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公开(公告)号：EP3845039A1
公开(公告)日：2021-07-07
申请号：EP19780283.8
申请日：2019-08-27
申请人： TactoTek Oy
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公开(公告)号：EP4164346A3
公开(公告)日：2023-06-21
申请号：EP22205517.0
申请日：2017-04-11
申请人： TactoTek Oy
IPC分类号： H05K5/00 , H05K3/28 , H05K1/03 , H05K1/14 , H01L23/522 , H01L23/538 , B29C39/12 , B29C45/16 , B32B27/08 , G06F3/044 , B32B17/10 , H01L21/56 , H05K1/02 , H05K1/18 , H05K3/40 , H05K3/46 , B32B3/06 , B32B3/26 , B32B3/30 , B32B5/02 , B32B5/26
摘要： An integrated multilayer assembly (100, 200, 300) for an electronic device comprising a first substrate film (106) configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film (202) configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature (214B) on the first side of the first substrate film, at least one other electrical feature (214A) on the first side of the second substrate film, and a molded plastic layer (204) between the first and second substrate films at least partially embedding the electrical features on the first sides thereof. A related method of manufacture is presented.
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公开(公告)号：EP3890460A1
公开(公告)日：2021-10-06
申请号：EP21175598.8
申请日：2016-09-28
申请人： Tactotek Oy
发明人： HEIKKINEN, Mikko , RAAPPANA, Pasi , SÄÄSKI, Jarmo
摘要： A multilayer structure (100), comprising a flexible substrate film (102) having a first side and opposite second side, a number of conductive traces (108), optionally defining contact pads and/or conductors, preferably printed on the first side of the substrate film for establishing a desired predetermined circuit design, plastic layer (104) molded onto the first side of the substrate film (102) so as to enclose the circuit between the plastic layer and the first side of the substrate film (102), and a preferably flexible connector (114) for providing external electrical connection to the embedded circuit on the first side from the second, opposite side of the substrate film (102), one end of the connector being attached to a predetermined contact area on the first side whereas the other end (114B) is located on the second side of the substrate for coupling with an external element (118), the intermediate portion connecting the two ends being fed through an opening (115) in the substrate, wherein the opening extending through the thickness of the substrate film is preferably dimensioned so as to accommodate the connector without substantial additional clearance. A corresponding method of manufacture is presented.
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公开(公告)号：EP3845043A2
公开(公告)日：2021-07-07
申请号：EP19783083.9
申请日：2019-08-27
申请人： TactoTek Oy
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6.发明公开
公开(公告)号：EP3957459A1
公开(公告)日：2022-02-23
申请号：EP21203098.5
申请日：2014-09-25
申请人： TactoTek Oy
发明人： HEIKKINEN, Mikko , SÄÄSKI, Jarmo , TORVINEN, Jarkko , NISKALA, Paavo , SIPPARI, Mikko , RAAPPANA, Pasi , KERÄNEN, Antti
摘要： Method for manufacturing an electromechanical structure, comprising: producing (106) conductors and/or graphics on a substantially flat film, attaching (108) electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming (110) the said film housing the electronic elements into a substantially three-dimensional shape, using (112) the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film, creating an electromechanical structure. A corresponding arrangement (500) for carrying out said method is also presented.
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公开(公告)号：EP3357310A1
公开(公告)日：2018-08-08
申请号：EP16850439.7
申请日：2016-09-28
申请人： Tactotek Oy
发明人： HEIKKINEN, Mikko , RAAPPANA, Pasi , SÄÄSKI, Jarmo
IPC分类号： H05K5/00 , H05K3/28 , H01L23/538 , H05K5/06 , H01R12/77 , H01R12/61 , H05K1/03 , H05K1/14 , B32B27/08 , H01R4/04
CPC分类号： H05K3/4015 , H05K1/189 , H05K3/4046 , H05K2201/10287 , H05K2203/1327
摘要： A multilayer structure, includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, preferably printed on the first side for establishing a desired predetermined circuit design, plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a preferably flexible connector for providing external electrical connection to the embedded circuit on the first side from the second, opposite side, one end of the connector being attached to a predetermined contact area on the first side, the other end being located on the second side for coupling with an external element, the intermediate portion connecting the two ends being fed through an opening in the substrate, wherein the opening extending through the thickness of the film is dimensioned to accommodate the connector without substantial additional clearance.
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9.发明公开
公开(公告)号：EP3049227A1
公开(公告)日：2016-08-03
申请号：EP14849632.6
申请日：2014-09-25
申请人： TactoTek Oy
发明人： HEIKKINEN, Mikko , SÄÄSKI, Jarmo , TORVINEN, Jarkko , NISKALA, Paavo , SIPPARI, Mikko , RAAPPANA, Pasi , KERÄNEN, Antti
CPC分类号： H05K3/0014 , B29C45/1418 , B29C45/14639 , B29C45/14811 , B29C45/14819 , B29C2045/14237 , B29L2031/3425 , B29L2031/3481 , H05K1/0284 , H05K1/0393 , H05K2201/0129 , H05K2201/09118 , H05K2203/1105
摘要： Method for manufacturing an electromechanical structure, com-prising: producing conductors and/or graphics on a substantially flat film 106, attaching electronic elements on the said film 108 in relation to the de-sired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape 110, using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film 112, wherein a preferred layer of material is attached on the surface of the film, creating an electromechanical structure. A corresponding arrangement for carrying out said method is also presented.
摘要翻译： 用于制造机电结构，COM-撬方法：制作在基本平坦的薄膜106的导体和/或图形，在相对于所述膜的去首创的三维形状上的上述膜108附接的电子元件，在形成说 膜容纳电子元件为大致的三维形状110，使用基本上三维电影，以通过在所述电影112基本上成形在注射成型过程中插入worin材料的优选层附着的表面上 电影，在机电结构产生。 因此，对于执行该方法的相应的装置被提出。
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公开(公告)号：EP4164346A2
公开(公告)日：2023-04-12
申请号：EP22205517.0
申请日：2017-04-11
申请人： TactoTek Oy
IPC分类号： H05K5/00 , H05K3/28 , H05K1/03 , H05K1/14 , H01L23/522 , H01L23/538 , B29C39/12 , B29C45/16 , B32B27/08 , G06F3/044 , B32B17/10 , H01L21/56 , H05K1/02 , H05K1/18 , H05K3/40 , H05K3/46 , B32B3/06 , B32B3/26 , B32B3/30 , B32B5/02 , B32B5/26
摘要： An integrated multilayer assembly (100, 200, 300) for an electronic device comprising a first substrate film (106) configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film (202) configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature (214B) on the first side of the first substrate film, at least one other electrical feature (214A) on the first side of the second substrate film, and a molded plastic layer (204) between the first and second substrate films at least partially embedding the electrical features on the first sides thereof. A related method of manufacture is presented.
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