公开(公告)号：EP1655690A3

公开(公告)日：2008-10-29

申请号：EP05251178.9

申请日：2005-02-28

申请人： FUJITSU LIMITED ,  Fujitsu Frontech Limited

发明人： Baba, Shunji, c/o Fujitsu Limited ,  Ishikawa, Naoki, c/o Fujitsu Limited ,  Kira, Hidehiko, c/o Fujitsu Limited ,  Kobayashi, Hiroshi, c/o Fujitsu Limited ,  Hashimoto, Shigeru c/o Fujitsu Frontech Limited ,  Sugimura, Yoshiyasu c/o Fujitsu Frontech Limited

IPC分类号： G06K19/073 ,  H01L23/58 ,  H01L23/498

CPC分类号： H01L23/573 ,  G06K19/073 ,  G06K19/0739 ,  H01L23/49855 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： An RFID tag that is very effective in preventing fraud includes a base 105, an antenna pattern 102 provided on the base, a breakdown pattern 103 provided on the base, a circuit chip 101 connected to both the antenna pattern and the breakdown pattern, and a cover 106 that is bonded to the base in a strippable manner so as to cover the antenna pattern, the breakdown pattern and the circuit chip. On tampering with the tag, the cover is caused to come off from the base together with all or a part of the breakdown pattern 103. The breakdown pattern is transparent, or the cover conceals the remaining part of the breakdown pattern, if only part is removed, or the breakdown pattern has a specific part that produces predetermined electrical properties such as a resistance and the cover conceals the specific part. It is thus made difficult to recognise and repair the removal or destruction of the breakdown pattern.

公开(公告)号：EP1814067B1

公开(公告)日：2008-08-13

申请号：EP06122184.2

申请日：2006-10-12

申请人： FUJITSU LIMITED ,  Fujitsu Frontech Limited

发明人： Ishikawa, Naoki, c/o Fujitsu Limited ,  Tsuneno, Tatsuro, c/o Fujitsu Frontech Limited ,  Kira, Hidehiko, c/o Fujitsu Limited

IPC分类号： G06K19/077

CPC分类号： G06K19/07749 ,  G06K19/07718 ,  G06K19/07728 ,  G06K19/0775 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/75252 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A series (100) of RFID tags is reeled around a reel core (40) formed by a core material (41) and a stress absorbing material (42) lapped around the core material to absorb a stress produced in reeling the series of RFID tags. In the series of RFID tags, a number of RFID tags each having an antenna and a circuit chip connected to the antenna and performing radio communication with the antenna are formed with a predetermined pitch on a long-belt-like and flexible base (13).

公开(公告)号：EP1814067A1

公开(公告)日：2007-08-01

申请号：EP06122184.2

申请日：2006-10-12

申请人： FUJITSU LIMITED ,  Fujitsu Frontech Limited

发明人： Ishikawa, Naoki, c/o Fujitsu Limited ,  Tsuneno, Tatsuro, c/o Fujitsu Frontech Limited ,  Kira, Hidehiko, c/o Fujitsu Limited

IPC分类号： G06K19/077

CPC分类号： G06K19/07749 ,  G06K19/07718 ,  G06K19/07728 ,  G06K19/0775 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/75252 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A series (100) of RFID tags is reeled around a reel core (40) formed by a core material (41) and a stress absorbing material (42) lapped around the core material to absorb a stress produced in reeling the series of RFID tags. In the series of RFID tags, a number of RFID tags each having an antenna and a circuit chip connected to the antenna and performing radio communication with the antenna are formed with a predetermined pitch on a long-belt-like and flexible base (13).

