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    Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
    2.
    发明公开
    Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink 有权
    导热基板压装在PC板孔中，用于将热量从IC传递到散热器

    公开(公告)号：EP0913861A3

    公开(公告)日：1999-07-28

    申请号：EP98307725.6

    申请日：1998-09-23

    Applicant: Hewlett-Packard Company

    Inventor： Rubens, Paul A. ,  Gilson, Charlie W. ,  Spreadbury, Brian G. ,  Irmscher, Horst F. ,  Jondrow, Tim J.

    IPC: H01L21/48

    CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4006 ,  H01L24/50 ,  H01L2924/14 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2203/0191 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00

    Abstract: A heat conductive substrate (50) is mounted within a through-opening (60) of a printed circuit board (52). An integrated circuit (42) then is mounted to one side of the heat conductive substrate, while a heat sink (90) is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions (71) of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap (75) occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery (67) of the substrate.

    Abstract translation: 导热基板（50）安装在印刷电路板（52）的通孔（60）内。 然后将集成电路（42）安装到导热衬底的一侧，同时将散热器（90）固定成与衬底的另一侧热接触。 IC和PC板之间没有直接的热接触。 通过对基板的多个部分（71）的正常表面施加受控压力，将导热基板安装到PC板。 这种压力减小了厚度并扩大了将衬底锁定到PC板上的受压部分的面积。 除了基板的受压区域之外，在基板和PC板之间的任何地方都会出现气隙（75）。 这种受压区域沿着衬底的周边（67）出现。

    Heat conductive substrate press-mounted in printed circuit board hole for transferring heat from integrated circuit to heat sink
    3.
    发明公开
    Heat conductive substrate press-mounted in printed circuit board hole for transferring heat from integrated circuit to heat sink 审中-公开
    要传输的压装在一个印刷电路板的热量的开口从集成电路到散热器的热传导基板

    公开(公告)号：EP1496546A2

    公开(公告)日：2005-01-12

    申请号：EP04076633.9

    申请日：1998-09-23

    Applicant: Hewlett-Packard Company

    Inventor： Rubens, Paul A. ,  Gilson, Charlie W. ,  Spreadbury, Brian G. ,  Irmscher, Horst F. ,  Jondrow, Tim J.

    IPC: H01L21/48 ,  H05K1/02

    CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4006 ,  H01L24/50 ,  H01L2924/14 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2203/0191 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00

    Abstract: A heat conductive substrate (50) is mounted within a through-opening (60) of a printed circuit board (52). An integrated circuit (42) then is mounted to one side of the heat conductive substrate, while a heat sink (90) is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions (71) of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap (75) occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery (67) of the substrate.

    Abstract translation: 导热基板（50）安装内的通孔的印刷电路板（52）的（60）。 一种集成电路（42），然后被安装到导热基片的一侧，而一个热沉（90）被固定在热接触于基板的另一侧。 有IC和PCB板之间没有直接的热接触。 导热基板，通过施加受控的压力到衬底的多个部分（71）的正常表面安装到印刷电路板上。 搜索压力减小厚度和扩展被按压部锁定基板到PC板的面积。 的空气间隙（75）的基片与PC板间的发生到处除了基板的按压区域。 搜索被按压区域沿所述基板的周缘（67）好发。

    Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
    4.
    发明公开
    Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink 有权
    要传输的压装在一个印刷电路板的热从IC到散热器的开口导热基板

    公开(公告)号：EP0913861A2

    公开(公告)日：1999-05-06

    申请号：EP98307725.6

    申请日：1998-09-23

    Applicant: Hewlett-Packard Company

    Inventor： Rubens, Paul A. ,  Gilson, Charlie W. ,  Spreadbury, Brian G. ,  Irmscher, Horst F. ,  Jondrow, Tim J.

    IPC: H01L21/48

    CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4006 ,  H01L24/50 ,  H01L2924/14 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2203/0191 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00

    Abstract: A heat conductive substrate (50) is mounted within a through-opening (60) of a printed circuit board (52). An integrated circuit (42) then is mounted to one side of the heat conductive substrate, while a heat sink (90) is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions (71) of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap (75) occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery (67) of the substrate.

    Abstract translation: 导热基板（50）安装内的通孔的印刷电路板（52）的（60）。 一种集成电路（42），然后被安装到导热基片的一侧，而一个热沉（90）被固定在热接触于基板的另一侧。 有IC和PCB板之间没有直接的热接触。 导热基板，通过施加受控的压力到衬底的多个部分（71）的正常表面安装到印刷电路板上。 搜索压力减小厚度和扩展被按压部锁定基板到PC板的面积。 的空气间隙（75）的基片与PC板间的发生到处除了基板的按压区域。 搜索被按压区域沿所述基板的周缘（67）好发。

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