公开(公告)号：EP0875934B1

公开(公告)日：2007-11-14

申请号：EP98303365.5

申请日：1998-04-30

申请人： Texas Instruments Incorporated

发明人： Saran, Mukil ,  Martin, Charles A.

IPC分类号： H01L23/48 ,  H01L23/498 ,  H05K1/02 ,  H01L23/485

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/451 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H05K1/0271 ,  H05K1/111 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T428/24529 ,  Y10T428/24545 ,  Y10T428/24917 ,  H01L2224/48824 ,  H01L2924/00

公开(公告)号：EP2852974B1

公开(公告)日：2018-08-01

申请号：EP13724714.4

申请日：2013-05-21

申请人： Invensas Corporation

发明人： MOHAMMED, Ilyas

IPC分类号： H01L25/065 ,  H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L25/10 ,  H01L21/56

CPC分类号： H01L23/5226 ,  H01L21/563 ,  H01L21/568 ,  H01L21/76877 ,  H01L21/76892 ,  H01L23/5389 ,  H01L24/06 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/49 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/4569 ,  H01L2224/48 ,  H01L2224/49 ,  H01L2224/73267 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/182 ,  H01L2924/191 ,  H01L2924/19107 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01049

摘要： A method for making a microelectronic unit includes forming a plurality of wire bonds on a first surface in the form of a conductive bonding surface of a structure comprising a patternable metallic element. The wire bonds are formed having bases joined to the first surface and end surfaces remote from the first surface. The wire bonds have edge surfaces extending between the bases and the end surfaces. The method also includes forming a dielectric encapsulation layer over a portion of the first surface of the conductive layer and over portions of the wire bonds such that unencapsulated portions of the wire bonds are defined by end surfaces or portions of the edge surfaces that are unconvered by the encapsulation layer. The metallic element is patterned to form first conductive elements beneath the wire bonds and insulated from one another by portions of the encapsulation layer.

公开(公告)号：EP0875934A3

公开(公告)日：1999-10-13

申请号：EP98303365.5

申请日：1998-04-30

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Saran, Mukil ,  Martin, Charles A.

IPC分类号： H01L23/48 ,  H01L23/498

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/451 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H05K1/0271 ,  H05K1/111 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T428/24529 ,  Y10T428/24545 ,  Y10T428/24917 ,  H01L2224/48824 ,  H01L2924/00

摘要： The reinforcing system (10, 70, 90) for a bond pad (12, 72, 92) includes at least one dielectric layer or stack (20, 21, 22, 76, 78, 96, 98) disposed under the bond pad (12, 72, 92) . A reinforcing patterned structure (30, 80, 82, 100, 102) is disposed in the dielectric layer or stack (20, 21, 22, 76, 78, 96, 98).

摘要翻译： 用于接合焊盘（12,72,92）的加强系统（10,70,90）包括设置在接合焊盘下方的至少一个电介质层或叠层（20,21,22,76,78,96,98） 12，72，92）。 加强图案化结构（30,80,82,100,102）设置在电介质层或叠层（20,21,22,76,78,96,98）中。

公开(公告)号：EP3029167A1

公开(公告)日：2016-06-08

申请号：EP15819755.8

申请日：2015-05-20

申请人： Nippon Steel & Sumikin Materials Co., Ltd. ,  Nippon Micrometal Corporation

发明人： OYAMADA Tetsuya ,  UNO Tomohiro ,  DEAI Hiroyuki ,  ODA Daizo

IPC分类号： C22C5/06 ,  C22F1/14 ,  H01L21/60 ,  C22F1/00

CPC分类号： H01L24/45 ,  C22C5/10 ,  H01L24/05 ,  H01L24/43 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45101 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45117 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48479 ,  H01L2224/48507 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85439 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/01001 ,  H01L2924/01007 ,  H01L2924/01049 ,  H01L2924/01031 ,  H01L2924/01048 ,  H01L2924/01028 ,  H01L2924/01005 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01004 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01203 ,  H01L2924/01044 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2224/48471 ,  H01L2924/00015 ,  H01L2924/01008 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01033 ,  H01L2224/4554

摘要： The present invention provides a bonding wire which can satisfy bonding reliability, spring performance, and chip damage performance required in high-density packaging. A bonding wire contains one or more of In, Ga, and Cd for a total of 0.05 to 5 at%, and a balance being made up of Ag and incidental impurities.

