公开(公告)号：EP2628370A4

公开(公告)日：2017-08-02

申请号：EP10858358

申请日：2010-10-14

Applicant: STORA ENSO OYJ

Inventor： MAIJALA JUHA ,  SIRVIÖ PETRI

IPC: H05K3/32 ,  B23K1/00 ,  H05K3/12 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K3/30 ,  B23K1/0016 ,  H01L2224/16225 ,  H01L2224/75 ,  H01L2224/81 ,  H05K3/1266 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2203/0278 ,  H05K2203/111 ,  Y10T29/4913 ,  Y10T29/53178

Abstract: A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.

Abstract translation: 芯片附着于印刷导电表面并与印刷导电表面电连接，由此芯片被加热至低于芯片能够承受而不被热损坏的温度，然后加热的芯片被压在印刷导电表面上 由此所述温度和所述压力的组合足以至少部分地熔化所述印刷导电表面，所述芯片上的所述接触点或所述两者中的至少一者的材料，由此附接并电连接所述芯片 到印刷的导电表面。

公开(公告)号：EP2810540A4

公开(公告)日：2016-01-06

申请号：EP13743076

申请日：2013-01-30

Applicant: STORA ENSO OYJ

Inventor： SIRVIÖ PETRI ,  MAIJALA JUHA

IPC: H05K3/10 ,  H05K1/03 ,  H05K3/12

CPC classification number: B05C1/003 ,  B05C19/008 ,  B05D1/007 ,  B05D1/28 ,  B05D3/0263 ,  B05D3/029 ,  B05D3/06 ,  B05D3/12 ,  C23C26/02 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/102 ,  H05K3/1241 ,  H05K3/1266 ,  H05K3/1283 ,  H05K2201/0293 ,  H05K2203/0126 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/102 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1545 ,  H05K2203/1581

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

公开(公告)号：EP2616821A4

公开(公告)日：2015-06-24

申请号：EP11824640

申请日：2011-09-16

Applicant: STORA ENSO OYJ

Inventor： MAIJALA JUHA ,  JOUPPI MARTTI ,  PÖYHÖNEN NIILO

IPC: B65D79/02 ,  G01P1/12

CPC classification number: B65D79/02 ,  G01P1/127

公开(公告)号：EP2898446A4

公开(公告)日：2016-04-27

申请号：EP13838256

申请日：2013-09-23

Applicant: STORA ENSO OYJ

Inventor： MAIJALA JUHA

IPC: G06K7/08 ,  A61J1/03 ,  A61J7/04 ,  B65D75/36 ,  G06K19/07 ,  H04B5/02 ,  H05K3/10

CPC classification number: H01L23/66 ,  A61J1/035 ,  A61J2200/30 ,  A61J2205/60 ,  B65D25/00 ,  B65D2203/10 ,  H01L23/4985 ,  H01L23/564 ,  H01L23/585 ,  H01L23/642 ,  H01L23/645 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K1/0239 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0292 ,  H05K1/111 ,  H05K1/165 ,  H05K3/0052 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09954 ,  H05K2201/0999 ,  H05K2201/2036 ,  H05K2203/0195 ,  H05K2203/0228 ,  H01L2924/00

Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

公开(公告)号：EP2810541A4

公开(公告)日：2016-01-06

申请号：EP13743392

申请日：2013-01-30

Applicant: STORA ENSO OYJ

Inventor： MAIJALA JUHA ,  SIRVIÖ PETRI

IPC: H05K3/10 ,  H05K1/03 ,  H05K3/12 ,  H05K3/14

CPC classification number: H05K3/14 ,  B05B1/30 ,  B05B5/14 ,  B05B5/1608 ,  B05B9/00 ,  B05B15/00 ,  B05B15/0431 ,  B05B17/0607 ,  B05B17/0615 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/146 ,  H05K3/381 ,  H05K2203/0278 ,  H05K2203/111 ,  H05K2203/1121 ,  H05K2203/1344 ,  H05K2203/1545

Abstract: A method and an arrangement are disclosed for transferring electrically conductive material in fluid form onto a substrate. Said substrate is preheated to a first temperature, and of said electrically conductive material there is produced fluid electrically conductive material. The fluid electrically conductive material is sprayed onto the preheated substrate to form a pattern of predetermined kind. The substrate onto which said fluid electrically conductive material was sprayed is cooled to a third temperature, which is lower than the melting point of said electrically conductive material.

