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1.Lead frame, method for manufacturing the same, resin-encapsulated semiconductor device and method for manufacturing the same 有权
标题翻译: 引线框架制造方法,塑料封装半导体器件及其制造方法公开(公告)号:EP1328023B1
公开(公告)日:2012-02-01
申请号:EP02019488.2
申请日:2002-08-30
发明人: Kawai, Fumihiko , Fukuda, Toshiyuki , Minamio, Masanori , Takeuchi, Noboru , Ogata, Shuichi , Tara, Katsushi , Nakatsuka, Tadayoshi
IPC分类号: H01L23/495 , H01L23/31
CPC分类号: H01L24/49 , H01L21/4842 , H01L21/565 , H01L23/3107 , H01L23/49503 , H01L23/49548 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/06179 , H01L2224/32014 , H01L2224/32245 , H01L2224/45015 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/49111 , H01L2224/49113 , H01L2224/4912 , H01L2224/4917 , H01L2224/49171 , H01L2224/49175 , H01L2224/49433 , H01L2224/4945 , H01L2224/73265 , H01L2224/85191 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/10329 , H01L2924/181 , H01L2924/18301 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2924/20752 , H01L2924/20753 , H01L2924/00015 , H01L2224/05599 , H01L2224/4554