provide a coating machine for electric or electronic circuit boards, which has a simple mechanism and configuration and is reduced in size and installation space with improved productivity and economy, as well as providing a coating method using the machine and an electric or electronic circuit board coated by the method.

摘要翻译： 的板状工件要被涂覆（100）被暂停，定位和布置的一对喷嘴单元（4,4）之间传送相对海誓山盟在应用空间3应用展台（2）的内部。 （5）布置在涂布剂（A）是从喷嘴的多元性喷洒各喷嘴单元（4）上连续以规则的间隔，以的涂层两者前后施加表面（100A）及（100B） 板状工件要被涂覆（100），而在垂直于其中单个喷嘴5的排列方向被涂覆（100）在一个方向（X）正在被移动的板状工件。 利用这种布置，能够提供一种用于电气或电子电路板涂布机，其具有简单的机构和配置以及尺寸和安装空间具有改善的生产率和经济性，以及在使用本设备提供涂层的方法和减小 电气或电子电路板的涂布由该方法。

公开(公告)号：EP0819473A1

公开(公告)日：1998-01-21

申请号：EP97305311.9

申请日：1997-07-16

申请人： NORDSON CORPORATION

发明人： Hogan, Patrick Thomas ,  Selestak, David M. ,  Zakrajsek, Richard ,  Donges, William E. ,  Havlik, Chris ,  Harrell, Greg ,  Omilion, Zygmunt Carl ,  Fox, Kevin

IPC分类号： B05B7/08 ,  B05C5/02

CPC分类号： B05B7/2489 ,  B05B7/0861 ,  B05B7/10 ,  B05B7/12 ,  B05C5/02 ,  H05K3/0091 ,  H05K2203/081 ,  H05K2203/1366 ,  H05K2203/1509

摘要： Apparatus and methods for spray coating selected areas of a circuit board with a liquid coating material without coating regions of the circuit board to be left uncoated. In one mode of operation, a bead of liquid coating material dispensed from an elongated nozzle tip is atomized by directing jets of air pressurized against the bead to form a conical, swirling spray pattern which is sprayed on selected areas of a circuit board. In a second mode of operation, the non-atomized bead of liquid coating material dispensed through the elongated nozzle tip is applied on selected areas of the circuit board. In a third mode of operation, jets of pressurized air are directed against the bead of liquid coating material to create a soft swirl pattern, without atomizing the bead of coating material.

摘要翻译： 设备和用于与没有所述电路板的涂敷区域的液体涂层材料的电路板的喷涂选定区域的方法被留下未涂覆的。 在一种操作模式中，从分配到细长喷嘴尖端液体涂层材料的胎圈通过引导压靠珠形成圆锥形空气射流，涡旋喷雾图形的所有其上的电路板的选定区域喷洒雾化。 在操作的第二模式中，通过细长喷嘴尖端分配的液体涂层材料的非雾化的珠施加在电路板的选定区域。 在操作的第三模式中，加压空气的喷流是针对液体涂层材料来创建软漩涡图案的胎圈，而不雾化涂覆材料的珠。

公开(公告)号：EP0501550B1

公开(公告)日：1996-10-09

申请号：EP92200377.7

申请日：1992-02-11

申请人： DELCO ELECTRONICS CORPORATION

发明人： O'Connell Litteral, Mary

IPC分类号： B23Q7/00

CPC分类号： B23Q39/042 ,  B23Q41/00 ,  H05K3/0091 ,  H05K2203/1366 ,  H05K2203/1509

公开(公告)号：EP0698233A1

公开(公告)日：1996-02-28

申请号：EP94913199.0

申请日：1994-05-10

申请人： CIBA-GEIGY AG

发明人： SCHÄFER, Hans-Jürgen

IPC分类号： B05C1 ,  B05D1 ,  B05D3 ,  B65D1 ,  G03F7 ,  H05K3

CPC分类号： H05K3/0091 ,  G03F7/16 ,  H05K3/1216 ,  H05K3/227 ,  H05K2203/0143 ,  H05K2203/0577 ,  H05K2203/111 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1509 ,  H05K2203/1572 ,  H05K2203/159

摘要： A process for coating printed circuit boards by means of coating rolls with a coating which may be cross-linked by electromagnetic radiation, preferably UV radiation, is characterised by the following steps: a photopolymerisable, fusible, low-molecular coating which is highly visquous to solid at room temperature and has a mean molecular weight preferably from 500 to 1500 is melted and supplied to the applicator roll (1) of a roll coating installation; the coating is applied on the printed circuit board surface(s) at a temperature from 60 °C to 110 °C with approximately 1000 to 20 000 mPas viscosity and 10-200 νm thick; the surface to be coated of the printed circuit board (L) is preheated (8) before coating up to a temperature 10 °C to 50 °C higher than the temperature at which the coating is applied. A device (10) for carrying out this process is also disclosed.

公开(公告)号：EP0427053B1

公开(公告)日：1994-01-26

申请号：EP90120513.8

申请日：1990-10-26

申请人： BÖLLHOFF VERFAHRENSTECHNIK GMBH & CO. KG

发明人： Heine, Werner

IPC分类号： B05B13/02 ,  B65G47/252

CPC分类号： H05K3/0091 ,  B05B13/0221 ,  H05K2203/1366 ,  H05K2203/1509 ,  H05K2203/1563