公开(公告)号：EP1695382A4

公开(公告)日：2007-10-10

申请号：EP03769013

申请日：2003-11-25

Applicant: FRY METALS INC

Inventor： LEWIS BRIAN ,  SINGH BAWA ,  LAUGHLIN JOHN P ,  KYAW DAVID V ,  INGHAM ANTHONY

IPC: B23K35/24 ,  H01L23/48 ,  B23K35/14 ,  B23K35/26 ,  B23K35/28 ,  B23K35/30 ,  B23K35/36 ,  C22C5/02 ,  C22C28/00 ,  H01L23/373 ,  H01L23/42

CPC classification number: H01L23/42 ,  B23K35/302 ,  B23K35/3066 ,  B23K35/3602 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01066 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.

公开(公告)号：EP2174324A4

公开(公告)日：2012-05-23

申请号：EP07872304

申请日：2008-03-18

Applicant: FRY METALS INC

Inventor： KHASELEV OSCAR ,  DESAI NITIN ,  MARCZI MICHAEL T ,  SINGH BAWA

IPC: H01F5/00 ,  B22F9/24 ,  C09D11/00 ,  H05K1/09 ,  H05K3/10 ,  H05K3/24

CPC classification number: H01F5/003 ,  B22F2998/00 ,  C09D11/52 ,  H01L51/0022 ,  H05K3/1241 ,  H05K3/1258 ,  H05K3/38 ,  H05K2201/098 ,  H05K2201/09909 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/1105 ,  H05K2203/1131 ,  H05K2203/1476 ,  B22F1/0062

公开(公告)号：EP2173496A4

公开(公告)日：2011-07-27

申请号：EP08782067

申请日：2008-07-18

Applicant: FRY METALS INC

Inventor： KHASELEV OSCAR ,  DESAI NITIN ,  DEVERAJAN SUPRIYA ,  MARCZI MICHAEL T ,  SINGH BAWA

IPC: B05D1/32

CPC classification number: H05K3/38 ,  H01L31/022425 ,  H05K1/0306 ,  H05K1/097 ,  H05K3/125 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/013 ,  H05K2203/1131 ,  Y02E10/50 ,  Y10T428/12535 ,  Y10T428/12583 ,  Y10T428/12597 ,  Y10T428/12896 ,  Y10T428/24802 ,  Y10T428/24917

公开(公告)号：EP2064000A4

公开(公告)日：2010-12-29

申请号：EP07842796

申请日：2007-09-19

Applicant: FRY METALS INC

Inventor： KHASELEV OSCAR ,  DESAI NITIN ,  MARCZI MICHAEL T ,  SINGH BAWA

IPC: B05D3/00

CPC classification number: C09D11/52 ,  C09D11/30 ,  H05K1/097 ,  H05K2203/122

Abstract: Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines.

Abstract translation: 提供了包括用于包括金属和油墨的组合物的这种溶剂体系的溶剂体系和分散体。 在某些实例中，溶剂体系可以与封端的金属颗粒一起使用以提供可用于印刷导电线的分散体。

公开(公告)号：EP2106318A4

公开(公告)日：2013-05-01

申请号：EP07844124

申请日：2007-10-11

Applicant: FRY METALS INC

Inventor： ARORA SANYOGITA ,  FINKE MARTINUS N ,  SINGH BAWA ,  LEWIS BRIAN ,  MARCZI MICHAEL T ,  HOLTZER MITCHELL

IPC: B23K35/34

CPC classification number: B23K35/3613 ,  B23K35/362 ,  B23K2201/42 ,  C08K11/00 ,  H05K3/3489 ,  Y10T428/31504

Abstract: Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers and the like.