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公开(公告)号：EP3106742B1
公开(公告)日：2018-03-14
申请号：EP16174093.1
申请日：2016-06-13
Inventor： MUNARIN, Marco , REISS, Martin , ALFIER, Alberto , RIEGER, Thomas
IPC: F21S4/22 , F21V19/00 , F21K9/90 , F21V31/00 , F21V31/04 , F21V15/01 , F21Y103/10 , F21Y115/10
CPC classification number: F21V15/012 , F21S4/22 , F21V15/013 , F21V19/004 , F21V31/005 , F21V31/04 , F21Y2101/00 , F21Y2103/10 , F21Y2115/10
Abstract: A lighting device (10) includes: - a channel-shaped elongate profiled body having a central or web portion (12) and two side portions (120) sidewise of the web portion (12), a profiled body (12, 120) having mutually opposed undercuts (122) opening inwardly of the channel shape of profiled body (12, 120), and - a light radiation source assembly (16) including an elongate support board (16a) carrying one or more light radiation sources, e.g. LED sources (16b), the support board (16a) having longitudinal sides extending into the said undercuts (122), wherein the light radiation source assembly (16) is retained by the channel-shaped profiled body (12, 120). Some embodiments may include: - a first sealing mass (14) located between the web portion (12) of the profiled body (12, 120) and the light radiation source assembly (16), - a second sealing mass (18) on the face of the support board (16a) opposed to the web portion (12) between one and the other said side portions (120).
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公开(公告)号：EP3351852B1
公开(公告)日：2019-10-30
申请号：EP18152940.5
申请日：2018-01-23
Inventor： REISS, Martin , DIDONE', Roberto , PEZZATO, Luigi , BALDO, Lorenzo
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公开(公告)号：EP3594558A1
公开(公告)日：2020-01-15
申请号：EP19175754.1
申请日：2019-05-21
Inventor： BOBBO, Simon , MICHIELAN, Valerio , ZANOTTO, Alberto , REISS, Martin , DIDONE', Roberto , CALLEGARO, Antonio
IPC: F21S4/22 , F21V21/005 , F21V23/00 , F21V31/00 , F21Y103/10 , F21Y115/10
Abstract: A method for installing a lighting device (10), such as, for example, an LED module comprising an elongated body having a first, light-emitting surface (10a) and at least one second rear (10b) or side surface, with an encapsulation layer at the second surface (10b), and a distribution of electrically-powered light radiation sources (12) arranged in the elongated body along the length thereof to project light radiation towards the light-emitting surface (10a).
Electrically-conductive formations (14) are provided for transferring electrical signals with respect to the light radiation sources (12), which pass through one or more passageways (140) in the encapsulation layer (100) at the second surface (10b).-
公开(公告)号：EP2891192A1
公开(公告)日：2015-07-08
申请号：EP13745673.7
申请日：2013-08-07
Applicant: OSRAM GmbH
Inventor： REISS, Martin , SCHWALENBERG, Simon
CPC classification number: H01L33/58 , H01L25/0753 , H01L25/50 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091 , H01L2924/00
Abstract: The present invention relates to a method for producing an LED module and an LED module, by means of which a high out-coupling efficiency and homogeneity of the emitted light can be provided. In the method according to a first aspect of the invention, a housing (26) is initially provided, which has a base side (28) on which a circuit board (36) with at least one LED (32) is arranged. In addition, at least one first base layer (22) made of a curable material is poured in a non-cured state into the housing (26). A scattering layer (24) made of a curable material is also poured into the housing in a non-cured state. The scattering layer (24) is poured onto the first base layer (22), the first base layer (22) not being cured when the scattering layer (24) is poured in, and after the scattering layer (24) is poured in, the at least one first base layer (22) and the scattering layer (24) are cured.