摘要翻译： 一系列（100）RFID标签卷绕在由芯材（41）形成的卷轴（40）和应力吸收材料（42）之间，围绕芯材料堆叠，以吸收卷绕该系列RFID标签产生的应力 。 在一系列RFID标签中，在长带状和柔性基座（13）上以预定的间距形成多个RFID标签，每个RFID标签各自具有连接到天线的天线和与天线进行无线电通信的电路芯片， 。

公开(公告)号：EP1655690A2

公开(公告)日：2006-05-10

申请号：EP05251178.9

申请日：2005-02-28

申请人： FUJITSU LIMITED ,  Fujitsu Frontech Limited

发明人： Baba, Shunji, c/o Fujitsu Limited ,  Ishikawa, Naoki, c/o Fujitsu Limited ,  Kira, Hidehiko, c/o Fujitsu Limited ,  Kobayashi, Hiroshi, c/o Fujitsu Limited ,  Hashimoto, Shigeru c/o Fujitsu Frontech Limited ,  Sugimura, Yoshiyasu c/o Fujitsu Frontech Limited

IPC分类号： G06K19/073 ,  H01L23/58 ,  H01L23/498

CPC分类号： H01L23/573 ,  G06K19/073 ,  G06K19/0739 ,  H01L23/49855 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： An RFID tag that is very effective in preventing fraud includes a base 105, an antenna pattern 102 provided on the base, a breakdown pattern 103 provided on the base, a circuit chip 101 connected to both the antenna pattern and the breakdown pattern, and a cover 106 that is bonded to the base in a strippable manner so as to cover the antenna pattern, the breakdown pattern and the circuit chip. On tampering with the tag, the cover is caused to come off from the base together with all or a part of the breakdown pattern 103. The breakdown pattern is transparent, or the cover conceals the remaining part of the breakdown pattern, if only part is removed, or the breakdown pattern has a specific part that produces predetermined electrical properties such as a resistance and the cover conceals the specific part. It is thus made difficult to recognise and repair the removal or destruction of the breakdown pattern.

摘要翻译： 在防止欺诈方面非常有效的RFID标签包括基座105，设置在基座上的天线图案102，设置在基座上的击穿图案103，连接到天线图案和击穿图案的电路芯片101，以及 盖106以可剥离的方式结合到基座，以覆盖天线图案，击穿图案和电路芯片。 在篡改标签时，盖子与全部或部分击穿图案103一起从基座脱落。击穿图案是透明的，或者盖子隐藏击穿图案的剩余部分，如果只有部分是 或者击穿图案具有产生诸如电阻等预定电气特性的特定部件，并且盖子遮盖特定部件。 因此难以识别和修复击穿图案的去除或破坏。

公开(公告)号：EP1746636A1

公开(公告)日：2007-01-24

申请号：EP05257724.4

申请日：2005-12-15

申请人： Fujitsu Ltd. ,  Fujitsu Frontech Limited

发明人： Ishikawa, Naoki, c/o Fujitsu Limited ,  Kira, Hidehiko, c/o Fujitsu Limited ,  Tsuneto, Tatsuro, c/o Fujitsu Frontech Limited ,  Kobayashi, Hiroshi, c/o Fujitsu Limited

IPC分类号： H01L21/00 ,  G06K19/077

CPC分类号： G06K19/07745 ,  G06K19/07718 ,  H01L21/67144 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/75743 ,  H01L2224/75822 ,  H01L2224/7598 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/81

摘要： The present invention provides an IC chip (11) mounting method for mounting two or more IC chips (11) on a base (13), including: preparing a wafer (10) by mounting a tape (30) on a face thereof, which is the reverse of the wafer (10) having a mounting surface to be attached to the base (13), and by dividing the wafer (10) into IC chips (11) by dicing while leaving the tape (30); sequentially pressing the IC chips (11) on the wafer (10) against a first roller (51) to allow the chips (11) to be sucked onto the first roller (51) ; subsequently transferring the IC chips (11) sucked onto the first roller (51) to a second roller (52); and subsequently mounting the IC chips (11) transferred to the second roller (52) on the traveling base (13).