摘要翻译： 本发明提供一种可以满足高密度封装所需的接合可靠性，弹簧性能和切屑损伤性能的接合线。 接合线包含In，Ga和Cd中的一种或多种，​​总共为0.05-5at％，余量由Ag和杂质构成。

公开(公告)号：EP2936557A1

公开(公告)日：2015-10-28

申请号：EP13818893.3

申请日：2013-12-17

申请人： Invensas Corporation

发明人： HABA, Belgacem ,  MOHAMMED, Ilyas ,  CASKEY, Terrence ,  CO, Reynaldo ,  CHAU, Ellis

IPC分类号： H01L23/498 ,  H01L25/10 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC分类号： H05K1/11 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/528 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10515 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

摘要： A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond elements from one another. The encapsulation element has a third surface facing away from the first surface. Unencapsulated portions of the bond elements are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element at least partially defines a second portion of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some conductive elements are at the second portion and configured for connection with such microelectronic element.

摘要翻译： 结构可以包括在第一表面的第一部分和远离基底的端表面处具有连接到导电元件的基底的结合元件。 电介质封装元件可以从第一部分覆盖并延伸并填充接合元件之间的空间，以将接合元件彼此分开。 封装元件具有背离第一表面的第三表面。 粘合元件的未封装部分由在第三表面处被封装元件未覆盖的至少部分端面限定。 封装元件至少部分地限定第一表面的除第一部分之外的第二部分，并且具有尺寸适于容纳微电子元件的整个区域的区域。 一些导电元件位于第二部分并被配置为与这种微电子元件连接。

公开(公告)号：EP2852974A1

公开(公告)日：2015-04-01

申请号：EP13724714.4

申请日：2013-05-21

申请人： Invensas Corporation

发明人： MOHAMMED, Ilyas

IPC分类号： H01L23/00 ,  H01L23/538 ,  H01L25/10 ,  H01L21/48 ,  H01L23/495

CPC分类号： H01L23/5226 ,  H01L21/563 ,  H01L21/568 ,  H01L21/76877 ,  H01L21/76892 ,  H01L23/5389 ,  H01L24/06 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/49 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/4569 ,  H01L2224/49 ,  H01L2224/73267 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/182 ,  H01L2924/191 ,  H01L2924/19107 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/1461 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01049

摘要： A method for making a microelectronic unit includes forming a plurality of wire bonds on a first surface in the form of a conductive bonding surface of a structure comprising a patternable metallic element. The wire bonds are formed having bases joined to the first surface and end surfaces remote from the first surface. The wire bonds have edge surfaces extending between the bases and the end surfaces. The method also includes forming a dielectric encapsulation layer over a portion of the first surface of the conductive layer and over portions of the wire bonds such that unencapsulated portions of the wire bonds are defined by end surfaces or portions of the edge surfaces that are uncovered by the encapsulation layer. The metallic element is patterned to form first conductive elements beneath the wire bonds and insulated from one another by portions of the encapsulation layer.

摘要翻译： 制造微电子单元的方法包括在包括可图案化的金属元件的结构的导电接合表面的形式的第一表面上形成多个引线接合。 线接合形成有连接到第一表面和远离第一表面的端表面的基底。 线接合具有在基部和端面之间延伸的边缘表面。 该方法还包括在导电层的第一表面的一部分上方并且在引线接合部分之上形成电介质封装层，使得引线接合的未封装部分由端面或边缘表面的未被 封装层。 金属元件被图案化以在引线键合下形成第一导电元件，并且通过封装层的一部分彼此绝缘。

公开(公告)号：EP0566901B1

公开(公告)日：1999-05-19

申请号：EP93105142.9

申请日：1993-03-29

申请人： International Business Machines Corporation

发明人： Brady, Michael John ,  Farrell, Curtis Edward ,  Kang, Sung Kwon ,  Marino, Jeffrey Robert

