Abstract:
Provided are a silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the silicon-containing resin composition, and a crack-free silica-based coating film formed using the silicon-containing resin composition. A silicon-containing resin composition including (A) a silicon-containing resin and (S) a solvent, wherein one or more selected from siloxane resins and polysilanes is used as the (A) silicon-containing resin, and the (S) solvent contains a cycloalkyl acetate having a specific structure. Cyclohexyl acetate is preferably used as the cycloalkyl acetate.
Abstract:
The present invention provides an energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. Also provided are a method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance. The energy-sensitive resin composition comprises an imidazole compound (A) represented by formula (1a), a resin precursor component (B), and a solvent (S), wherein the resin precursor component (B) is at least one resin precursor component selected from the group consisting of: a monomer component comprising a diamine compound represented by formula (2), a dicarbonyl compound represented by formula (3a) and/or a tetracarboxylic acid dianhydride represented by formula (3b); and a precursor polymer having a repeating unit represented by formula (4).
Abstract:
Provided are: a curable composition that can be cured at low temperature in a short time regardless of the type of epoxy compound that is mixed therewith, and has a long pot life; an adhesive comprising said curable composition; a method for producing a fiber-reinforced composite material that uses the curable composition; and a fiber-reinforced composite material containing a matrix comprising the curable composition. Furthermore, the present invention provides a curing agent mixture composition that can be cured at low temperature and in a short time, and provides the curable composition with a long pot life. Furthermore, provided is a curing agent mixture composition that can be cured at low temperature and in a short time, and provides the curable composition with a long pot life. An epoxy compound (A) and an imidazole compound (B) having a specific structure are blended in with the curable composition. In addition, the imidazole compound (B) having a specific structure and at least one type of crosslinking agent (C) selected from the group comprising a polyvalent amide compound and a polyvalent carboxylic acid anhydride are blended in with the curing agent mixture composition.
Abstract:
This invention provides: a new imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and the oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. Metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.
Abstract:
Provided is a composition containing a novel vinyl-group-containing compound. This composition contains a vinyl-group-containing compound represented by general formula (1). In the formula: W 1 and W 2 represent a group represented by general formula (2) (where a ring (Z) is an aromatic hydrocarbon ring, X is a single bond or -S-, R 1 is a single bond or a C1-4 alkylene group, R 2 is a specific substituent group such as a monovalent hydrocarbon, and m is an integer equal to 0 or higher), a group represented by general formula (4) (where the ring (Z), X, R 1 , R 2 , and m are as previously stated), a hydroxyl group, or a (meth)acryloyloxy group; rings (Y 1 , Y 2 ) are aromatic hydrocarbon rings; R represents a single bond or a specific divalent group; R 3a and R 3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon group; and n1 and n2 are integers of 0-4.
Abstract:
Provided are a novel sulfonium salt having high sensitivity with respect to active energy rays, a photoacid generator comprising the sulfonium salt, and a photosensitive composition containing the photoacid generator. The sulfonium salt is represented by formula (a1). In the formula, R 1 and R 2 each independently represent the group that is represented by formula (a2) or an alkyl group that may be substituted by a halogen atom, R 1 and R 2 are bonded to each other and may form a ring with the sulfur atom within the formula, R 3 is the group represented by formula (a3) or the group represented by formula (a4), A 1 represents S or the like, X - represents a monovalent anion, and R 1 and R 2 are not both an alkyl group which may be substituted with a halogen atom. In formulas (a2) to (a4), the ring Z 1 represents an aromatic hydrocarbon ring, R 4 , R 6 , R 9 , and R 10 each represents a specific monovalent group, R 5 , R 7 , and R 8 each represents a specific divalent group, A 2 and A 3 each represents S or the like, ml represents an integer of 0 or more, and n1 and n2 each represent 0 or more.
Abstract:
Provided are: a transparent body production method that uses a novel vinyl group-containing compound; and a transparent body obtained by this production method. This transparent body production method includes subjecting a vinyl group-containing compound that is represented by formula (1) to heating at a temperature equal to or greater than the melting point of said compound. In formula (1), each of W 1 and W 2 is the group represented by formula (2) (in the formula, the ring Z is an aromatic hydrocarbon ring, X is a single bond or a group represented by -S-, R 1 is a single bond or an alkylene group having 1-4 carbon atoms, R 2 is a specific substituent such as a monovalent hydrocarbon group, and m is an integer of 0 or higher), the group represented by formula (4) (in the formula, the ring Z, X, R 1 , R 2 , and m are as indicated above), a hydroxyl group, or an (meth)acryloyloxy group, each of the ring Y 1 and the ring Y 2 is an aromatic hydrocarbon ring, R is a single bond or a specific divalent group, each of R 3a and R 3b is a cyano group, a halogen group, or a monovalent hydrocarbon group, and each of n1 and n2 is an integer of 0-4.