公开(公告)号：EP2810540A4

公开(公告)日：2016-01-06

申请号：EP13743076

申请日：2013-01-30

Applicant: STORA ENSO OYJ

Inventor： SIRVIÖ PETRI ,  MAIJALA JUHA

IPC: H05K3/10 ,  H05K1/03 ,  H05K3/12

CPC classification number: B05C1/003 ,  B05C19/008 ,  B05D1/007 ,  B05D1/28 ,  B05D3/0263 ,  B05D3/029 ,  B05D3/06 ,  B05D3/12 ,  C23C26/02 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/102 ,  H05K3/1241 ,  H05K3/1266 ,  H05K3/1283 ,  H05K2201/0293 ,  H05K2203/0126 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/102 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1545 ,  H05K2203/1581

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

公开(公告)号：EP2628370A4

公开(公告)日：2017-08-02

申请号：EP10858358

申请日：2010-10-14

Applicant: STORA ENSO OYJ

Inventor： MAIJALA JUHA ,  SIRVIÖ PETRI

IPC: H05K3/32 ,  B23K1/00 ,  H05K3/12 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K3/30 ,  B23K1/0016 ,  H01L2224/16225 ,  H01L2224/75 ,  H01L2224/81 ,  H05K3/1266 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2203/0278 ,  H05K2203/111 ,  Y10T29/4913 ,  Y10T29/53178

Abstract: A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.

Abstract translation: 芯片附着于印刷导电表面并与印刷导电表面电连接，由此芯片被加热至低于芯片能够承受而不被热损坏的温度，然后加热的芯片被压在印刷导电表面上 由此所述温度和所述压力的组合足以至少部分地熔化所述印刷导电表面，所述芯片上的所述接触点或所述两者中的至少一者的材料，由此附接并电连接所述芯片 到印刷的导电表面。

公开(公告)号：EP3117039A4

公开(公告)日：2017-11-01

申请号：EP15761881

申请日：2015-03-13

Applicant: STORA ENSO OYJ

Inventor： MIIKKI NINA ,  SIRVIÖ PETRI ,  BACKFOLK KAJ

IPC: D21H19/10 ,  B32B7/10 ,  B32B7/12 ,  B32B27/10 ,  B32B27/32 ,  B32B27/36 ,  B41J11/00 ,  B41M7/00 ,  B65D65/40 ,  D21H19/14 ,  D21H19/34 ,  D21H19/52 ,  D21H19/82 ,  D21H19/84 ,  D21H21/00 ,  D21H21/18 ,  D21H23/70 ,  D21H27/10 ,  D21H27/30

CPC classification number: D21H27/10 ,  B32B7/12 ,  B32B27/10 ,  B32B27/32 ,  B32B27/36 ,  B32B2307/4023 ,  B32B2307/4026 ,  B32B2307/75 ,  B32B2439/70 ,  B41M5/0017 ,  B41M5/5218 ,  B41M5/5236 ,  B41M5/5254 ,  B41M7/0036 ,  B65D65/40 ,  D21H19/10 ,  D21H19/14 ,  D21H19/34 ,  D21H19/52 ,  D21H19/82 ,  D21H19/84 ,  D21H21/18 ,  D21H23/70

Abstract: The invention refers to a method to produce a packaging material comprising the steps of; treating at least one surface of a paperboard substrate with a binder and with a metal salt, printing at least a part of said treated surface with ink, and applying at least one polymer layer on said printed surface. The packaging material produced in accordance with the invention shows good printability and simultaneously good adhesion of the applied polymer layer.

公开(公告)号：EP2810541A4

公开(公告)日：2016-01-06

申请号：EP13743392

申请日：2013-01-30

Applicant: STORA ENSO OYJ

Inventor： MAIJALA JUHA ,  SIRVIÖ PETRI

IPC: H05K3/10 ,  H05K1/03 ,  H05K3/12 ,  H05K3/14

CPC classification number: H05K3/14 ,  B05B1/30 ,  B05B5/14 ,  B05B5/1608 ,  B05B9/00 ,  B05B15/00 ,  B05B15/0431 ,  B05B17/0607 ,  B05B17/0615 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/146 ,  H05K3/381 ,  H05K2203/0278 ,  H05K2203/111 ,  H05K2203/1121 ,  H05K2203/1344 ,  H05K2203/1545

Abstract: A method and an arrangement are disclosed for transferring electrically conductive material in fluid form onto a substrate. Said substrate is preheated to a first temperature, and of said electrically conductive material there is produced fluid electrically conductive material. The fluid electrically conductive material is sprayed onto the preheated substrate to form a pattern of predetermined kind. The substrate onto which said fluid electrically conductive material was sprayed is cooled to a third temperature, which is lower than the melting point of said electrically conductive material.