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10 条记录 (耗时 0.012 秒)

    Low dielectric printed circuit boards
    4.
    发明公开
    Low dielectric printed circuit boards 失效
    Leiterplatten mit niedrigerDielektrizitätskonstante。

    公开(公告)号：EP0332834A1

    公开(公告)日：1989-09-20

    申请号：EP89101910.1

    申请日：1989-02-03

    申请人： International Business Machines Corporation

    发明人： Lazzarini, Donald Joseph ,  Wiley, John Pennock ,  Wiley, Robert Taylor

    IPC分类号： H05K3/46

    CPC分类号： H05K1/024 ,  H05K3/4623 ,  H05K2201/015 ,  H05K2201/09536 ,  H05K2203/061 ,  Y10T29/49126

    摘要： The invention features a printed circuit board and a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-­assemblies (10) are first constructed, tested, and then subsequently incorporated into the final circuit board assembly (20) which has a triplate geometry. Dielectric materials are chosen which enhance the performance of the circuit board.

    摘要翻译： 本发明的特征在于印刷电路板和使用模块化技术制造具有低介电材料的印刷电路板的方法。 子组件（10）首先被构造，测试，然后被并入到具有三板几何形状的最终电路板组件（20）中。 选择提高电路板性能的电介质材料。

    Multilayer circuit board and method of manufacture therefor
    7.
    发明公开
    Multilayer circuit board and method of manufacture therefor 失效
    Mehrschicht-Leiterplatte sowie Verfahren zu ihrer Herstellung。

    公开(公告)号：EP0264617A1

    公开(公告)日：1988-04-27

    申请号：EP87113464.9

    申请日：1987-09-15

    申请人： International Business Machines Corporation

    发明人： Hoffarth, Joseph Gerard ,  Lazzarini, Donald Joseph ,  Welsh, John Andrew ,  Wiley, John Pennock

    IPC分类号： H05K3/46

    CPC分类号： H05K3/4673 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2203/066

    摘要： A multilayer circuit board (10) having a conformal layer (14) of an insulating material separating a circuit core (11) from an adjacent insulating layer is disclosed. The conformal layer (14) encapsulates the substrate (12) and conductive pattern of circuit lines (13) in the circuit core, thereby reducing failures caused by impurities trapped during lamination. The multilayer circuit board is manufactured by coating at least one circuit core with the conformal layer of insulating material before final lamination of the circuit cores into a multilayer circuit board.

    摘要翻译： 公开了一种具有将电路芯（11）与相邻绝缘层分离的绝缘材料的保形层（14）的多层电路板（10）。 保形层（14）将电路芯中的衬底（12）和电路线（13）的导电图案封装在一起，从而减少在层压期间被杂质捕获的故障。 多层电路板通过在将电路芯最终层压成多层电路板之前，用绝缘材料的保形层涂覆至少一个电路芯。

    High performance circuit boards
    10.
    发明公开
    High performance circuit boards 失效
    Hochleistungsleiterplatten。

    公开(公告)号：EP0331909A1

    公开(公告)日：1989-09-13

    申请号：EP89101916.8

    申请日：1989-02-03

    申请人： International Business Machines Corporation

    发明人： Hoffarth, Joseph Gerard ,  Wiley, John Pennock

    IPC分类号： H05K3/46

    CPC分类号： H05K3/4641 ,  H05K1/024 ,  H05K1/036 ,  H05K3/427 ,  H05K3/429 ,  H05K3/445 ,  H05K2201/015 ,  H05K2201/0187 ,  H05K2201/0195 ,  Y10T29/49126

    摘要： The invention relates to laminated printed circuit boards and to a method of fabricating a printed circuit board having improved circuit board performance. The circuit board utilizes low dielectric materials having dielectric constants of less than 3.0. The dielectric layers (12a,12b) are spaced apart from plated through-holes, thus eliminating the interface between the metallized surface (16) of the through-hole (15) and the dielectric sheet (12). Thus, the low dielectric layer is not required to be plated.
    The lower dielectric character of the laminates improves wiring density, circuit speed, and provides for thinner laminates and cores.

    摘要翻译： 本发明涉及层压印刷电路板以及制造具有改进的电路板性能的印刷电路板的方法。 电路板使用具有小于3.0的介电常数的低介电材料。 电介质层（12a，12b）与电镀通孔间隔开，从而消除了通孔（15）的金属化表面（16）与电介质片（12）之间的界面。 因此，不需要对低介电层进行电镀。 层压板的较低介电特性提高了布线密度，电路速度，并提供了较薄的层压板和芯。