公开(公告)号：EP2890822A1

公开(公告)日：2015-07-08

申请号：EP13766419.9

申请日：2013-08-29

申请人： Corning Incorporated

发明人： JOHNSON, Benedict Yorke ,  OWUSU, Samuel Odei

IPC分类号： C22B11/02 ,  B22F1/00 ,  B22F9/18 ,  B82Y30/00 ,  B22F9/24

CPC分类号： C22B11/04 ,  B22F1/0018 ,  B22F9/24 ,  C22B3/16 ,  C22B11/02 ,  C22C5/06

摘要： Described herein are methods of making metallic or elemental silver. These methods generally include a step of forming a reaction dispersion that includes a silver-containing compound, an organic acid, and a solvent that includes an alcohol, followed by mixing the reaction dispersion for a time and at a temperature effective to form a reaction product that includes metallic silver from a cationic silver species of the silver-containing compound. Also described herein are metallic or elemental silver produced by these methods.

摘要翻译： 这里描述的是制备金属或元素银的方法。 这些方法通常包括形成包含含银化合物，有机酸和包括醇的溶剂的反应分散体的步骤，然后将反应分散体混合一段时间并且在有效形成反应产物的温度下 其包括来自含银化合物的阳离子银种类的金属银。 本文还描述了通过这些方法生产的金属或元素银。

公开(公告)号：EP3049213A1

公开(公告)日：2016-08-03

申请号：EP14840396.7

申请日：2014-08-28

申请人： Corning Incorporated

发明人： BURKET, Robert Carl ,  GOERS, Uta-Barbara ,  OWUSU, Samuel Odei ,  PETRIWSKY, Tammy Lynn

IPC分类号： B23K26/36

CPC分类号： C03C15/00 ,  B23K26/006 ,  B23K26/302 ,  B23K26/362 ,  B23K26/364 ,  B23K26/382 ,  B23K26/384 ,  B23K26/402 ,  B23K2203/54 ,  C03B33/0222 ,  C03C23/00 ,  C03C23/0025 ,  C03C2218/34 ,  H05K1/0306 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/0029 ,  H05K2203/0285

摘要： Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

摘要翻译： 公开了通过激光钻孔和酸蚀刻在玻璃基板中形成通孔的方法。 在一个实施例中，在玻璃基板中形成通孔的方法包括从玻璃基板的入射表面激光钻穿玻璃基板厚度的至少一部分的通孔。 该方法还包括在蚀刻持续时间的至少一部分期间蚀刻玻璃基板以蚀刻持续时间以增加通孔的入射开口的直径并向玻璃基板施加超声波能量。 所应用的超声能量的频率在40 kHz到192 kHz之间。

公开(公告)号：EP2890510A1

公开(公告)日：2015-07-08

申请号：EP13759652.4

申请日：2013-08-29

申请人： Corning Incorporated ,  Johnson, Benedict Yorke ,  Owusu, Samuel Odei

发明人： JOHNSON, Benedict Yorke ,  OWUSU, Samuel Odei

IPC分类号： B22F1/00 ,  B22F9/18 ,  C22B11/02 ,  B82Y30/00 ,  B22F9/24

CPC分类号： C22B11/02 ,  B22F1/0018 ,  B22F9/20 ,  B82Y30/00 ,  C22C5/06

摘要： Described herein are methods of making metallic or elemental silver in the solid state. These methods generally include a step of forming an at least substantially solvent-free solid state reaction mixture that includes a silver-containing compound and an organic acid, followed by heating the reaction mixture at a temperature and for a time effective to form metallic silver from a cationic silver species of the silver-containing compound. Also described herein are metallic or elemental silver produced by these methods.

摘要翻译： 这里描述的是制造固态的金属或元素银的方法。 这些方法通常包括形成至少基本上无溶剂的固态反应混合物的步骤，该固体反应混合物包括含银化合物和有机酸，然后在有效形成金属银的温度和时间的条件下加热反应混合物， 含银化合物的阳离子银种类。 本文还描述了通过这些方法生产的金属或元素银。

公开(公告)号：EP3338521A1

公开(公告)日：2018-06-27

申请号：EP16766113.1

申请日：2016-08-19

申请人： Corning Incorporated

发明人： GARNER, Sean Matthew ,  OWUSU, Samuel Odei ,  PIECH, Garrett Andrew ,  POLLARD, Scott Christopher

IPC分类号： H05K1/02 ,  H05K1/03 ,  H01L23/15 ,  C03C17/00 ,  B23K26/00 ,  C03B33/02 ,  C03C15/00 ,  B23K26/53 ,  H05K3/10 ,  H05K3/46

CPC分类号： H05K3/0029 ,  C03B33/0222 ,  C03C15/00 ,  C03C17/002 ,  C03C17/008 ,  C03C23/0025 ,  C03C23/007 ,  C03C2217/445 ,  C03C2217/70 ,  H01L21/4807 ,  H01L23/15 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/036 ,  H05K1/115 ,  H05K3/002 ,  H05K3/107 ,  H05K3/388 ,  H05K3/4038 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2203/0143 ,  H05K2203/0743 ,  H05K2203/075 ,  H05K2203/0776 ,  H05K2203/0789 ,  H05K2203/107 ,  H05K2203/1194 ,  H05K2203/1545 ,  Y02P40/57

摘要： Methods of continuous fabrication of features in flexible substrates are disclosed. In one embodiment, a method of fabricating features in a substrate web includes providing the substrate web arranged in a first spool on a first spool assembly, advancing the substrate web from the first spool and through a laser processing assembly comprising a laser, and creating a plurality of defects within the substrate web using the laser. The method further includes advancing the substrate web through an etching assembly and etching the substrate web at the etching assembly to remove glass material at the plurality of defects, thereby forming a plurality of features in the substrate web. The method further includes rolling the substrate web into a final spool.

公开(公告)号：EP3027557A1

公开(公告)日：2016-06-08

申请号：EP14748437.2

申请日：2014-07-23

申请人： Corning Incorporated

发明人： FAGAN, James Gerard ,  GADKAREE, Kishor Purushottam ,  KUMAR, Atul ,  OWUSU, Samuel Odei ,  REDDY, Kamjula Pattabhirami

IPC分类号： C01B31/12

CPC分类号： C01B31/125 ,  C01B32/342 ,  C01B32/348 ,  H01G11/34

摘要： The disclosure relates, in various embodiments, to methods for forming activated carbon comprising (a) providing a feedstock mixture comprising a carbon feedstock, at least one activating agent chosen from alkali metal hydroxides, and at least one additive chosen from fats, oils, fatty acids, fatty acid esters, and polyhydroxylated compounds to form a feedstock mixture; (b) optionally heating the feedstock mixture to a first temperature, and when a step of heating the feedstock mixture to a first temperature is performed, optionally holding the feedstock mixture at the first temperature for a time sufficient to react the at least one activating agent with the at least one additive; (c) optionally milling and/or grinding the feedstock mixture; (d) heating the feedstock mixture to an activation temperature; and (e) holding the feedstock mixture at the activation temperature for a time sufficient to form activated carbon.