Abstract translation: 各种实施例可以涉及一种用于制造LED模块的方法，包括提供实现为中空主体的壳体，在LED模块的光出射侧具有开口，其中壳体具有基座侧，与光出口 将具有一个LED的电路板布置在壳体的基底侧上，通过开口将非固化状态的可固化材料制成的一个第一基底层倾倒到壳体中，并且在由 处于非固化状态的可固化材料通过开口进入壳体。 将散射层倒入第一基层。 第一基层在散射层的倾倒期间不固化，在散射层倾倒之后，一个第一基层和散射层固化。
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公开(公告)号：EP3093894B1
公开(公告)日：2020-08-05
申请号：EP16168741.3
申请日：2016-05-09
Inventor： REISS, Martin , TREVISANELLO, Lorenzo Roberto , RIEGER, Thomas
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Patent Agency Ranking
公开(公告)号：EP3357661A1
公开(公告)日：2018-08-08
申请号：EP18153393.6
申请日：2018-01-25
Inventor： RUGGIERI, Giuseppe , REISS, Martin , BISCARO, Alessandro , PEZZATO, Luigi
CPC classification number: F21V15/01 , B29C33/36 , B29C33/40 , B29C35/10 , B29C39/006 , B29C39/142 , B29C39/24 , B29C39/38 , B29C41/28 , B29C41/32 , B29C41/36 , B29C41/44 , B29C41/46 , B29C2035/0827 , B29K2083/005 , B29K2995/0026 , B29K2995/003 , B29L2011/00 , B29L2031/747
Abstract: A method of manufacturing housings (12) of lighting devices, comprising:
- providing a profiled mold (16) having a molding seat (20),
- dispensing curable liquid material (21) into said molding seat (20),
- curing said curable liquid material (21) in said profiled mold (16) so as to form an elongated housing (12), and
- extracting said elongated housing (12) from said profiled mold (16).-
公开(公告)号：EP3106742A8
公开(公告)日：2017-02-22
申请号：EP16174093.1
申请日：2016-06-13
Inventor： MUNARIN, Marco , REISS, Martin , ALFIER, Alberto , RIEGER, Thomas
IPC: F21S4/22 , F21V19/00 , F21K9/90 , F21V31/00 , F21V31/04 , F21V15/01 , F21Y103/10 , F21Y115/10
CPC classification number: F21V15/012 , F21S4/22 , F21V15/013 , F21V19/004 , F21V31/005 , F21V31/04 , F21Y2101/00 , F21Y2103/10 , F21Y2115/10
Abstract: A lighting device (10) includes:
- a channel-shaped elongate profiled body having a central or web portion (12) and two side portions (120) sidewise of the web portion (12), a profiled body (12, 120) having mutually opposed undercuts (122) opening inwardly of the channel shape of profiled body (12, 120), and
- a light radiation source assembly (16) including an elongate support board (16a) carrying one or more light radiation sources, e.g. LED sources (16b), the support board (16a) having longitudinal sides extending into the said undercuts (122), wherein the light radiation source assembly (16) is retained by the channel-shaped profiled body (12, 120).
Some embodiments may include:
- a first sealing mass (14) located between the web portion (12) of the profiled body (12, 120) and the light radiation source assembly (16),
- a second sealing mass (18) on the face of the support board (16a) opposed to the web portion (12) between one and the other said side portions (120).-
公开(公告)号：EP2655963B1
公开(公告)日：2015-01-07
申请号：EP12721785.9
申请日：2012-04-23
Applicant: OSRAM GmbH
Inventor： REISS, Martin , HOLZAPFEL, Gerhard , STRAUSS, Steffen
IPC: F21V31/04 , F21S4/00 , F21Y101/02 , F21Y103/00
CPC classification number: F21S4/20 , F21S4/24 , F21V23/00 , F21V31/04 , F21Y2103/10 , F21Y2115/10 , H05K1/189 , H05K3/284 , H05K3/3405 , H05K2201/10106 , H05K2201/10189 , H05K2203/1476 , Y10T29/49117
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公开(公告)号：EP2655963A1
公开(公告)日：2013-10-30
申请号：EP12721785.9
申请日：2012-04-23
Applicant: OSRAM GMBH
Inventor： REISS, Martin , HOLZAPFEL, Gerhard , STRAUSS, Steffen
IPC: F21V31/04 , F21S4/00 , F21Y101/02 , F21Y103/00
CPC classification number: F21S4/20 , F21S4/24 , F21V23/00 , F21V31/04 , F21Y2103/10 , F21Y2115/10 , H05K1/189 , H05K3/284 , H05K3/3405 , H05K2201/10106 , H05K2201/10189 , H05K2203/1476 , Y10T29/49117
Abstract: The lighting device (100) comprises at least one semiconductor light source (103) potted with at least one first potting compound (107, 108), wherein at least one region of the lighting device comprises: at least one connection zone (104) which is electrically connected to the at least one semiconductor light source (103), and at least one electrical connection element (111) having at least one electrical line (113), wherein at least one electrical line (113) is connected to an associated connection zone (104) and faces out from the lighting device at one end and the at least one connection zone (104) and the at least one electrical connection element (111) are arranged in a cutout (109) of the first potting compound (107, 108) and are potted by means of a second potting compound (119).
Abstract translation: 照明装置可以包括至少一个铸造有至少一个第一铸造化合物的半导体光源，其中所述照明装置的至少一个区域具有：至少一个连接区域，其电连接到所述至少一个半导体光源， 以及至少一个电连接元件，其具有至少一个电线，其中至少一个电线连接到相关联的连接区域并且在一端突出到所述照明装置外部，并且所述至少一个连接区域和所述至少一个连接区域 至少一个电连接元件布置在第一铸造化合物的切口中并且通过第二铸造化合物铸造。
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公开(公告)号：EP3351852A1
公开(公告)日：2018-07-25
申请号：EP18152940.5
申请日：2018-01-23
Inventor： REISS, Martin , DIDONE', Roberto , PEZZATO, Luigi , BALDO, Lorenzo
Abstract: A lighting device (10) includes:
- an elongated laminar substrate (12) having opposed front and back surfaces,
- one or more electrically-powered light radiation sources (14), e.g. LED sources, at the front surface of the substrate (12),
- a protective encapsulation (160, 162a, 162b, 20) sealingly encapsulating the substrate (12) and the light radiation source(s) (14), the encapsulation being light-permeable to facilitate propagation of light radiation from the device.
The encapsulation includes thermally-conductive material (20) at the back surface of the substrate (12) .
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