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12 条记录 (耗时 0.011 秒)

    Matrix-addressed smectic liquid crystal display device
    1.
    发明公开
    Matrix-addressed smectic liquid crystal display device 失效
    矩阵寻址型液晶显示器件

    公开(公告)号：EP0113414A3

    公开(公告)日：1987-04-29

    申请号：EP83111646

    申请日：1983-11-22

    申请人： International Business Machines Corporation

    发明人： Depp, Steven Wade ,  Eldridge, Jerome Michael ,  Juliana, Anthony, Jr. ,  Lee, Michael Heino

    IPC分类号： G02F01/133 ,  G09G03/36

    CPC分类号： G02F1/132 ,  G02F1/133345 ,  G09G3/3603 ,  G09G3/3622

    摘要： A matrix-addressed smectic liquid display device (MASD) comprises a smetic liquid crystal material confined between a pair of closely spaced apart substrates (16, 18) of transparent insulating material. A first array of spaced highly conductive row lines (30) is disposed on a transparent highly resistive thin film (32) deposited on the interior surface (34) of one of the substrates (16). A second array of spaced column lines (26) is disposed on the interior surface (28) of the other substrate (18). Circuit means (40, 48, 50, 52) are provided to drive both ends of selected row electrodes with a voltage source to cause heating of the area of the highly resistive transparent material between the selected row line and an adjacent row line which has a reference potential connected to both ends. The heating causes the adjacent liquid crystal material to change from the smectic to at least the nematic state. A source of image signals (42) is coupled (44, 46, 54) to the column lines (26) as the liquid crystal material is cooling to selectively produce a clear or scattered state in the liquid crystal material. The row lines (30) are sequentially energized in conjunction with the appropriate image data to produce a desired display image.

    摘要翻译： 矩阵寻址的近晶液体显示装置（MASD）包括限制在一对间隔开的透明绝缘材料的基板（16,18）之间的粘液液晶材料。 间隔的高度导电的行线（30）的第一阵列布置在沉积在一个基板（16）的内表面（34）上的透明高电阻薄膜（32）上。 间隔列线（26）的第二阵列布置在另一基底（18）的内表面（28）上。 设置电路装置（40,48,50,52）以用电压源来驱动所选择的行电极的两端，以使得所选择的行线与相邻行线之间的高电阻透明材料区域的加热具有 参考电位连接到两端。 加热使得相邻的液晶材料从近晶形变化到至少向列态。 当液晶材料冷却以选择性地在液晶材料中产生透明或散射状态时，图像信号源42被耦合到列线26。 结合适当的图像数据，行行（30）被依次通电以产生期望的显示图像。

    A cooling system for integrated circuit chips
    8.
    发明公开
    A cooling system for integrated circuit chips 失效
    集成电路板冷却系统

    公开(公告)号：EP0168677A3

    公开(公告)日：1987-04-01

    申请号：EP85107734

    申请日：1985-06-24

    申请人： International Business Machines Corporation

    发明人： Eastman, Dean Eric ,  Eldridge, Jerome Michael ,  Petersen, Kurt Edward ,  Olive, Graham

    IPC分类号： H01L23/42 ,  H01L23/46

    CPC分类号： H01L23/4332 ,  F28F9/0278 ,  H01L23/473 ,  H01L2224/16 ,  H01L2924/3011

    摘要： The drawing shows a cooling system for use in a "flip chip packaging" environment where a large scale integrated circuit chip is mounted in an inverted position on a ceramic substrate and presents a flat upwardly facing cooling surface. The system comprises a silicon plate (18) having a plain lower surface which is attached (e.g. by solder) to the upper surface of the inverted chip to be cooled. The upper surface of the plate (18) is formed with a multiplicity of parallel grooves (20) which register with slots (22A) formed through a second plate (22) sealed to the plate (18). A third plate overlying and sealed to the plate (22) has an inlet port (24C) which communicates with the central slot (22A) and outlet passages (24A) which communicate with the end slots (22a). The port (24A) registers with the outlet end of a flexible bellows pipe (28) through which coolant fluid is supplied to the grooves (20) and the outlet ports (248) of the passages (24A) register with the inlet end of an annular duct formed between the bellows pipe (28) and a co-axial encircling second flexible bellows pipe (32) and through which heated coolant fluid is removed from the grooves (20).

    A cooling system for integrated circuit chips
    10.
    发明公开
    A cooling system for integrated circuit chips 失效
    Kühlungssystemfürintegrierte Schaltungschips。

    公开(公告)号：EP0168677A2

    公开(公告)日：1986-01-22

    申请号：EP85107734.7

    申请日：1985-06-24

    申请人： International Business Machines Corporation

    发明人： Eastman, Dean Eric ,  Eldridge, Jerome Michael ,  Petersen, Kurt Edward ,  Olive, Graham

    IPC分类号： H01L23/42 ,  H01L23/46

    CPC分类号： H01L23/4332 ,  F28F9/0278 ,  H01L23/473 ,  H01L2224/16 ,  H01L2924/3011

    摘要： The drawing shows a cooling system for use in a "flip chip packaging" environment where a large scale integrated circuit chip is mounted in an inverted position on a ceramic substrate and presents a flat upwardly facing cooling surface. The system comprises a silicon plate (18) having a plain lower surface which is attached (e.g. by solder) to the upper surface of the inverted chip to be cooled. The upper surface of the plate (18) is formed with a multiplicity of parallel grooves (20) which register with slots (22A) formed through a second plate (22) sealed to the plate (18). A third plate overlying and sealed to the plate (22) has an inlet port (24C) which communicates with the central slot (22A) and outlet passages (24A) which communicate with the end slots (22a). The port (24A) registers with the outlet end of a flexible bellows pipe (28) through which coolant fluid is supplied to the grooves (20) and the outlet ports (248) of the passages (24A) register with the inlet end of an annular duct formed between the bellows pipe (28) and a co-axial encircling second flexible bellows pipe (32) and through which heated coolant fluid is removed from the grooves (20).

    摘要翻译： 该图示出了在“倒装芯片封装”环境中使用的冷却系统，其中大规模集成电路芯片安装在陶瓷基板上的倒置位置并且呈现平坦的面向上的冷却表面。 该系统包括具有平坦下表面的硅板（18），该平板下表面（例如通过焊料）附接到待冷却的倒置芯片的上表面。 板（18）的上表面形成有多个平行的槽（20），其与通过密封到板（18）的第二板（22）形成的槽（22A）对准。 覆盖并密封到板（22）的第三板具有与中心狭槽（22A）连通的入口（24C）和与端槽（22a）连通的出口通道（24A）。 端口（24A）与柔性波纹管（28）的出口端对准，冷却剂流体通过该出口端供应到凹槽（20），并且通道（24A）的出口（24B）与入口端 环形管道形成在波纹管（28）和同轴环绕的第二柔性波纹管（32）之间，并且加热的冷却剂流体从槽（20）移除。