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公开(公告)号:EP1537249A4
公开(公告)日:2007-07-11
申请号:EP03754452
申请日:2003-09-05
申请人: OLIN CORP , WIELAND WERKE AG
发明人: CARON RONALD N , ROBINSON PETER W , TYLER DEREK E , BOEGEL ANDREAS , KUHN HANS-ACHIM , SEEGER JOERG
摘要: An age-hardening copper-base alloy and processing method to make a commercially useful strip product for applications requiring high yield strength and moderately high electrical conductivity, in a strip, plate, wire, foil, tube, powder or cast form. The alloys are particularly suited for use in electrical connectors and interconnections. The alloys contain Cu-Ti-X where X is selected from Ni, Fe, Sn, P, Al, Zn, Si, Pb, Be, Mn, Mg, Ag, As, Sb, Zr, B, Cr and Co. and combinations thereof. The alloys offer excellent combinations of yield strength, and electrical conductivity, with excellent stress relaxation resistance. The yield strength is at least of 724 MPa (105 ksi) and the electrical conductivity is at least 50% IACS.
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公开(公告)号:EP1520054A4
公开(公告)日:2007-03-07
申请号:EP03763072
申请日:2003-07-01
申请人: OLIN CORP , WIELAND WERKE AG
发明人: MANDIGO FRANK N , ROBINSON PETER W , TYLER DEREK E , BOEGEL ANDREAS , KUHN HANS-ACHIM , KEPPELER FRANK M , SEEGER JOERG
CPC分类号: C22F1/08 , C22C9/06 , H01L23/49579 , H01L2924/0002 , H01R13/03 , H01L2924/00
摘要: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1 % of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting (10) the copper alloy; (b). hot working (12) the cast copper-base alloy to effect a first reduction in cross-sectional area; (c). solutionizing (14) the cast copper-base alloy at a temperature and for a time effective to substantially form a single phase alloy; (d). first age annealing (18) the alloy at a temperature and for a time effective to precipitate an amount of a second phase effective to form a multi-phase alloy having silicides; (e). cold working (20) the multi-phase alloy to effect a second reduction in cross-sectional area; and (f). second age annealing (22) the multiphase alloy at a temperature and for a time effective to precipitate additional silicides thereby raising conductivity, wherein the second age annealing temperature is less than the first age annealing temperature.
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公开(公告)号:EP3158095A4
公开(公告)日:2017-04-26
申请号:EP08864853
申请日:2008-12-19
申请人: GBC METALS LLC , WIELAND-WERKE AG
发明人: MUTSCHLER RALPH A , ROBINSON PETER WILLIAM , TYLER DEREK E , KAUFLER ANDREA , KUHN HANS ACHIM , HOFMANN UWE
摘要: A copper base alloy having an improved combination of yield strength and electrical conductivity consisting essentially of between about 1.0 and about 6.0 weight percent Ni, up to about 3.0 weight percent Co, between about 0.5 and about 2.0 weight percent Si, between about 0.01 and about 0.5 weight percent Mg, up to about 1.0 weight percent Cr, up to about 1.0 weight percent Sn, and up to about 1.0 weight percent Mn, the balance being copper and impurities, the alloy processed to have a yield strength of at least about 137 ksi, and an electrical conductivity of at least about 25% IACS.
摘要翻译: 一种具有改进的屈服强度和电导率组合的铜基合金,其基本上由约1.0至约6.0重量%的Ni,至多约3.0重量%的Co,约0.5至约2.0重量%的Si,约0.01至约 0.5重量%的Mg,至多约1.0重量%的Cr,至多约1.0重量%的Sn和至多约1.0重量%的Mn,余量为铜和杂质,合金的加工屈服强度为至少约137 ksi,电导率至少约为25%IACS。
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公开(公告)号:EP0953139A4
公开(公告)日:2000-12-27
申请号:EP98902435
申请日:1998-01-15
申请人: OLIN CORP
发明人: ROBINSON PETER W , MRAVIC BRIAN , TYLER DEREK E
IPC分类号: B22F1/00 , F42B7/04 , F42B12/74 , F42B1/00 , B22F3/12 , C22C1/04 , C22C33/02 , F42B7/00 , F42B8/00 , F42B8/14 , F42B12/72
CPC分类号: B22F1/0003 , B22F2998/10 , F42B7/046 , F42B12/74 , B22F3/20 , B22F3/1035 , B22F3/12
摘要: There is provided a lead-free projectile (10), such as a bullet or a ballistic shot, formed by liquid phase sintering or liquid phase bonding of a first particulate (12) having a density greater than lead, a second, ductile, particulate (14) having a melting temperature in excess of 400 °C and a binder (16) having a fluidity temperature that is less than the melting temperature of the second particulate (14). Unlike solid phase sintering that tends to produce articles having a porosity of about 20 %, by volume, liquid phase sintering and liquid phase bonding achieve close to 0 % porosity. Reducing the porosity level decreases the amount of high density, first particulate (12), required to achieve a density close to that of lead. One suitable composition for the projectile is ferrotungsten-iron-zinc.
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公开(公告)号:EP0771473A4
公开(公告)日:1998-07-15
申请号:EP95924756
申请日:1995-06-29
申请人: OLIN CORP
IPC分类号: H01L23/28 , H01L23/12 , H01L23/29 , H01L23/31 , H01L23/373 , H01L23/433 , H01L23/10 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号: H01L24/32 , H01L23/315 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L2224/2919 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/83856 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H01L2924/1532 , H01L2924/16152 , H01L2924/181 , H01L2924/20752 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/05599
摘要: There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery is approached.
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