IPC分类号： H01L23/485

CPC分类号： H01L23/53271 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/6835 ,  H01L21/76838 ,  H01L23/4951 ,  H01L23/4985 ,  H01L23/49872 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/02126 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/1145 ,  H01L2224/13022 ,  H01L2224/13101 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/2919 ,  H01L2224/3015 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48609 ,  H01L2224/48611 ,  H01L2224/48616 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48709 ,  H01L2224/48711 ,  H01L2224/48716 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48809 ,  H01L2224/48811 ,  H01L2224/48816 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/73215 ,  H01L2224/85001 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3011 ,  Y10S428/901 ,  Y10T428/24917 ,  H01L2924/01048 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48824 ,  H01L2224/05552 ,  H01L2224/05599

公开(公告)号：EP3029167A4

公开(公告)日：2017-08-09

申请号：EP15819755

申请日：2015-05-20

申请人： NIPPON STEEL & SUMIKIN MAT CO ,  NIPPON MICROMETAL CORP

发明人： OYAMADA TETSUYA ,  UNO TOMOHIRO ,  DEAI HIROYUKI ,  ODA DAIZO

IPC分类号： H01L23/49 ,  C22C5/06 ,  C22F1/00 ,  C22F1/14

CPC分类号： H01L24/45 ,  C22C5/10 ,  H01L24/05 ,  H01L24/43 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45101 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45117 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48479 ,  H01L2224/48507 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85439 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/01001 ,  H01L2924/01007 ,  H01L2924/01049 ,  H01L2924/01031 ,  H01L2924/01048 ,  H01L2924/01028 ,  H01L2924/01005 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01004 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01203 ,  H01L2924/01044 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2224/48471 ,  H01L2924/00015 ,  H01L2924/01008 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01033 ,  H01L2224/4554

摘要： The present invention provides a bonding wire which can satisfy bonding reliability, spring performance, and chip damage performance required in high-density packaging. A bonding wire contains one or more of In, Ga, and Cd for a total of 0.05 to 5 at%, and a balance being made up of Ag and incidental impurities.

摘要翻译： 本发明提供一种能够满足高密度封装所需的接合可靠性，弹簧性能和芯片损伤性能的接合线。 接合线包含总计0.05-5原子％的In，Ga和Cd中的一种或多种，​​余量由Ag和不可避免的杂质组成。

公开(公告)号：EP2705533A1

公开(公告)日：2014-03-12

申请号：EP12712792.6

申请日：2012-03-12

申请人： Tessera, Inc.

发明人： SATO, Hiroaki ,  KANG, Teck-Gyu ,  HABA, Belgacem ,  OSBORN, Philip, R. ,  WANG, Wei-Shun ,  CHAU, Ellis ,  MOHAMMED, Ilyas ,  MASUDA, Norihito ,  SAKUMA, Kazuo ,  HASHIMOTO, Kiyoaki ,  INETARO, Kurosawa ,  KIKUCHI, Tomoyuki

IPC分类号： H01L25/10 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L25/043 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1713 ,  H01L2224/17179 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48464 ,  H01L2224/49105 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

摘要翻译： 制造微电子封装的方法包括在具有第一表面和远离其的第二表面的衬底的工艺单元上形成电介质封装层。 微电子元件安装到基板的第一表面，以及多个导电元件，其在第一表面处露出，其中至少一些电连接到微电子元件。 线接合具有接合到远离基座的导电元件和端表面的基部，并且限定在基部和端面之间延伸的边缘表面。 封装层形成为至少部分地覆盖第一表面，并且引线接合的部分与引线键合的未封装部分由端盖表面或边缘表面的未被覆盖的部分中的至少一个限定。

公开(公告)号：EP0875934A2

公开(公告)日：1998-11-04

申请号：EP98303365.5

申请日：1998-04-30

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Saran, Mukil ,  Martin, Charles A.

IPC分类号： H01L23/48 ,  H01L23/498

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/451 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H05K1/0271 ,  H05K1/111 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T428/24529 ,  Y10T428/24545 ,  Y10T428/24917 ,  H01L2224/48824 ,  H01L2924/00

摘要： The reinforcing system (10, 70, 90) for a bond pad (12, 72, 92) includes at least one dielectric layer or stack (20, 21, 22, 76, 78, 96, 98) disposed under the bond pad (12, 72, 92) . A reinforcing patterned structure (30, 80, 82, 100, 102) is disposed in the dielectric layer or stack (20, 21, 22, 76, 78, 96, 98).