摘要翻译： 本发明提供了一种用于将两个或更多IC芯片（11）安装在基座（13）上的IC芯片（11）安装方法，包括：通过在其表面上安装带（30）来准备晶片（10） 是具有待安装到基座（13）的安装表面的晶片（10）的反面，并且通过在离开带（30）的同时通过切割将晶片（10）分成IC芯片（11）; 将晶片（10）上的IC芯片（11）顺序地压靠在第一辊（51）上以允许芯片（11）被吸附到第一辊（51）上; 随后将吸附到第一辊（51）上的IC芯片（11）传送到第二辊（52）; 随后将传送到第二辊52的IC芯片11安装在移动基座13上。

公开(公告)号：EP1804203B1

公开(公告)日：2010-06-23

申请号：EP06111643.0

申请日：2006-03-23

申请人： FUJITSU LIMITED

发明人： Ishikawa, Naoki, c/o Fujitsu Limited ,  Baba, Shunji, c/o Fujitsu Limited ,  Kira, Hidehiko, c/o Fujitsu Limited ,  Kobayashi, Hiroshi, c/o Fujitsu Limited ,  Matsumura, Takayoshi, c/o Fujitsu Limited

IPC分类号： G06K19/077 ,  H01Q1/22

CPC分类号： G06K19/07749 ,  G06K19/077 ,  G06K19/07728 ,  H01Q1/2208 ,  H01Q9/16 ,  Y10T156/10 ,  Y10T156/1754

公开(公告)号：EP1873691A3

公开(公告)日：2008-09-03

申请号：EP06125049.4

申请日：2006-11-29

申请人： FUJITSU LIMITED

发明人： Kobayashi, Hiroshi, c/o Fujitsu Limited ,  Ishikawa, Naoki, c/o Fujitsu Limited ,  Matsumura, Takayoshi, c/o Fujitsu Limited

IPC分类号： G06K19/077

CPC分类号： G06K19/07749 ,  G06K19/07752 ,  H01L2224/16 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2224/0401

摘要： A method of manufacturing an RFID tag includes a step of preparing a strap (120) having a connecting metal pattern (122) formed on a base (121), and mounted with a circuit chip (11), the pattern connecting the circuit chip to a metal antenna pattern (132). A substrate (130) has a concave section (133) which houses the circuit chip and is formed on a first face. The metal antenna pattern (132) extends over a first face and a second face of a base (131) so as to circle them except for the concave section and to have the two ends positioned across the concave section. The method includes a connection step of positioning and directing the strap and the substrate to house the circuit chip in the concave section and covering the strap and the substrate with a covering material (140) so as to fix the strap and the substrate in a state where the connection metal pattern is connected to the metal antenna pattern.

公开(公告)号：EP0880170A2

公开(公告)日：1998-11-25

申请号：EP98302110.6

申请日：1998-03-20

申请人： FUJITSU LIMITED

发明人： Tsunoi, Kazuhisa, c/o Fujitsu Limited ,  Kira, Hidehiko, c/o Fujitsu Limited ,  Baba, Shunji, c/o Fujitsu Limited ,  Fujii, Akira, c/o Fujitsu Limited ,  Kusagaya, Toshihiro, c/o Fujitsu Limited ,  Kobae, Kenji, c/o Fujitsu Limited ,  Kainuma, Norio, c/o Fujitsu Limited ,  Ishikawa, Naoki, c/o Fujitsu Limited ,  Emoto, Satoshi, c/o Fujitsu Limited

IPC分类号： H01L21/56 ,  H01L21/60

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81001 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00

摘要： A semiconductor device (31) having bumps (36) is to be mounted on a board (33) having pads (34) so that each of the bumps (36) is joined to a corresponding one of the pads (34). Adhesive (39) to be hardened by heat is provided between the semiconductor device (31) and the board (33). The mounting method includes the steps of pressing the bumps (36) of the semiconductor device (31) on the pads (34) of the board (33), and heating a portion in which each of the bumps (36) and a corresponding one of the pads (34) are in contact with each other. A pressure of the bumps (36) to the pads (34) reaches a predetermined value before a temperature of the adhesive (39) to which heat is supplied in the above step reaches a temperature at which the adhesive (39) is hardened.

