RFID tag
    8.
    发明公开
    RFID tag 有权
    RFID-Etikett

    公开(公告)号:EP1804203A2

    公开(公告)日:2007-07-04

    申请号:EP06111643.0

    申请日:2006-03-23

    申请人: FUJITSU LIMITED

    IPC分类号: G06K19/077

    摘要: The present invention relates to an RFID tag performing exchange of information with an external device without contact, and is to improve the resistance to bending while avoiding an increase in the thickness of the RFID tag. A circuit chip (11) is bonded to a base portion (131) of a base (13) with a thermosetting adhesive. The base is folded, and an ultraviolet curing adhesive is applied on the circuit chip. The fold-back portions (132; 133) of the base are folded back onto the circuit chip, to which portions ultraviolet light is irradiated, as a result, both of the surfaces of the circuit chip are bonded to the base with the adhesives.

    摘要翻译: RFID标签技术领域本发明涉及RFID标签,其与外部设备进行信息交换而不接触,并且提高抗弯曲性,同时避免RFID标签的厚度增加。 电路芯片(11)用热固性粘合剂结合到基座(13)的基部(131)上。 折叠底座,并在电路芯片上施加紫外线固化粘合剂。 底座的折回部分(132; 133)折回到照射部分紫外线的电路芯片上,结果,电路芯片的两个表面都用粘合剂粘合到基底上。

    RFID tag
    9.
    发明公开
    RFID tag 有权
    RFID标签

    公开(公告)号:EP1804203A3

    公开(公告)日:2008-04-23

    申请号:EP06111643.0

    申请日:2006-03-23

    申请人: FUJITSU LIMITED

    IPC分类号: G06K19/077 H01Q1/22

    摘要: The present invention relates to an RFID tag performing exchange of information with an external device without contact, and is to improve the resistance to bending while avoiding an increase in the thickness of the RFID tag. A circuit chip (11) is bonded to a base portion (131) of a base (13) with a thermosetting adhesive. The base is folded, and an ultraviolet curing adhesive is applied on the circuit chip. The fold-back portions (132; 133) of the base are folded back onto the circuit chip, to which portions ultraviolet light is irradiated, as a result, both of the surfaces of the circuit chip are bonded to the base with the adhesives.

    摘要翻译: 本发明涉及与外部设备进行信息交换而不接触的RFID标签,并且在避免增加RFID标签的厚度的同时提高抗弯曲性。 用热固性粘合剂将电路芯片(11)粘合到基座(13)的基座部分(131)上。 将基座折叠,并在电路芯片上涂敷紫外线固化粘合剂。 基底的折回部分(132; 133)折回到电路芯片上,紫外线照射到该电路芯片上,结果,电路芯片的两个表面都用粘合剂粘合到基底。