公开(公告)号：EP1746636A1

公开(公告)日：2007-01-24

申请号：EP05257724.4

申请日：2005-12-15

申请人： Fujitsu Ltd. ,  Fujitsu Frontech Limited

发明人： Ishikawa, Naoki, c/o Fujitsu Limited ,  Kira, Hidehiko, c/o Fujitsu Limited ,  Tsuneto, Tatsuro, c/o Fujitsu Frontech Limited ,  Kobayashi, Hiroshi, c/o Fujitsu Limited

IPC分类号： H01L21/00 ,  G06K19/077

CPC分类号： G06K19/07745 ,  G06K19/07718 ,  H01L21/67144 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/75743 ,  H01L2224/75822 ,  H01L2224/7598 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/81

摘要： The present invention provides an IC chip (11) mounting method for mounting two or more IC chips (11) on a base (13), including: preparing a wafer (10) by mounting a tape (30) on a face thereof, which is the reverse of the wafer (10) having a mounting surface to be attached to the base (13), and by dividing the wafer (10) into IC chips (11) by dicing while leaving the tape (30); sequentially pressing the IC chips (11) on the wafer (10) against a first roller (51) to allow the chips (11) to be sucked onto the first roller (51) ; subsequently transferring the IC chips (11) sucked onto the first roller (51) to a second roller (52); and subsequently mounting the IC chips (11) transferred to the second roller (52) on the traveling base (13).

摘要翻译： 本发明提供了一种用于将两个或更多IC芯片（11）安装在基座（13）上的IC芯片（11）安装方法，包括：通过在其表面上安装带（30）来准备晶片（10） 是具有待安装到基座（13）的安装表面的晶片（10）的反面，并且通过在离开带（30）的同时通过切割将晶片（10）分成IC芯片（11）; 将晶片（10）上的IC芯片（11）顺序地压靠在第一辊（51）上以允许芯片（11）被吸附到第一辊（51）上; 随后将吸附到第一辊（51）上的IC芯片（11）传送到第二辊（52）; 随后将传送到第二辊52的IC芯片11安装在移动基座13上。

公开(公告)号：EP1655690A3

公开(公告)日：2008-10-29

申请号：EP05251178.9

申请日：2005-02-28

申请人： FUJITSU LIMITED ,  Fujitsu Frontech Limited

发明人： Baba, Shunji, c/o Fujitsu Limited ,  Ishikawa, Naoki, c/o Fujitsu Limited ,  Kira, Hidehiko, c/o Fujitsu Limited ,  Kobayashi, Hiroshi, c/o Fujitsu Limited ,  Hashimoto, Shigeru c/o Fujitsu Frontech Limited ,  Sugimura, Yoshiyasu c/o Fujitsu Frontech Limited

IPC分类号： G06K19/073 ,  H01L23/58 ,  H01L23/498

CPC分类号： H01L23/573 ,  G06K19/073 ,  G06K19/0739 ,  H01L23/49855 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： An RFID tag that is very effective in preventing fraud includes a base 105, an antenna pattern 102 provided on the base, a breakdown pattern 103 provided on the base, a circuit chip 101 connected to both the antenna pattern and the breakdown pattern, and a cover 106 that is bonded to the base in a strippable manner so as to cover the antenna pattern, the breakdown pattern and the circuit chip. On tampering with the tag, the cover is caused to come off from the base together with all or a part of the breakdown pattern 103. The breakdown pattern is transparent, or the cover conceals the remaining part of the breakdown pattern, if only part is removed, or the breakdown pattern has a specific part that produces predetermined electrical properties such as a resistance and the cover conceals the specific part. It is thus made difficult to recognise and repair the removal or destruction of the breakdown pattern.

公开(公告)号：EP1655690A2

公开(公告)日：2006-05-10

申请号：EP05251178.9

申请日：2005-02-28

申请人： FUJITSU LIMITED ,  Fujitsu Frontech Limited

发明人： Baba, Shunji, c/o Fujitsu Limited ,  Ishikawa, Naoki, c/o Fujitsu Limited ,  Kira, Hidehiko, c/o Fujitsu Limited ,  Kobayashi, Hiroshi, c/o Fujitsu Limited ,  Hashimoto, Shigeru c/o Fujitsu Frontech Limited ,  Sugimura, Yoshiyasu c/o Fujitsu Frontech Limited

IPC分类号： G06K19/073 ,  H01L23/58 ,  H01L23/498

CPC分类号： H01L23/573 ,  G06K19/073 ,  G06K19/0739 ,  H01L23/49855 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： An RFID tag that is very effective in preventing fraud includes a base 105, an antenna pattern 102 provided on the base, a breakdown pattern 103 provided on the base, a circuit chip 101 connected to both the antenna pattern and the breakdown pattern, and a cover 106 that is bonded to the base in a strippable manner so as to cover the antenna pattern, the breakdown pattern and the circuit chip. On tampering with the tag, the cover is caused to come off from the base together with all or a part of the breakdown pattern 103. The breakdown pattern is transparent, or the cover conceals the remaining part of the breakdown pattern, if only part is removed, or the breakdown pattern has a specific part that produces predetermined electrical properties such as a resistance and the cover conceals the specific part. It is thus made difficult to recognise and repair the removal or destruction of the breakdown pattern.

