公开(公告)号：EP2705533A1

公开(公告)日：2014-03-12

申请号：EP12712792.6

申请日：2012-03-12

申请人： Tessera, Inc.

发明人： SATO, Hiroaki ,  KANG, Teck-Gyu ,  HABA, Belgacem ,  OSBORN, Philip, R. ,  WANG, Wei-Shun ,  CHAU, Ellis ,  MOHAMMED, Ilyas ,  MASUDA, Norihito ,  SAKUMA, Kazuo ,  HASHIMOTO, Kiyoaki ,  INETARO, Kurosawa ,  KIKUCHI, Tomoyuki

IPC分类号： H01L25/10 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L25/043 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1713 ,  H01L2224/17179 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48464 ,  H01L2224/49105 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

摘要翻译： 制造微电子封装的方法包括在具有第一表面和远离其的第二表面的衬底的工艺单元上形成电介质封装层。 微电子元件安装到基板的第一表面，以及多个导电元件，其在第一表面处露出，其中至少一些电连接到微电子元件。 线接合具有接合到远离基座的导电元件和端表面的基部，并且限定在基部和端面之间延伸的边缘表面。 封装层形成为至少部分地覆盖第一表面，并且引线接合的部分与引线键合的未封装部分由端盖表面或边缘表面的未被覆盖的部分中的至少一个限定。