摘要:
The present invention relates to a method of preparing hydrophilic silicone gel adhesives by curing a silicone composition. The method includes forming the silicone composition by reacting a polyoxyethylene-organopolysiloxane copolymer having an average of at least 1 functional groups selected from, unsaturated hydrocarbon, hydroxyl, silanol, or combinations thereof and a polyoxyethylene-organopolysiloxane copolymer as cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule in the presence of a catalyst. The polyoxyethylene-organopolysiloxane copolymers react via hydrosilylation or coupling reaction.
摘要:
Provided in various embodiments are methods of loading solid microparticles and nanoparticles of silver, including silver-based compounds, on silicone particles to surface modify the silicone particles. The silver-loaded microparticles and silver-loaded nanoparticles can be dispersed or loaded into silicones for use in antimicrobial and other applications.
摘要:
A gel having improved thermal stability is the hydro silylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a hydrosilylation catalyst and (D) a heated reaction product of iron acetylacetonate. The iron acetylacetonate is present prior to heating in an amount of from about 0.05 to about 30 weight percent based on a total weight of (A) and (B). The gel is formed using a method that includes the steps of (I) heating the iron acetylacetonate to form the (D) heated reaction product of the iron acetylacetonate and (II) combining (A), (B), (C) and (D) to effect the hydrosilylation reaction of (A) and (B) in the presence of (C) and (D) to form the gel.
摘要:
A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The composite can be used for both TIMl and TIM2 applications.
摘要:
An additive for a silicone encapsulant has the structure: Formula (I) wherein R 1 and R 2 are each -O-Si(R 4 )(R 5 )(R 6 ) and each of R 4 , R 5 , and R 6 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups, and wherein R 3 is independently chosen from C 1 -C 10 hydrocarbyl groups, C 1 -C 10 alkyl groups, C 2 -C 10 alkenyl groups, and C 6 -C 10 aryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device.
摘要:
An aryl group-containing siloxane composition is formed by introducing an alkaline earth- metal as a part of the reaction product of an organopolysiloxane having at least two alkenyl groups per molecule and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule in the presence of a hydrosilylation catalyst, wherein at least one of the organopolysiloxanes includes an aryl group. The alkaline earth metal may be introduced via a heat stability composition or may alternatively be pre -reacted with the organopolysiloxane having at least two alkenyl groups per molecule. The aryl group-containing siloxane compositions may be utilized as an encapsulating layer for a light emitting device.
摘要:
A gel has improved thermal stability and is the ultraviolet hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a UV-activated hydrosilylation catalyst comprising at least one of platinum, rhodium, ruthenium, palladium, osmium, and iridium, and (D) a thermal stabilizer. The (D) thermal stabilizer is present in an amount of from about 0.01 to about 30 weight percent based on a total weight of (A) and (B) and having transparency to UV light sufficient for the ultraviolet hydrosilylation reaction product to form.
摘要:
A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM1 and TIM2 applications in electronic devices.