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1.INTEGRATED CIRCUIT DEVICE HAVING STACKED CONDUCTIVE LAYERS CONNECTING CIRCUIT ELEMENTS THERETHROUGH 失效
标题翻译: 具有连接电路元件的堆叠导电层的集成电路器件公开(公告)号:EP0199635A3
公开(公告)日:1987-11-19
申请号:EP86400782
申请日:1986-04-11
申请人: FUJITSU LIMITED
发明人: MIYAUCHI, AKIRA , NISHIMOTO, HIROSHI C/O SUZUKI , OKIYAMA, TADASHI , KITASAGAMI, HIROO , SUGIMOTO, MASAHIRO , TAMADA, HARUO , EMORI, SHINJI
IPC分类号: H01L23/12 , H01L21/60 , H01L23/057 , H01L23/498 , H01L23/64 , H01P1/00 , H01P3/08 , H01P5/00 , H01P5/02 , H01P5/08 , H05K1/02 , H05K1/18 , H05K3/32 , H05K3/40 , H01L23/48 , H01L23/04 , H01L23/56
CPC分类号: H05K1/184 , H01L23/057 , H01L23/49822 , H01L23/645 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/4903 , H01L2224/49051 , H01L2224/49175 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01031 , H01L2924/01042 , H01L2924/0105 , H01L2924/01057 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/10329 , H01L2924/12041 , H01L2924/1306 , H01L2924/14 , H01L2924/16195 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/0243 , H05K3/325 , H05K3/4046 , H05K2201/10265 , H05K2201/10409 , H05K2201/10689 , H01L2924/00 , H01L2224/45099 , H01L2224/05599