Abstract:
A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).
Abstract:
Flexible transparent conductive films, flexible OPV devices, and semitransparent flexible OPV devices, and methods for the fabrication of flexible transparent conductive films, and the use of those films in fabricating flexible OPV devices, and semitransparent flexible OPV devices are presented. High-throughput and low-cost fabrication options also allow for economical production.
Abstract:
The invention is directed generally to improvements in irrigation and fertilization assessment and delivery. More specifically, embodiments of the invention provide an improved fluid delivery tube, method to manufacture such tube, and systems that include such tube. The delivery tube is beneficial at least because it minimizes the life cycle cost of a plant-responsive delivery tube.
Abstract:
A general method for the fabrication of three-dimensional objects of arbitrary shapes coated in organic optoelectronic devices, including semitransparent objects and optoelectronic devices, is described. In particular, a method for fabricating curved objects coated in organic photovoltaic, and especially semitransparent photovoltaic, devices is presented. High-throughput and low-cost fabrication options also allow for economical production.
Abstract:
A process for gluing laminated products with a curing amino adhesive, such as melamine urea formaldehyde (MUF) adhesive or urea formaldehyde (UF) adhesive, wherein a hardener comprising acid, acid salt and/or acid generating salt and a polymer dispersion or a mixture of different polymer dispersions and conventional additives, and the adhesive are applied separately at the parts to be glued, that the parts thereafter are joined and that the glue thereafter is cured under pressure, is described. Additionally, a use of a polymer dispersion or a mixture of different polymer dispersions in a hardener for use in a method for separate application of adhesive and hardener is disclosed.
Abstract:
A process for gluing laminated products with a curing amino adhesive, such as melamine urea formaldehyde (MUF) adhesive or urea formaldehyde (UF) adhesive, wherein a hardener comprising acid, acid salt and/or acid generating salt and a polymer dispersion or a mixture of different polymer dispersions and conventional additives, and the adhesive are applied separately at the parts to be glued, that the parts thereafter are joined and that the glue thereafter is cured under pressure, is described. Additionally, a use of a polymer dispersion or a mixture of different polymer dispersions in a hardener for use in a method for separate application of adhesive and hardener is disclosed.
Abstract:
A polymeric composition which has a dielectric constant K' greater than 4 at 20 °C which varies little with temperature is made from a polymer or mixture of polymers and a ceramic or a mixture of ceramics, where the polymer or mixture of polymers has a dielectric constant K' in the range of about 1.5 to about 3.5 and a temperature coefficient of dielectric constant TCK' that is negative and is between 0 and about -300 ppm/°C; and the ceramic includes a first ceramic, which may be one ceramic or a mixture of ceramics, each having a dielectric constant in the range of about 15 to about 200 and a TCK' that is positive and is between 0 and about 3000 ppm/°C; and an optional second ceramic, which may be one ceramic or a mixture of ceramics, each having a dielectric constant in the range from about 3 up to about 15 and a TCK' that is positive and is between 0 and about 300 ppm/°C.
Abstract:
L'invention concerne un revêtement en plastique comprenant un alliage polymère conçu pour des surfaces de sols et de murs, de préférence des surfaces de sols, ledit alliage polymère comprenant une matière de base se présentant sous la forme de PVC-plastique. Selon l'invention, au moins la partie du revêtement conçue pour être orientée vers l'extérieur dans un espace contient l'alliage polymère, comprenant un mélange de la matière de base ainsi que d'une matière d'alliage destinée à rendre la matière de base souple et comportant du polyuréthane thermoplastique. La proportion pondérale de matière de base dépasse celle de la matière d'alliage dans l'alliage polymère.
Abstract:
The present invention is a film capacitor comprising a dielectric film and a metal layer, the dielectric film being a resin film obtained by stretching an unstretched film produced using a crystalline hydrogenated dicyclopentadiene ring-opening polymer, and heating the resulting stretched film, and the resin film having a softening point of 250 to 320°C, a thermal shrinkage ratio of 0.01 to 5.0% when heated at 200°C for 10 minutes, a loss tangent (tan´) of 0.0001 to 0.0010, and a coefficient of static friction of 0.01 to 1.00. The present invention provides a film capacitor that includes a resin film as a dielectric film, the resin film exhibiting excellent heat resistance, excellent withstand voltage properties, and excellent workability.
Abstract:
Provided is a laminated glass including, in order: a first glass sheet; a first interlayer film; a transparent film laminated with a heat reflection film; a second interlayer film; and a second glass sheet, wherein the first interlayer film and the second interlayer film are formed of a modified hydrogenated block copolymer [E], the modified hydrogenated block copolymer [E] is a hydrogenated block copolymer [D] in which an alkoxysilyl group is incorporated, the hydrogenated block copolymer [D] being a block copolymer [C] in which 90% or more of all unsaturated bonds is hydrogenated, the block copolymer [C] is composed of at least two polymer blocks [A] including a repeat unit derived from an aromatic vinyl compound, and at least one polymer block [B] including a repeat unit derived from a linear conjugated diene compound, and the ratio of weight fraction [A] : [B] is 30:70 to 60:40.