摘要:
The invention relates to a method which enables a control unit to have time-flexible access to measurement data of individual sensors. The control unit (SG) sends a request telegram to the sensors (S1, ..., S5) and, upon comparing the request telegram with its own address, each sensor (S1,..., S5) determines whether and at what time interval (ZS0,..., ZS4) it should transmit the measurement data thereof to the control unit (SG).
摘要:
The invention relates to a method which enables a control unit to have time-flexible access to measurement data of individual sensors. The control unit (SG) sends a request telegram to the sensors (S1, ..., S5) and, upon comparing the request telegram with its own address, each sensor (S1,..., S5) determines whether and at what time interval (ZS0,..., ZS4) it should transmit the measurement data thereof to the control unit (SG).
摘要:
The invention relates to a method for signal transmission in a bus system, superposed on a direct supply voltage. Previously in a bus system, voltage signals were sent to modules from the central unit and said modules could respond by altering the current input. This has the disadvantage that the current input, which already has to be kept relatively low due to the energy consumption, is relatively susceptible to faults and that the process of faultlessly detecting the signals sent by the modules in the central unit is complex, accordingly. According to the invention, the modules of the central unit also respond with voltage signals superposed on the direct supply voltage. The central unit delivers the direct supply voltage via a resistor of the bus line for the duration of the signal transmission through the modules so that the voltage signal of the modules can be detected in the central unit on the bus line, on the side of the resistor facing away from the direct supply voltage. The invention is particularly suitable for use for bus systems in motor vehicles, especially for a sensor data bus.
摘要:
The invention relates to a thin film structured sensor, having a dielectric carrier layer (21) on which a layer (23) containing platinum is arranged and at least a top layer (25) is arranged thereon. At least one surface of the layer (23) containing platinum is fitted with an additional adhesive layer (22) made of silicon, at least in certain areas.
摘要:
The invention relates to a thin film structured sensor, having a dielectric carrier layer (21) on which a layer (23) containing platinum is arranged and at least a top layer (25) is arranged thereon. At least one surface of the layer (23) containing platinum is fitted with an additional adhesive layer (22) made of silicon, at least in certain areas.
摘要:
A method of protecting electronic or micromechanical components having at least one contact face for electric contacting is described. Sensitive components such as electronic microchips having bond pads, for example, are protected from soiling and corrosion. This method includes the application of an organic protective layer at least to the contact faces of the components.
摘要:
The invention relates to a method for signal transmission in a bus system, superposed on a direct supply voltage. Previously in a bus system, voltage signals were sent to modules from the central unit and said modules could respond by altering the current input. This has the disadvantage that the current input, which already has to be kept relatively low due to the energy consumption, is relatively susceptible to faults and that the process of faultlessly detecting the signals sent by the modules in the central unit is complex, accordingly. According to the invention, the modules of the central unit also respond with voltage signals superposed on the direct supply voltage. The central unit delivers the direct supply voltage via a resistor of the bus line for the duration of the signal transmission through the modules so that the voltage signal of the modules can be detected in the central unit on the bus line, on the side of the resistor facing away from the direct supply voltage. The invention is particularly suitable for use for bus systems in motor vehicles, especially for a sensor data bus.