METHOD OF MANUFACTURING SURFACE EMITTING LASER, AND SURFACE EMITTING LASER, SURFACE EMITTING LASER ARRAY, OPTICAL SCANNING DEVICE, AND IMAGE FORMING APPARATUS
    6.
    发明公开
    METHOD OF MANUFACTURING SURFACE EMITTING LASER, AND SURFACE EMITTING LASER, SURFACE EMITTING LASER ARRAY, OPTICAL SCANNING DEVICE, AND IMAGE FORMING APPARATUS 有权
    VERFAHREN ZUR HERSTELLUNG EINESOBERFLÄCHENEMITTIERENDENLASERS,OBERFLÄCHENEMITTIERENDERLASER,ARRAY AUSOBERFLÄCHENEMITTIERENDENLASERN,OPTISCHE ABTASTVORRICHTUNG UND BILDERZEUGUNGSVORRICHTUNG

    公开(公告)号:EP2436090A4

    公开(公告)日:2017-08-09

    申请号:EP10780346

    申请日:2010-03-15

    申请人: RICOH CO LTD

    IPC分类号: H01S5/183 H01S5/42

    摘要: A disclosed method of manufacturing a surface emitting laser includes laminating a transparent dielectric layer on an upper surface of a laminated body; forming a first resist pattern on an upper surface of the dielectric layer, the first resist pattern including a pattern defining an outer perimeter of a mesa structure and a pattern protecting a region corresponding to one of the relatively high reflection rate part and the relatively low reflection rate part included in an emitting region; etching the dielectric layer by using the first resist pattern as an etching mask; and forming a second resist pattern protecting a region corresponding to an entire emitting region. These steps are performed before the mesa structure is formed.

    摘要翻译: 公开的制造表面发射激光器的方法包括:在透明介电层上层压层压体的上表面; 在所述介​​电层的上表面上形成第一抗蚀剂图案,所述第一抗蚀剂图案包括限定台面结构的外周边的图案和保护对应于所述较高反射率部分和所述较低反射率部分中的一个的区域的图案 包括在发光区域中的高速部分; 通过使用第一抗蚀剂图案作为蚀刻掩模蚀刻介电层; 以及形成保护对应于整个发光区域的区域的第二抗蚀剂图案。 这些步骤在台面结构形成之前执行。

    COMPOUND SEMICONDUCTOR PHOTOVOLTAIC CELL AND MANUFACTURING METHOD OF THE SAME
    7.
    发明公开
    COMPOUND SEMICONDUCTOR PHOTOVOLTAIC CELL AND MANUFACTURING METHOD OF THE SAME 审中-公开
    根据上述制造复合型半导体和过程光伏电池

    公开(公告)号:EP2973745A4

    公开(公告)日:2016-03-02

    申请号:EP14763163

    申请日:2014-03-12

    申请人: RICOH CO LTD

    发明人: SATO SHUNICHI

    摘要: A compound semiconductor photovoltaic cell includes a compound semiconductor substrate; one or more first photoelectric conversion cells deposited on the compound semiconductor substrate; a bonding layer deposited on the one or more first photoelectric conversion cells; and one or more second photoelectric conversion cells bonded to the one or more first photoelectric conversion cells via the bonding layer, and disposed on a light incident side of the one or more first photoelectric conversion cells in a light incident direction. Further, band gaps of the first and the second photoelectric conversion cells decrease as the first and the second photoelectric conversion cells approach from the light incident side toward a back side in the light incident direction, and when there is one second photoelectric conversion cells, a band gap of the bonding layer is greater than or equal to a band gap of the second photoelectric conversion cell.