Abstract:
The present invention provides a method for manufacturing a composite piezoelectric substrate capable of forming an ultrathin piezoelectric film having a uniform thickness by efficiently using a piezoelectric material. a) A piezoelectric substrate (2) and a supporting substrate (10) are prepared, b) ions are implanted from a surface (2a) of the piezoelectric substrate (2) to form a defective layer (4) in a region having a predetermined depth from the surface (2a) of the piezoelectric substrate (2), c) impurities adhering to at least one of the surface (2a) of the piezoelectric substrate (2) in which the defective layer (4) is formed and a surface (10a) of the supporting substrate (1) are removed to directly expose the constituent atoms of the surfaces (2a and 10a) and activate them, d) the supporting substrate (10) is bonded to the surface (2a) of the piezoelectric substrate (2) to form a substrate bonded body (40), e) the substrate bonded body (40) is separated at the defective layer (4) formed in the piezoelectric substrate (2) so that a separation layer (3) between the surface (2a) of the piezoelectric substrate (2) and the defective layer (4) is separated from the piezoelectric substrate (2) and bonded to the supporting substrate (10) to form a composite piezoelectric substrate (30), and f) the surface (3a) of the separation layer (3) of the composite piezoelectric substrate (30) is smoothed.
Abstract:
An elastic wave device is provided that not only offers an increased acoustic velocity but also is insusceptible to the spurious responses of other wave modes and a method for producing such an elastic wave device. An elastic wave device has a lithium niobate film (5) and uses an SH surface acoustic wave. The elastic wave device (1) has a supporting substrate (2), a high-acoustic-velocity film (3) formed on the supporting substrate (2) and configured so that the acoustic velocity of the propagating bulk wave is higher than the acoustic velocity of the elastic wave that propagates on the lithium niobate film (5), a low-acoustic-velocity film (4) stacked on the high-acoustic-velocity film (3) and configured so that the acoustic velocity of the propagating bulk wave is lower than the acoustic velocity of the bulk wave that propagates in the lithium niobate film (5), the lithium niobate film (5) stacked on the low-acoustic-velocity film (4), and an IDT electrode (6) formed on either side of the lithium niobate film (5). When the lithium niobate film (5) has Euler angles of (0°±5°, θ, 0°), θ is in the range of 0° to 8° and 57° to 180°.
Abstract:
A boundary acoustic wave device in which a first medium to a fourth medium are laminated and an electrode is disposed between a first medium and a second medium is provided, wherein the boundary acoustic wave device has a small absolute value of temperature coefficient of delay time and good temperature characteristics. A boundary acoustic wave device (1) in which a first medium (11) to fourth medium (14) are laminated in that order and, an electrode including an IDT electrode (16) is disposed at an interface between the first medium (11) and the second medium (12), and in a structure formed by laminating the fourth medium (14)/the second medium (12)/the electrode/the first medium (11), the temperature coefficient of delay time TCD of a boundary acoustic wave takes on a positive value, the fourth medium or the second medium has a positive temperature coefficient of sound velocity TCV, the first medium (11) has a negative temperature coefficient of sound velocity TCV, and the sound velocity of transverse wave of the third medium (13) is specified to be smaller than the sound velocity of transverse wave of the fourth medium (14) and/or the second medium (12).
Abstract:
The present invention provides a method for manufacturing a composite piezoelectric substrate capable of forming an ultrathin piezoelectric film having a uniform thickness by efficiently using a piezoelectric material. a) A piezoelectric substrate (2) and a supporting substrate (10) are prepared, b) ions are implanted from a surface (2a) of the piezoelectric substrate (2) to form a defective layer (4) in a region having a predetermined depth from the surface (2a) of the piezoelectric substrate (2), c) impurities adhering to at least one of the surface (2a) of the piezoelectric substrate (2) in which the defective layer (4) is formed and a surface (10a) of the supporting substrate (1) are removed to directly expose the constituent atoms of the surfaces (2a and 10a) and activate them, d) the supporting substrate (10) is bonded to the surface (2a) of the piezoelectric substrate (2) to form a substrate bonded body (40), e) the substrate bonded body (40) is separated at the defective layer (4) formed in the piezoelectric substrate (2) so that a separation layer (3) between the surface (2a) of the piezoelectric substrate (2) and the defective layer (4) is separated from the piezoelectric substrate (2) and bonded to the supporting substrate (10) to form a composite piezoelectric substrate (30), and f) the surface (3a) of the separation layer (3) of the composite piezoelectric substrate (30) is smoothed.
Abstract:
A surface acoustic wave device is provided which can adjust a band width without connecting an additional capacity, and which has a sufficiently small propagation loss. In a surface acoustic wave device (1), a plurality of surface acoustic wave elements (2 and 3) are made of piezoelectric bodies (4) having the same Cut-Angle. In the surface acoustic wave elements (2 and 3), a propagation azimuth (X1) of a surface acoustic wave in at least one surface acoustic wave element (2) is different from a propagation azimuth (X2) of a surface acoustic wave in at least another one surface acoustic wave element (3). In each of the surface acoustic wave elements (2 and 3), a confinement layer (12) for confining the surface acoustic wave inside the piezoelectric body (4) is disposed on the piezoelectric body (4) at the side opposite to the side where an electrode is formed.
Abstract:
Provided is an elastic wave device in which variations in frequency characteristics are unlikely to occur and the electromechanical coupling coefficient k 2 can be enhanced regardless of variations in the thickness of a piezoelectric body. An elastic wave device (1) includes a medium layer (3), a piezoelectric body (4), and an IDT electrode (5) that are disposed on a supporting substrate (2). The medium layer (3) is made of a medium containing a low-velocity medium in which the propagation velocity of the same bulk wave as that which is a main vibration component of an elastic wave propagating in the piezoelectric body and being used is lower than the propagation velocity of the elastic wave, and a high-velocity medium in which the propagation velocity of the same bulk wave as that which is a main vibration component of the elastic wave is higher than the propagation velocity of the elastic wave.
Abstract:
Provided is an elastic wave device which can be used at high frequencies and in which the Q factor can be enhanced. An elastic wave device (1) includes a supporting substrate (2); a high-acoustic-velocity film (3) stacked on the supporting substrate (2), in which the acoustic velocity of a bulk wave propagating therein is higher than the acoustic velocity of an elastic wave propagating in a piezoelectric film (5); a low-acoustic-velocity film (4) stacked on the high-acoustic-velocity film (3), in which the acoustic velocity of a bulk wave propagating therein is lower than the acoustic velocity of a bulk wave propagating in the piezoelectric film (5); the piezoelectric film (5) stacked on the low-acoustic-velocity film (4); and an IDT electrode (6) stacked on a surface of the piezoelectric film (5).