摘要翻译： 具有凸块（36）的半导体器件（31）将安装在具有焊盘（34）的板（33）上，使得每个凸块（36）接合到对应的一个焊盘（34）。 在半导体器件（31）和基板（33）之间设置被热硬化的粘合剂（39）。 安装方法包括以下步骤：将半导体器件（31）的凸块（36）按压在板（33）的焊盘（34）上，并且加热其中每个凸起（36）和相应的一个 的焊盘（34）彼此接触。 在上述步骤中供应热量的粘合剂（39）的温度达到粘合剂（39）硬化的温度之前，到焊盘（34）的凸起（36）的压力达到预定值。

公开(公告)号：EP1804203A2

公开(公告)日：2007-07-04

申请号：EP06111643.0

申请日：2006-03-23

申请人： FUJITSU LIMITED

发明人： Ishikawa, Naoki, c/o Fujitsu Limited ,  Baba, Shunji, c/o Fujitsu Limited ,  Kira, Hidehiko, c/o Fujitsu Limited ,  Kobayashi, Hiroshi, c/o Fujitsu Limited ,  Matsumura, Takayoshi, c/o Fujitsu Limited

IPC分类号： G06K19/077

CPC分类号： G06K19/07749 ,  G06K19/077 ,  G06K19/07728 ,  H01Q1/2208 ,  H01Q9/16 ,  Y10T156/10 ,  Y10T156/1754

摘要： The present invention relates to an RFID tag performing exchange of information with an external device without contact, and is to improve the resistance to bending while avoiding an increase in the thickness of the RFID tag. A circuit chip (11) is bonded to a base portion (131) of a base (13) with a thermosetting adhesive. The base is folded, and an ultraviolet curing adhesive is applied on the circuit chip. The fold-back portions (132; 133) of the base are folded back onto the circuit chip, to which portions ultraviolet light is irradiated, as a result, both of the surfaces of the circuit chip are bonded to the base with the adhesives.

摘要翻译： RFID标签技术领域本发明涉及RFID标签，其与外部设备进行信息交换而不接触，并且提高抗弯曲性，同时避免RFID标签的厚度增加。 电路芯片（11）用热固性粘合剂结合到基座（13）的基部（131）上。 折叠底座，并在电路芯片上施加紫外线固化粘合剂。 底座的折回部分（132; 133）折回到照射部分紫外线的电路芯片上，结果，电路芯片的两个表面都用粘合剂粘合到基底上。

公开(公告)号：EP1873691B1

公开(公告)日：2013-06-26

申请号：EP06125049.4

申请日：2006-11-29

申请人： FUJITSU LIMITED

发明人： Kobayashi, Hiroshi, c/o Fujitsu Limited ,  Ishikawa, Naoki, c/o Fujitsu Limited ,  Matsumura, Takayoshi, c/o Fujitsu Limited

IPC分类号： G06K19/077

CPC分类号： G06K19/07749 ,  G06K19/07752 ,  H01L2224/16 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2224/0401

摘要： A method of manufacturing an RFID tag includes a step of preparing a strap (120) having a connecting metal pattern (122) formed on a base (121), and mounted with a circuit chip (11), the pattern connecting the circuit chip to a metal antenna pattern (132). A substrate (130) has a concave section (133) which houses the circuit chip and is formed on a first face. The metal antenna pattern (132) extends over a first face and a second face of a base (131) so as to circle them except for the concave section and to have the two ends positioned across the concave section. The method includes a connection step of positioning and directing the strap and the substrate to house the circuit chip in the concave section and covering the strap and the substrate with a covering material (140) so as to fix the strap and the substrate in a state where the connection metal pattern is connected to the metal antenna pattern.