公开(公告)号：EP3070135A4

公开(公告)日：2017-04-05

申请号：EP14862999

申请日：2014-11-17

申请人： LG CHEMICAL LTD

发明人： PARK YONG SU ,  LEE HUI JE ,  KIM HYUN CHEOL ,  KWON YOON KYUNG ,  PARK HYON GYU ,  KIM HAK LIM ,  LEE DAE HYUCK ,  JUNG SAY YOUNG

IPC分类号： C09J133/06 ,  C08G18/62 ,  C09J7/02 ,  C09J175/04 ,  H01B5/14

CPC分类号： C09J133/14 ,  B32B7/12 ,  B32B27/30 ,  B32B2255/26 ,  B32B2307/202 ,  B32B2405/00 ,  B32B2457/00 ,  C08G18/246 ,  C08G18/6229 ,  C08G18/724 ,  C08G18/73 ,  C08G18/7621 ,  C08G2170/40 ,  C09J133/06 ,  C09J133/066 ,  C09J175/04 ,  Y10T428/1462 ,  Y10T428/2848 ,  Y10T428/2891 ,  Y10T428/31938 ,  C08F2220/1858 ,  C08F220/20

摘要： Provided are a pressure sensitive adhesive composition, a conductive laminate protective film, and a conductive laminate. A cured product of the pressure sensitive adhesive composition according to the present application constitutes a pressure sensitive adhesive layer attached on a hard coating surface of a conductive laminate or the like, so that a surface of the conductive laminate or the like can be protected as well as that a peeling force can be maintained appropriately regardless of a peeling rate even after a heat treatment for sintering, and thus can be used for a protective film.

摘要翻译： 本发明提供压敏粘合剂组合物，导电层压保护膜和导电层压体。 根据本申请的压敏粘合剂组合物的固化产物构成附着在导电叠层等的硬涂层表面上的压敏粘合剂层，从而也可以保护导电叠层等的表面 因为即使在烧结热处理之后，无论剥离率如何都可适当地保持剥离力，因此可用于保护膜。

公开(公告)号：EP2930218A4

公开(公告)日：2016-08-03

申请号：EP14814577

申请日：2014-06-18

申请人： LG CHEMICAL LTD

发明人： PARK YONG SU ,  YANG SE WOO ,  CHANG SUK KY ,  PARK MIN SOO ,  PARK EUN SUK

IPC分类号： C09J4/00 ,  C09J133/06 ,  C09J175/04 ,  G02B5/30 ,  G02F1/13

CPC分类号： C09J133/06 ,  C08G2170/40 ,  C09J4/00 ,  C09J7/0217 ,  C09J7/385 ,  C09J133/066 ,  C09J175/04 ,  C09J2203/318 ,  C09J2433/00 ,  G02B1/04 ,  G02B5/3033 ,  G02F1/133528 ,  G02F2202/28 ,  C08F220/06 ,  C08L33/08 ,  C08F2220/1825 ,  C08F220/20 ,  C08F220/14

摘要： Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive optical laminate, a pressure-sensitive adhesive polarizing plate and a display device. The pressure-sensitive adhesive composition offers a pressure-sensitive adhesive that has excellent durability and processability in manufacturing due to increased hardness even when the pressure-sensitive adhesive layer is formed thinner than a typical adhesive composition, and that can prevent a pressure mark and leakage of the pressure-sensitive adhesive, as well as a bending problem generated when applied on an optical member such as a polarizing plate, etc.

摘要翻译： 提供压敏粘合剂组合物，压敏粘合剂光学层压体，压敏粘合剂偏振片和显示装置。 压敏粘合剂组合物提供了一种压敏粘合剂，即使当压敏粘合剂层形成得比典型的粘合剂组合物薄时，由于硬度的提高，在制造中具有优异的耐久性和加工性，并且可以防止压痕和渗漏 的压敏粘合剂，以及当施加在诸如偏振片等的光学构件上时产生的弯曲问题。

公开(公告)号：EP2490251A4

公开(公告)日：2016-10-05

申请号：EP09850414

申请日：2009-10-16

申请人： LG CHEMICAL LTD

发明人： JOO HYO SOOK ,  CHANG SUK KY ,  PARK HYO SOON ,  HONG JONG WAN ,  CHO HYUN JU ,  KIM JANG SOON ,  PARK YONG SU

IPC分类号： H01L21/58

CPC分类号： H01L24/83 ,  C08G2650/40 ,  C08L71/00 ,  C08L79/08 ,  C08L81/06 ,  C09J7/20 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/85 ,  H01L2221/68327 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/451 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/0106 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  Y10T428/24959 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/48 ,  H01L2224/45099

摘要： Provided are a die attach film, a semiconductor wafer, and a semiconductor packaging method. The die attach film can prevent generation of burrs or scattering of chips in a dicing process, and exhibits excellent expandability and pick-up characteristics in a die pressure-sensitive adhesive process. Further, the die attach film can prevent release, shifting, or deflection of a chip in a wire pressure-sensitive adhesive or molding process. Thus, it is possible to improve embeddability, inhibit warpage of a wafer or wiring substrate, and enhance productivity in a semiconductor packaging process.