摘要:
Provided is a photosensitive resin composition comprising: (A) a silicone resin having an epoxy group and/or a phenolic hydroxyl group; (B) a photoacid generator represented by formula (B); and (C) a benzotriazole compound.
摘要:
The present invention provides a positive type photosensitive siloxane composition in which a film formed by the same has high heat resistance, high strength and high crack resistance, an active matrix substrate in which by-product is not generated, an occurrence of defects is suppressed, and an interlayer insulating film is easily formed at a low cost while having good transmittance, a display apparatus including the active matrix substrate, and a method of manufacturing the active matrix substrate. An active matrix substrate 30 includes a plurality of gate wirings 11 provided so as to extend parallel to each other on an insulating substrate 10, and a plurality of source wirings 12 provided so as to extend parallel to each other in a direction intersecting the respective gate wirings 11. An interlayer insulating film 14 and a gate insulating film 15 are interposed at portions including the intersecting portions of the gate wirings 11 and the source wirings 12, on a lower side of the source wiring 12. The interlayer insulating film 14 is formed using the positive type photosensitive siloxane composition without using a resist.
摘要:
Negative-working imageable elements are prepared with radiation-sensitive imageable layers that contain surface-modified silica particles such as fumed silica particles and sol-gel silica particles, that are present in an amount of from about 1 to about 40 weight %, have an average particle size of from about 1 to about 500 nm, have surface hydroxy groups, and have a carbon content of from about 0.5 to about 15 weight % that is derived from surface hydrophobic groups having 1 to 30 carbon atoms. The presence of the surface-modified silica particles provides improved abrasion resistance, reduced tackiness, and various other desired properties.
摘要:
The invention is a composition comprising a curable arylcyclobutene based oligomer or polymer and a dissolution inhibitor which comprises a compound comprising at least two diazonaphthoquinone (DNQ) moieties each of which is pendant from different phenyl groups.
摘要:
The present invention relates to a process for the production of three-dimensional articles by stereolithography using a radiation-curable composition containing a mixture of at least one cationically polymerizable compound and/or at least one free radical polymerizable compound, at least one filler material, at least one photoinitiator for cationic and/or radical polymerizations and at least one antisedimentation agent. An organic viscosity stabilizer material soluble in the base resin may optionally be brought into contact with the composition. A filler material can be introduced in the composition in an effective amount sufficient to at least delay or prevent a significant viscosity increase. The present invention also relates to cured articles resulting from said processes and a process for preparing said compositions.
摘要:
The present invention provides a positive type resist composition which has excellent photosensitivity in light decomposition. The composition comprises;
(a) a polymer having at least 70 % of isotactic construction, prepared from polymerizable monomers, at least a portion of which is a (meth)acrylate monomer having a group selected from the class consisting of a t-butyl group, a benzyl group, an alpha-methylbenzyl group, an alpha, alpha-dimethylbenzyl group and a trityl group, and (b) a photoactivator which generates an acid in response to a light irradiation.
The present invention also provides a resist composition into which, instead of the polymer (a), a polymer (c) is formulated which has at least 70 % of isotactic construction and is prepared from polymerizable monomers, at least a portion of which is a hydroxyl styrene selected from the class consisting of p-t-butoxycarbonyloxystyrene, p-t-butoxycarbonyloxy-alpha-methyl-styrene, t-butyl-p-vinyl benzoate and t-butyl-p-isopropenylphenyloxy acetate.
摘要:
Provided is a photosensitive resin composition that contains: (A) a silicone resin containing an acid-crosslinkable group; (B) an epoxy compound represented by formula (B); and (C) a photoacid generator.
(In the formula, R51-R55 each independently represent a hydrogen atom or a saturated hydrocarbyl group having 1-6 carbon atoms.)
摘要:
Provided is a polymer that includes a silphenylene skeleton, an isocyanuric acid skeleton, and a hydroxy-group-substituted alkyl ether skeleton in the main chain, and that includes an epoxy group in a side chain.