Method of forming micropatterns
    6.
    发明公开
    Method of forming micropatterns 失效
    形成微孔的方法

    公开(公告)号:EP0595361A3

    公开(公告)日:1997-04-02

    申请号:EP93117627.5

    申请日:1993-10-29

    IPC分类号: G03F7/004 G03F7/039

    CPC分类号: G03F7/0045 G03F7/40

    摘要: The surface of a semiconductor substrate is coated with a chemical amplification resist composed of a radiosensitive material containing, as its main component, a polymer or monomolecular compound in which at least a part of phenol hydroxyl groups are substituted by protecting groups that are easily eliminated by the action of an acid. Next, said chemical amplification resist is exposed to light or irradiated with a radioactive ray and then developed, thereby forming a resist pattern. Next, the entire surface of said resist pattern is irradiated with a radioactive ray, while maintaining the temperature of the semiconductor substrate in the range not higher than the glass transition point of said chemical amplification resist, so as to eliminate the protecting groups contained in said chemical amplification resist, thereby improving the heat resistance of said resist pattern.

    摘要翻译: 半导体衬底的表面涂覆有由放射敏感材料构成的化学放大抗蚀剂,其包含作为其主要成分的聚合物或单分子化合物,其中至少部分酚羟基被保护基团取代,所述基团易于被 酸的作用。 接下来,将所述化学增幅抗蚀剂曝光或用放射线照射,然后显影,从而形成抗蚀剂图案。 接下来,在将半导体衬底的温度保持在不高于所述化学放大抗蚀剂的玻璃化转变点的范围内的状态下,用放射线照射所述抗蚀剂图案的整个表面,以消除所述抗蚀图案中包含的保护基 化学放大抗蚀剂,从而提高所述抗蚀剂图案的耐热性。

    Method of forming micropatterns
    8.
    发明公开
    Method of forming micropatterns 失效
    Verfahren zur Herstellung vonwärmebeständigenMikrobildern。

    公开(公告)号:EP0595361A2

    公开(公告)日:1994-05-04

    申请号:EP93117627.5

    申请日:1993-10-29

    IPC分类号: G03F7/004 G03F7/039

    CPC分类号: G03F7/0045 G03F7/40

    摘要: The surface of a semiconductor substrate is coated with a chemical amplification resist composed of a radiosensitive material containing, as its main component, a polymer or monomolecular compound in which at least a part of phenol hydroxyl groups are substituted by protecting groups that are easily eliminated by the action of an acid. Next, said chemical amplification resist is exposed to light or irradiated with a radioactive ray and then developed, thereby forming a resist pattern. Next, the entire surface of said resist pattern is irradiated with a radioactive ray, while maintaining the temperature of the semiconductor substrate in the range not higher than the glass transition point of said chemical amplification resist, so as to eliminate the protecting groups contained in said chemical amplification resist, thereby improving the heat resistance of said resist pattern.

    摘要翻译: 半导体衬底的表面涂覆有由放射敏感材料构成的化学放大抗蚀剂,其包含作为其主要成分的聚合物或单分子化合物,其中至少部分酚羟基被保护基团取代,所述基团易于被 酸的作用。 接下来,将所述化学增幅抗蚀剂曝光或用放射线照射,然后显影,从而形成抗蚀剂图案。 接下来,在将半导体衬底的温度保持在不高于所述化学放大抗蚀剂的玻璃化转变点的范围内的状态下,用放射线照射所述抗蚀剂图案的整个表面,以消除所述抗蚀图案中包含的保护基 化学放大抗蚀剂,从而提高所述抗蚀剂图案的耐热性。