公开(公告)号：EP2327032A4

公开(公告)日：2015-04-22

申请号：EP09800109

申请日：2009-07-22

Applicant: STORA ENSO OYJ

Inventor： TORNIAINEN ESA ,  MAIJALA JUHA ,  KÄNSÄKOSKI ARI

IPC: G06F17/30 ,  B41M3/00 ,  G09B5/00 ,  G09B21/00

CPC classification number: G09B5/00 ,  B41M3/006 ,  B41M7/009

Abstract: According to the invention, the sheet-based printed product (1) comprises, so as to form an electric user interface, an electric detector (10) fabricated by printing it in a predetermined location on a sheet (9) of the printed product and arranged to detect a pointer (15) brought to the vicinity of the detector, and collection means (11, 8) for collecting information about detection of the pointer for further actions.

公开(公告)号：EP2675728A4

公开(公告)日：2016-12-28

申请号：EP12747541

申请日：2012-02-14

Applicant: STORA ENSO OYJ

Inventor： MAIJALA JUHA ,  MÄKELÄ RAIMO ,  ILKKA PETRI

IPC: B65D83/04 ,  A61J1/03 ,  A61J7/04 ,  G08C17/00 ,  G09F3/03 ,  H05K1/16

CPC classification number: G06F19/3462 ,  A61J1/03 ,  A61J1/035 ,  A61J7/0418 ,  A61J7/0436 ,  A61J7/049 ,  G06F17/30368 ,  G09F3/00 ,  G09F3/0297

Abstract: A monitoring system for monitoring smart package content use, wherein the system comprises a smart package. The smart package in turn comprises removable content units, such as pill type or tablet type or other singly packed objects, as well as most preferably wireless communication elements. The system comprises also database elements with which the smart package can be in communication. In addition, the smart package is adapted to detect said removal of a content unit and to deliver information to said database elements by way of said communication elements, regarding a removal of said content unit. The smart package is identifiable by the database elements on the basis of information delivered by way of said communication elements.

Abstract translation: 一种用于监控智能包装内容使用的监控系统，其中所述系统包括智能包装。 智能包装又包括可移除内容单元，例如药片类型或片剂类型或其他单独打包的对象，以及最优选无线通信元件。 该系统还包括智能包可与之通信的数据库元件。 此外，智能包适于检测内容单元的删除，并且通过所述通信元件向所述数据库元素传送关于删除所述内容单元的信息。 基于通过所述通信元件传递的信息，智能包可由数据库元素识别。

公开(公告)号：EP2585378A4

公开(公告)日：2014-06-25

申请号：EP10853564

申请日：2010-06-22

Applicant: STORA ENSO OYJ

Inventor： MAIJALA JUHA ,  MÄKELÄ RAIMO ,  ILKKA PETRI

IPC: B65D5/42 ,  G06K17/00 ,  G06K19/10 ,  H04B1/034

CPC classification number: B65D25/00 ,  B65D2203/10 ,  G06K17/0022 ,  G06K19/07737 ,  G06K19/07741 ,  G06K2017/009 ,  H01R43/00 ,  Y10T29/49117

Abstract: A fiber or plastic based package includes: an interface adapted to attach and connect, in a detachable manner, a module to a fiber or plastic based package, the module including a wireless transmitter, and the interface including conductors for transferring package data from the fiber or plastic based package to the module. A module, system and software are also implemented in connection with the fiber or plastic based package. A smart package, its management and various applications thereof are provided.

Abstract translation: 的纤维或塑料基包装，包括：一个接口angepasst到模块连接并连接，以可拆卸的方式，在光纤或塑料封装，模块，包括无线发射器，以及包括从纤维导体，用于传递环包数据的接口 或塑料基包装到模块。 的模块，系统和软件是这样实施的与纤维或塑料基包装连接。 智能软件包，其管理和各种应用程序及其设置。

公开(公告)号：EP2050320A4

公开(公告)日：2012-12-05

申请号：EP07788794

申请日：2007-07-06

Applicant: STORA ENSO OYJ

Inventor： MAIJALA JUHA ,  MERTA JUHA ,  LEHTI SANNA

IPC: H05K3/10

CPC classification number: H05K3/1266 ,  G03G15/225 ,  H05K3/1283 ,  H05K3/4664 ,  H05K2203/0143 ,  H05K2203/0425 ,  H05K2203/0517 ,  H05K2203/1131 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/5313

公开(公告)号：EP2298045A4

公开(公告)日：2012-01-04

申请号：EP08761652

申请日：2008-05-09

Applicant: STORA ENSO OYJ

Inventor： MAIJALA JUHA ,  SIRVIOE PETRI

IPC: H05K3/10 ,  C23C24/08 ,  C23C26/00

CPC classification number: C23C26/00 ,  C23C24/10 ,  H05K1/0393 ,  H05K3/1266 ,  H05K2203/0143 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/1131 ,  H05K2203/1545 ,  Y10T428/24322 ,  Y10T428/24521 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/256

Abstract: An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web.