公开(公告)号：EP1068037A4

公开(公告)日：2001-11-14

申请号：EP99927076

申请日：1999-05-03

申请人： OLIN CORP

发明人： BUENEMANN MORRIS C JR ,  DIPPOLD JACK D ,  MULDROW HOWARD ,  ROBINSON PETER W ,  MRAVIC BRIAN DI

IPC分类号： B22F1/00 ,  C22C33/02 ,  F42B7/04 ,  B22F9/08 ,  C06B45/02 ,  C22C1/04 ,  F42B5/16

CPC分类号： C22C33/0271 ,  B22F1/0014 ,  B22F1/0088 ,  B22F2998/00 ,  B22F2998/10 ,  C22C33/02 ,  F42B7/046 ,  Y10T428/12028 ,  Y10T428/12104 ,  B22F1/0048 ,  B22F9/082 ,  B22F1/0085

摘要： A relatively high carbon, water-atomized, steel shot is softened via annealing to render it suitable for ballistic use. The annealing preferably includes decarburization from a surface layer or throughout and preferably provides the shot with a surface Knoop hardness of less than 250.

公开(公告)号：EP0953139A4

公开(公告)日：2000-12-27

申请号：EP98902435

申请日：1998-01-15

申请人： OLIN CORP

发明人： ROBINSON PETER W ,  MRAVIC BRIAN ,  TYLER DEREK E

IPC分类号： B22F1/00 ,  F42B7/04 ,  F42B12/74 ,  F42B1/00 ,  B22F3/12 ,  C22C1/04 ,  C22C33/02 ,  F42B7/00 ,  F42B8/00 ,  F42B8/14 ,  F42B12/72

CPC分类号： B22F1/0003 ,  B22F2998/10 ,  F42B7/046 ,  F42B12/74 ,  B22F3/20 ,  B22F3/1035 ,  B22F3/12

摘要： There is provided a lead-free projectile (10), such as a bullet or a ballistic shot, formed by liquid phase sintering or liquid phase bonding of a first particulate (12) having a density greater than lead, a second, ductile, particulate (14) having a melting temperature in excess of 400 °C and a binder (16) having a fluidity temperature that is less than the melting temperature of the second particulate (14). Unlike solid phase sintering that tends to produce articles having a porosity of about 20 %, by volume, liquid phase sintering and liquid phase bonding achieve close to 0 % porosity. Reducing the porosity level decreases the amount of high density, first particulate (12), required to achieve a density close to that of lead. One suitable composition for the projectile is ferrotungsten-iron-zinc.

公开(公告)号：EP1537249A4

公开(公告)日：2007-07-11

申请号：EP03754452

申请日：2003-09-05

申请人： OLIN CORP ,  WIELAND WERKE AG

发明人： CARON RONALD N ,  ROBINSON PETER W ,  TYLER DEREK E ,  BOEGEL ANDREAS ,  KUHN HANS-ACHIM ,  SEEGER JOERG

IPC分类号： C22F1/08 ,  C22C20060101 ,  C22C1/00 ,  C22C9/00 ,  C22C9/06 ,  C22F1/00

CPC分类号： C22C9/06 ,  C22C9/00

摘要： An age-hardening copper-base alloy and processing method to make a commercially useful strip product for applications requiring high yield strength and moderately high electrical conductivity, in a strip, plate, wire, foil, tube, powder or cast form. The alloys are particularly suited for use in electrical connectors and interconnections. The alloys contain Cu-Ti-X where X is selected from Ni, Fe, Sn, P, Al, Zn, Si, Pb, Be, Mn, Mg, Ag, As, Sb, Zr, B, Cr and Co. and combinations thereof. The alloys offer excellent combinations of yield strength, and electrical conductivity, with excellent stress relaxation resistance. The yield strength is at least of 724 MPa (105 ksi) and the electrical conductivity is at least 50% IACS.

公开(公告)号：EP1520054A4

公开(公告)日：2007-03-07

申请号：EP03763072

申请日：2003-07-01

申请人： OLIN CORP ,  WIELAND WERKE AG

发明人： MANDIGO FRANK N ,  ROBINSON PETER W ,  TYLER DEREK E ,  BOEGEL ANDREAS ,  KUHN HANS-ACHIM ,  KEPPELER FRANK M ,  SEEGER JOERG

IPC分类号： C22C9/06 ,  C22F1/00 ,  C22F1/08

CPC分类号： C22F1/08 ,  C22C9/06 ,  H01L23/49579 ,  H01L2924/0002 ,  H01R13/03 ,  H01L2924/00

摘要： A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1 % of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting (10) the copper alloy; (b). hot working (12) the cast copper-base alloy to effect a first reduction in cross-sectional area; (c). solutionizing (14) the cast copper-base alloy at a temperature and for a time effective to substantially form a single phase alloy; (d). first age annealing (18) the alloy at a temperature and for a time effective to precipitate an amount of a second phase effective to form a multi-phase alloy having silicides; (e). cold working (20) the multi-phase alloy to effect a second reduction in cross-sectional area; and (f). second age annealing (22) the multiphase alloy at a temperature and for a time effective to precipitate additional silicides thereby raising conductivity, wherein the second age annealing temperature is less than the first age annealing temperature.

公开(公告)号：EP0882384A4

公开(公告)日：1999-03-24

申请号：EP96923727

申请日：1996-07-09

申请人： OLIN CORP

发明人： ROBINSON PETER W ,  MAHULIKAR DEEPAK ,  HOFFMAN PAUL R

IPC分类号： H01L23/06 ,  H01L23/08 ,  H01L23/13 ,  H01L23/14 ,  H01L23/24 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H05K1/02 ,  H05K3/30 ,  H05K7/20 ,  H05K1/00 ,  H05K1/03 ,  H05K1/16 ,  H05K7/02

CPC分类号： H01L23/13 ,  H01L23/142 ,  H01L23/24 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/49816 ,  H01L24/32 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/0271 ,  H05K3/305 ,  H05K2201/10477 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

摘要： The bending of a ball grid array electronic package (40) having a metallic base (12) is reduced minimizing stresses applied to the innermost row of solder balls (36) when the package base (12) is cyclically heated and cooled. Reducing the stresses applied to the solder balls (36) increases the number of thermal cycles before solder ball (36) fracture causes device (20) failure. Among the means disclosed to reduce the bending moment are a bimetallic (44, 46) composite base, an intergral stiffener (72), a centrally disposed cover (52) bonded to an external structure (30) and a package base (12) with a stress accommodating depressed portion (64).