摘要翻译： 在防止欺诈方面非常有效的RFID标签包括基座105，设置在基座上的天线图案102，设置在基座上的击穿图案103，连接到天线图案和击穿图案的电路芯片101，以及 盖106以可剥离的方式结合到基座，以覆盖天线图案，击穿图案和电路芯片。 在篡改标签时，盖子与全部或部分击穿图案103一起从基座脱落。击穿图案是透明的，或者盖子隐藏击穿图案的剩余部分，如果只有部分是 或者击穿图案具有产生诸如电阻等预定电气特性的特定部件，并且盖子遮盖特定部件。 因此难以识别和修复击穿图案的去除或破坏。

公开(公告)号：EP1818861A3

公开(公告)日：2007-09-05

申请号：EP07250266.9

申请日：2007-01-23

申请人： Fujitsu Ltd.

发明人： Kobayashi, Hiroshi, c/o Fujitsu Limited ,  Ishikawa, Naoki, c/o Fujitsu Limited ,  Matsumura, Takayoshi, c/o Fujitsu Limited ,  Baba, Shunji, c/o Fujitsu Limited

IPC分类号： G06K19/077 ,  H01Q1/38 ,  H01Q7/00

CPC分类号： H01Q1/38 ,  G06K19/07752 ,  G06K19/07771 ,  H01L2224/75252 ,  H01L2224/83192 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01Q1/2208 ,  H01Q7/00 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49155 ,  Y10T29/49165

摘要： In a manufacturing method of a thin and small RFID tag, an antenna metal pattern is formed on a substrate, going once around a dielectric plate, and a recess is formed on the substrate to house an IC chip. A strap on which the IC chip is mounted is connected and fastened to the substrate in the position and orientation in which the IC chip is housed in the recess.

摘要翻译： 在薄而小的RFID标签的制造方法中，在基板上形成天线金属图案，一次围绕电介质板，并且在基板上形成凹部以容纳IC芯片。 IC芯片安装在其上的带子以IC芯片容纳在凹槽中的位置和取向连接并紧固到基板。

公开(公告)号：EP1818861B1

公开(公告)日：2009-12-23

申请号：EP07250266.9

申请日：2007-01-23

申请人： Fujitsu Ltd.

发明人： Kobayashi, Hiroshi, c/o Fujitsu Limited ,  Ishikawa, Naoki, c/o Fujitsu Limited ,  Matsumura, Takayoshi, c/o Fujitsu Limited ,  Baba, Shunji, c/o Fujitsu Limited

IPC分类号： G06K19/077 ,  H01Q1/38 ,  H01Q7/00

CPC分类号： H01Q1/38 ,  G06K19/07752 ,  G06K19/07771 ,  H01L2224/75252 ,  H01L2224/83192 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01Q1/2208 ,  H01Q7/00 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49155 ,  Y10T29/49165

公开(公告)号：EP1818861A2

公开(公告)日：2007-08-15

申请号：EP07250266.9

申请日：2007-01-23

申请人： Fujitsu Ltd.

发明人： Kobayashi, Hiroshi, c/o Fujitsu Limited ,  Ishikawa, Naoki, c/o Fujitsu Limited ,  Matsumura, Takayoshi, c/o Fujitsu Limited ,  Baba, Shunji, c/o Fujitsu Limited

IPC分类号： G06K19/077

CPC分类号： H01Q1/38 ,  G06K19/07752 ,  G06K19/07771 ,  H01L2224/75252 ,  H01L2224/83192 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01Q1/2208 ,  H01Q7/00 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49155 ,  Y10T29/49165

摘要： In a manufacturing method of a thin and small RFID tag, an antenna metal pattern is formed on a substrate, going once around a dielectric plate, and a recess is formed on the substrate to house an IC chip. A strap on which the IC chip is mounted is connected and fastened to the substrate in the position and orientation in which the IC chip is housed in the recess.

摘要翻译： 在薄型和小型RFID标签的制造方法中，天线金属图案形成在基板上，一直围绕电介质板，并且在基板上形成凹部以容纳IC芯片。 将IC芯片安装在其上的条带以将IC芯片容纳在凹部中的位置和方向连接并紧固到基板。